Quick packaging method for COB-type LED chip

A technology of LED chips and packaging methods, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of high viscosity of packaging glue, waste of packaging glue, and difficulty in mixing evenly, and achieve moderate hardness and flexibility, and process parameters. Easy to control and avoid the effect of phosphor sedimentation

A technology of LED chips and packaging methods, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of high viscosity of packaging glue, waste of packaging glue, and difficulty in mixing evenly, and achieve moderate hardness and flexibility, and process parameters. Easy to control and avoid the effect of phosphor sedimentation

CN104882529AActive Publication Date: 2015-09-02TECORE SYNCHEM
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  • Quick packaging method for COB-type LED chip
  • Quick packaging method for COB-type LED chip
  • Quick packaging method for COB-type LED chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Preparation of tackifier (containing epoxy and isocyano-modified tackifier): under nitrogen protection, 1,3,5,7‐tetramethylcyclotetrasiloxane was heated to 40°C, and in 5 hours A solution consisting of 1,2‐epoxy‐4‐vinylcyclohexane, vinyltrimethoxysilane, isocyanoethyl methacrylate and 0.5wt% chloroplatinic acid in isopropanol was added dropwise. The mixed solution was reacted at 60°C for 3 hours to obtain a tackifier; the 1,3,5,7-tetramethylcyclotetrasiloxane, 1,2-epoxy-4-vinylcyclohexane, ethylene Trimethoxysilane and isocyanoethyl methacrylate are represented by a, b, c and d in turn, the molar ratio of a:b:c:d=1:1:1:1, and, b+ c+d=3; the added amount of the chloroplatinic acid is 50ppm of the total amount of a, b, c and d.

Embodiment 2

[0042] Preparation of tackifier (containing epoxy and isocyano-modified tackifier): under nitrogen protection, 1,3,5,7‐tetramethylcyclotetrasiloxane was heated to 60°C, and in 3 hours A solution consisting of 1,2-epoxy-4-vinylcyclohexane, vinyltrimethoxysilane, isocyanoethyl methacrylate and isopropanol solution with a concentration of 0.1wt% chloroplatinic acid was added dropwise. The mixed solution was reacted at 80°C for 2 hours to obtain a tackifier; the 1,3,5,7-tetramethylcyclotetrasiloxane, 1,2-epoxy-4-vinylcyclohexane, ethylene Trimethoxysilane and isocyanoethyl methacrylate are represented by a, b, c and d in turn, the molar ratio of a:b:c:d=1:0.5:0.5:1, and, b+ c+d=2; the added amount of the chloroplatinic acid is 10ppm of the total amount of a, b, c and d.

Embodiment 3

[0044] Preparation of tackifier (containing epoxy and isocyano-modified tackifier): under nitrogen protection, 1,3,5,7‐tetramethylcyclotetrasiloxane was heated to 50°C, and in 4 hours A solution consisting of 1,2‐epoxy‐4‐vinylcyclohexane, vinyltrimethoxysilane, isocyanoethyl methacrylate and 0.3wt% chloroplatinic acid in isopropanol was added dropwise. The mixed solution was reacted at 70°C for 2.5 hours to obtain a tackifier; the 1,3,5,7-tetramethylcyclotetrasiloxane, 1,2-epoxy-4-vinylcyclohexane, ethylene Trimethoxysilane and isocyanoethyl methacrylate are represented by a, b, c and d in turn, the molar ratio of a:b:c:d=1:3:0.5:0.5, and, b+ c+d=4; the added amount of chloroplatinic acid is 30ppm of the total amount of a, b, c and d.

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Abstract

The invention discloses a quick packaging method for a COB-type LED chip. The method includes steps of covering the COB-type LED chip 2 with a fluorescent coating; enabling the fluorescent coating to be adhered to the COB-type LED chip in a vacuum condition; and then heating to enable the fluorescent coating to be solidified and to package the COB-type LED chip in a ordinary pressure condition. In this way, the packaged COB-type LED chip 3 is obtained. According to the invention, technical process of a prior art is simplified; the production efficiency is improved; and the yield rate is improved and the production cost is reduced at the same time. The operation is simple and technical parameters are easy to control. Fluorescent powder settlement is avoided completely, so that COB-type LED chip packaging batch stability is high and the color temperature keeps consistent. The packaged COB-type LED chip obtained by using the method is good in high temperature and low temperature impact and is not easy to get aged during long term use due to firm bonding of the substrate and the package coating. The refraction coefficient is 1.40 to 1.43 and the hardness and the flexibility are moderate.

Description

technical field [0001] The invention relates to a rapid packaging method for a COB type LED chip. Background technique [0002] Semiconductor lighting technology is one of the most promising high-tech fields in the 21st century, and Light Emitting Diode (hereinafter referred to as LED) is its core technology. LED is a kind of light-emitting element that can directly convert electric energy into light energy. It has low working voltage, low power consumption, high luminous efficiency, extremely short luminous response time, pure light color, firm structure, impact resistance and vibration resistance. , stable and reliable performance, light weight, small size and low cost, and a series of characteristics, so it has been widely used and developed by leaps and bounds. [0003] With the continuous improvement of power white LED manufacturing technology, its luminous efficiency, brightness and power have been greatly improved. In order to manufacture high-performance, high-powe...

Claims

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Application Information

Patent Timeline
02 Sep 2015
Publication
CN104882529A
IPC
H01L33/56; H01L33/50
CPC
H01L33/504; H01L33/56; H01L2933/0041; H01L2933/005
Inventors
谭晓华; 韩颖