Preparation method for inverted LED white-light chip of chip scale package

Abstract

The invention discloses a preparation method for an inverted LED white-light chip of chip scale package, and the method comprises the following steps: temporarily fixing an UV solidifying adhesive tape (2-1) on the upper surface of a die bonding positioning light cover (1); setting flip chips (3) on the upper surface of the UV solidified adhesive tape (2-1) according to the position of the die bonding positioning light cover (1); employing a fluorescent glue film (4) to cover the flip chips (3); carrying out vacuumizing and heating, and enabling the fluorescent glue film (4) to be solidified and packaged on the flip chips (3); carrying out cutting along gaps among the all packaged flip chips (3); removing the die bonding positioning light cover (1); carrying out UV irradiation and enabling the UV solidified adhesive tape (2-1) to be solidified, and obtaining the inverted LED white-light chip (5) of chip scale package. The method simplifies the technological flow, avoids glue mixing and dispensing in the original technology, improves the production efficiency and yield, and greatly reduces the production cost. The method completely avoids the sinking of phosphor, enables the batch stability of the inverted LED white-light chips (5) to be high, and enabling the color temperature of the inverted LED white-light chips (5) to be consistent.

Description

Technical field [0001] The invention relates to a method for preparing flip-chip LED white light chips of chip-level packaging. Background technique [0002] Semiconductor lighting technology is one of the most promising high-tech fields in the 21st century, and Light Emitting Diode (hereinafter referred to as LED) is its core technology. LED is a kind of light-emitting element that can directly convert electrical energy into light energy. Because it has low working voltage, low power consumption, high luminous efficiency, extremely short luminous response time, pure light color, strong structure, impact resistance and vibration resistance , Stable and reliable performance, light weight, small size and low cost, etc., which have been widely used and developed by leaps and bounds. [0003] With the continuous improvement of power white LED manufacturing technology, its luminous efficiency, brightness and power have been greatly improved. In order to manufacture high-performance, h...

AI Technical Summary

Problems solved by technology

This encapsulation process has many disadvantages, for example, the encapsulation glue used has a high viscosity and is not easy to mix evenly; the mixed glue is not easy to degassing, resulting in air bubbles in the encapsulation glue, resulting in defective products in the encapsulation chip; the specific gravity of the phosphor is greater than Encapsulation glue, so the phosphor powder is prone to sedimentation in the encapsulation glue, resulting in large changes in the color temperature and color rendering index of the packaged LED, which requires that the packaged LED chips must be tested and screened before they can be used, so the current production line is long. , low efficiency, and poor batch stability; in addition, packaging manufacturers must complete a very tedious use process in a short period of time, and the use time of the mixed packaging glue is particularly short, generally only 8 hours

After the use time is exceeded, the viscosity of the mixed adhesive increases, and it is no longer suitable for dispensing, which causes waste of packaging adhesive

In addition, the current process route can only be manufactured by a single piece, and there are serious problems of long production line, high cost, low efficiency and poor batch stability

[0006] In short, the existing LED chip packaging process is prone to defective products, and the process route is long, the dispensing time is long, the yield is low, and the production efficiency is low, resulting in high production costs.

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