The invention discloses a high-speed
copper-clad plate material based on an
epoxy resin
system and a preparation method thereof, and belongs to the technical field of
energy conservation and
environmental protection. In order to solve the problems that a traditional
copper-clad plate is high in
dielectric loss, poor in heat
conductivity and insufficient in
heat resistance, fluorinated
silicon dioxide nanoparticles (the
surface energy is smaller than or equal to 18 mN / m) are prepared through a
sol-
gel method, and a
boron nitride layer is modified through
trisodium citrate and aminopropyltriethoxysilane; mixing with
bisphenol A
epoxy resin, a
reactive diluent, a DOPO
flame retardant, dicyandiamide and 2-methylimidazole to obtain a
resin adhesive; adding nano filler and deionized water, mixing and defoaming at a high speed, presoaking 2116
glass fiber cloth to prepare a prepreg, laminating, matching with
copper foil, performing segmented
hot pressing, and performing secondary
tempering. Dk of the obtained material is 3.1-3.35, Df is smaller than or equal to 0.0055, Tg is larger than or equal to 165 DEG C, heat
conductivity is larger than or equal to 0.59 W / m.K, peel strength is larger than or equal to 1.78 N / mm, T288 is larger than or equal to 40 min, and the material is suitable for 5G high-speed PCBs and has low
energy consumption and environmental friendliness.