Adhesive fluorescent adhesive film for rapid packaging of light-emitting diodes, preparation method and application

A technology of light-emitting diodes and fluorescent adhesives, applied in the direction of adhesives, film/sheet adhesives, non-polymer adhesive additives, etc., can solve the problems of low production efficiency, long process route, long dispensing time, etc. Achieve the effect of improving production efficiency, simplifying process flow, and high batch stability

Active Publication Date: 2017-05-17
TECORE SYNCHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In short, the packaging process of existing LED white light chips and COB LED chips is prone to defective products, and the process route is long, the dispensing time is long, the yield is low, and the production efficiency is low, resulting in high production costs.

Method used

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  • Adhesive fluorescent adhesive film for rapid packaging of light-emitting diodes, preparation method and application
  • Adhesive fluorescent adhesive film for rapid packaging of light-emitting diodes, preparation method and application
  • Adhesive fluorescent adhesive film for rapid packaging of light-emitting diodes, preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Preparation of tackifier (containing epoxy and isocyano-modified tackifier): under nitrogen protection, 1,3,5,7‐tetramethylcyclotetrasiloxane was heated to 40°C, and in 5 hours A solution consisting of 1,2‐epoxy‐4‐vinylcyclohexane, vinyltrimethoxysilane, isocyanoethyl methacrylate and 0.5wt% chloroplatinic acid in isopropanol was added dropwise. The mixed solution was reacted at 60°C for 3 hours to obtain a tackifier; the 1,3,5,7-tetramethylcyclotetrasiloxane, 1,2-epoxy-4-vinylcyclohexane, ethylene Trimethoxysilane and isocyanoethyl methacrylate are represented by a, b, c and d in turn, the molar ratio of a:b:c:d=1:1:1:1, and, b+ c+d=3; the added amount of the chloroplatinic acid is 50ppm of the total amount of a, b, c and d.

Embodiment 2

[0054] Preparation of tackifier (containing epoxy and isocyano-modified tackifier): under nitrogen protection, 1,3,5,7‐tetramethylcyclotetrasiloxane was heated to 60°C, and in 3 hours A solution consisting of 1,2-epoxy-4-vinylcyclohexane, vinyltrimethoxysilane, isocyanoethyl methacrylate and isopropanol solution with a concentration of 0.1wt% chloroplatinic acid was added dropwise. The mixed solution was reacted at 80°C for 2 hours to obtain a tackifier; the 1,3,5,7-tetramethylcyclotetrasiloxane, 1,2-epoxy-4-vinylcyclohexane, ethylene Trimethoxysilane and isocyanoethyl methacrylate are represented by a, b, c and d in turn, the molar ratio of a:b:c:d=1:0.5:0.5:1, and, b+ c+d=2; the added amount of the chloroplatinic acid is 10ppm of the total amount of a, b, c and d.

Embodiment 3

[0056] Preparation of tackifier (containing epoxy and isocyano-modified tackifier): under nitrogen protection, 1,3,5,7‐tetramethylcyclotetrasiloxane was heated to 50°C, and in 4 hours A solution consisting of 1,2‐epoxy‐4‐vinylcyclohexane, vinyltrimethoxysilane, isocyanoethyl methacrylate and 0.3wt% chloroplatinic acid in isopropanol was added dropwise. The mixed solution was reacted at 70°C for 2.5 hours to obtain a tackifier; the 1,3,5,7-tetramethylcyclotetrasiloxane, 1,2-epoxy-4-vinylcyclohexane, ethylene Trimethoxysilane and isocyanoethyl methacrylate are represented by a, b, c and d in turn, the molar ratio of a:b:c:d=1:3:0.5:0.5, and, b+ c+d=4; the added amount of chloroplatinic acid is 30ppm of the total amount of a, b, c and d.

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Abstract

The invention discloses a viscous fluorescent film for fast package of light emitting diode and a preparation method and application thereof. The preparation method is as below: (1) weighing and mixing vinyl silicone rubber, fumed silica, vinyl silicone oil, methyl vinyl MQ silicone resin, hydroxyl silicone oil and LED phosphor to obtain a mixture 1; (2) weighing an inhibitor, a tackifier, a Karstedt catalyst and methyl silicone oil; (3) adding the components in the step (2) into the mixture 1, evenly mixing by a kneader, a two-roll mill or a mixer to obtain a mixture 2, extruding the mixture 2 on a release film, covering another from the release film and calendaring. The viscous fluorescent glue film for fast package of light-emitting diode of the invention can be used in chip scale package of inversion LED white light and package of COB type LED chip. The method simplifies process, avoids the steps of first dam enclosure, then mixing and dispensing glue, improves productivity, increases yield and significantly reduces production cost.

Description

technical field [0001] The invention relates to a fast-encapsulating viscous fluorescent adhesive film for light-emitting diodes, a preparation method and application thereof. Background technique [0002] Semiconductor lighting technology is one of the most promising high-tech fields in the 21st century, and Light Emitting Diode (hereinafter referred to as LED) is its core technology. LED is a kind of light-emitting element that can directly convert electric energy into light energy. It has low working voltage, low power consumption, high luminous efficiency, extremely short luminous response time, pure light color, firm structure, impact resistance and vibration resistance. , stable and reliable performance, light weight, small size and low cost, and a series of characteristics, so it has been widely used and developed by leaps and bounds. [0003] With the continuous improvement of power white LED manufacturing technology, its luminous efficiency, brightness and power ha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/00C09J183/07C09J11/04C09J11/06H01L33/56
Inventor 谭晓华韩颖冯亚凯
Owner TECORE SYNCHEM
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