Data processing method and device for applying fluorescent powder to LED (light-emitting diode) and manufacturing method of device

A data processing device and data processing technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., to achieve the effects of convenient product controllability, high quality, and improved utilization efficiency

Active Publication Date: 2011-08-24
LATTICE POWER (JIANGXI) CORP
View PDF4 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The first technical problem to be solved by the present invention is to provide a data processing method for applying phosphor powder to LEDs, which is used to solve the problem of accurately applying phosphor powder to each chip, so that the quality of the product remains consistent
[0005] The second technical problem to be solved by the present invention is to provide a data processing device for applying phosphor powder to LEDs, which is used to solve the problem of accurately applying phosphor powder to each chip, so that the quality of the product remains consistent
[0006] The third technical problem to be solved by the present invention is to provide a manufacturing method for applying phosphor powder to LEDs, which is used to solve the problem of accurately applying phosphor powder to each chip, so that the quality of the product remains consistent

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Data processing method and device for applying fluorescent powder to LED (light-emitting diode) and manufacturing method of device
  • Data processing method and device for applying fluorescent powder to LED (light-emitting diode) and manufacturing method of device
  • Data processing method and device for applying fluorescent powder to LED (light-emitting diode) and manufacturing method of device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] The present invention proposes a data processing method for applying fluorescent powder to LED, see figure 2 As shown, the optical characteristic parameters of the chip need to be collected before data processing. The optical characteristic parameters are mainly the main wavelength and optical power of the point measurement output, and can also include other optical characteristic parameters, such as forward voltage, reverse breakdown voltage and lifetime. parameters etc. Then process the collected optical characteristic parameters of the chip to generate a chip data file. The chip data file can be converted into a data file directly executed by the phosphor powder application device, or a data file for further processing.

[0041]The generated chip data file is combined with the preset standard data for data processing to generate a phosphor distribution data file. The preset standard data is mainly that the chipset as a whole should have effect characteristics such ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a data processing method and device for applying fluorescent powder to an LED (light-emitting diode) and a manufacturing method of the device, which are used for solving the problem of precisely applying the fluorescent powder against each chip and keeping the consistency in product quality. The technical scheme in the invention is as follows: the data processing method comprises the following steps: generating a chip data file: processing parameters of optical characteristics of each chip in a collected chip group, and generating the data file for being implemented by a system or being further processed; and generating a fluorescent powder distribution data file: performing data processing on the data file, and generating the fluorescent powder distribution data file against the amount of the fluorescent powder required for each chip according to data in the data file. A chip product applying the technology in the invention has the characteristics of being good in consistency, more humanized, more stable and more convenient to process.

Description

technical field [0001] The invention relates to a manufacturing method of a light-emitting diode, in particular to a production process of applying fluorescent powder to the light-emitting diode during the production process of the light-emitting diode. Background technique [0002] At present, in the field of semiconductor lighting, the method of realizing white light is to use the blue light emitted by InGaAlN LED to excite the YAG phosphor, and the yellow light emitted by the phosphor is synthesized with the original remaining blue light to form white light. The color coordinates of the white light of this technical solution depend on the thickness of the powder (determining how much blue light remains) and the excitation wavelength. Since epitaxy is difficult to control the uniformity of the wavelength in the chip and the consistency between the chips, and now it is common to mix the phosphor powder and the packaging material (such as silica gel), and the phosphor powder...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/00
Inventor 方文卿
Owner LATTICE POWER (JIANGXI) CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap