Quick packaging method for COB-type LED chip

Abstract

The invention discloses a quick packaging method for a COB-type LED chip. The method includes steps of covering the COB-type LED chip 2 with a fluorescent coating; enabling the fluorescent coating to be adhered to the COB-type LED chip in a vacuum condition; and then heating to enable the fluorescent coating to be solidified and to package the COB-type LED chip in a ordinary pressure condition. In this way, the packaged COB-type LED chip 3 is obtained. According to the invention, technical process of a prior art is simplified; the production efficiency is improved; and the yield rate is improved and the production cost is reduced at the same time. The operation is simple and technical parameters are easy to control. Fluorescent powder settlement is avoided completely, so that COB-type LED chip packaging batch stability is high and the color temperature keeps consistent. The packaged COB-type LED chip obtained by using the method is good in high temperature and low temperature impact and is not easy to get aged during long term use due to firm bonding of the substrate and the package coating. The refraction coefficient is 1.40 to 1.43 and the hardness and the flexibility are moderate.

Description

technical field [0001] The invention relates to a rapid packaging method for a COB type LED chip. Background technique [0002] Semiconductor lighting technology is one of the most promising high-tech fields in the 21st century, and Light Emitting Diode (hereinafter referred to as LED) is its core technology. LED is a kind of light-emitting element that can directly convert electric energy into light energy. It has low working voltage, low power consumption, high luminous efficiency, extremely short luminous response time, pure light color, firm structure, impact resistance and vibration resistance. , stable and reliable performance, light weight, small size and low cost, and a series of characteristics, so it has been widely used and developed by leaps and bounds. [0003] With the continuous improvement of power white LED manufacturing technology, its luminous efficiency, brightness and power have been greatly improved. In order to manufacture high-performance, high-powe...

AI Technical Summary

Problems solved by technology

This encapsulation process has many disadvantages, for example, the encapsulation glue used has a high viscosity and is not easy to mix evenly; the mixed glue is not easy to degassing, resulting in air bubbles in the encapsulation glue, resulting in defective products in the encapsulation chip; the specific gravity of the phosphor is greater than Encapsulation glue, so the phosphor powder is prone to sedimentation in the encapsulation glue, resulting in large changes in the color temperature and color rendering index of the packaged LED, which requires that the packaged LED chips must be tested and screened before they can be used, so the current production line is long. , low efficiency, and poor batch stability; in addition, packaging manufacturers must complete a very tedious use process in a short period of time, and the use time of the mixed packaging glue is particularly short, generally only 8 hours

After the use time is exceeded, the viscosity of the mixed adhesive increases, and it is no longer suitable for dispensing, which causes waste of packaging adhesive

In addition, the current process route has serious problems of long production route, high cost, low efficiency and poor batch stability

[0006] In short, the existing COB-type LED chip packaging process is prone to defective products, and the process route is long, the dispensing time is long, the yield is low, and the production efficiency is low, resulting in high production costs.

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