A kind of white light LED chip manufacturing method and product thereof

A technology of LED chips and manufacturing methods, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of inconsistent color temperature, uneven coating surface, uneven color of white light, etc., to achieve the effect of consistent color temperature

Inactive Publication Date: 2016-09-21
SUZHOU NANOJOIN PHOTONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, this technical method is prone to uneven coating thickness, resulting in inconsistent color temperature; uneven coating surface, resulting in uneven color of white light formed when the light is emitted, and uneven yellowish or bluish spots appear locally.

Method used

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  • A kind of white light LED chip manufacturing method and product thereof
  • A kind of white light LED chip manufacturing method and product thereof
  • A kind of white light LED chip manufacturing method and product thereof

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Embodiment Construction

[0027] The invention discloses a method for manufacturing a white light LED chip, the whole process is combined as Figure 1-Figure 4 shown, including the following steps:

[0028] Step 1. Growing a complete LED epitaxial structure on the substrate: using organic chemical vapor deposition method to epitaxially grow the N-type electrode contact layer, the light-emitting active region, and the P-type electrode contact layer in sequence on the sapphire substrate;

[0029] Step 2, making the N-type electrode area: using photoresist or dielectric film as a mask, etching the designed N-type contact area and segmented area to the N-type contact electrode area on the P-GaN by ion etching;

[0030] Step 3, making a transparent conductive layer: making a transparent conductive layer on the surface of P-GaN by photolithography and vapor deposition, and annealing at 400°C-600°C for 10-30 minutes;

[0031] Step 4, making electrodes: use photoresist as a mask, vapor-deposit multi-layer met...

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Abstract

The invention discloses a white LED (light emitting diode) chip and a manufacturing method thereof. The white LED chip is manufactured by manufacturing an inner box dam around a chip welding pad, reserving a welding disc, manufacturing an outer box dam at a chip outer frame, reserving a scribing groove, and then coating fluorescent powder between the inner box dam and the outer box dam. With the adoption of the method, a smooth and uniform fluorescent powder coating can be obtained on the surface of the chip, and fluorescent powder chip-level encapsulation can be realized truly. The white chip obtained by the method is consistent in color temperature, and is free from nonuniform light spots of local blue rings or yellow rings.

Description

technical field [0001] The invention relates to a method for manufacturing a white light LED chip and its products, in particular to a method for directly coating phosphor powder on the chip surface to obtain white light, and belongs to the technical field of semiconductor lighting. Background technique [0002] As a new type of green light source product, LED (Light Emitting Diode) has the advantages of high efficiency, high brightness, small size, long service life, low power consumption, and no harmful substances such as Hg. It is expected to replace traditional incandescent lamps, fluorescent lamps, Halogen lamps and traditional backlights have become widely used high-quality light sources. [0003] The main means for the industry to obtain white LEDs is to excite phosphors with monochromatic light to form mixed white light. [0004] In the prior art, monochromatic LED chips are generally provided by chip manufacturing companies in the middle of the industry, and downst...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/38H01L33/50
Inventor 王怀兵吴思王辉孔俊杰王勇徐金雄
Owner SUZHOU NANOJOIN PHOTONICS
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