The invention discloses a preparation method for an inverted LED white-light 
chip of 
chip scale 
package, and the method comprises the following steps: temporarily fixing an UV solidifying 
adhesive tape (2-1) on the upper surface of a 
die bonding positioning light cover (1); setting flip chips (3) on the upper surface of the UV solidified 
adhesive tape (2-1) according to the position of the 
die bonding positioning light cover (1); employing a fluorescent glue film (4) to cover the flip chips (3); carrying out vacuumizing and heating, and enabling the fluorescent glue film (4) to be solidified and packaged on the flip chips (3); carrying out 
cutting along gaps among the all packaged flip chips (3); removing the 
die bonding positioning light cover (1); carrying out UV 
irradiation and enabling the UV solidified 
adhesive tape (2-1) to be solidified, and obtaining the inverted LED white-light 
chip (5) of 
chip scale package. The method simplifies the technological flow, avoids glue mixing and dispensing in the original technology, improves the production efficiency and yield, and greatly reduces the production cost. The method completely avoids the sinking of 
phosphor, enables the batch stability of the inverted LED white-light chips (5) to be high, and enabling the 
color temperature of the inverted LED white-light chips (5) to be consistent.