The invention discloses a preparation method for an inverted LED white-light
chip of
chip scale
package, and the method comprises the following steps: temporarily fixing an UV solidifying
adhesive tape (2-1) on the upper surface of a
die bonding positioning light cover (1); setting flip chips (3) on the upper surface of the UV solidified
adhesive tape (2-1) according to the position of the
die bonding positioning light cover (1); employing a fluorescent glue film (4) to cover the flip chips (3); carrying out vacuumizing and heating, and enabling the fluorescent glue film (4) to be solidified and packaged on the flip chips (3); carrying out
cutting along gaps among the all packaged flip chips (3); removing the
die bonding positioning light cover (1); carrying out UV
irradiation and enabling the UV solidified
adhesive tape (2-1) to be solidified, and obtaining the inverted LED white-light
chip (5) of
chip scale package. The method simplifies the technological flow, avoids glue mixing and dispensing in the original technology, improves the production efficiency and yield, and greatly reduces the production cost. The method completely avoids the sinking of
phosphor, enables the batch stability of the inverted LED white-light chips (5) to be high, and enabling the
color temperature of the inverted LED white-light chips (5) to be consistent.