High-temperature-resisting transparent thick-film photoresist and application thereof in preparing LED phosphor layer

A phosphor layer and high-temperature-resistant technology, which is applied in the field of optoelectronics, can solve problems such as poor spatial consistency of LED light source color coordinates, difficulty in obtaining high-temperature-resistant transparent thick-film photoresist, and unsatisfactory high-temperature resistance, so as to avoid blue spots Or the effect of macula, consistent color temperature and uniform thickness

Inactive Publication Date: 2012-07-25
胡国兵
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the continuous penetration of LED lamps into the general lighting market, market demand requires continuous improvement of LED phosphor coating technology, and continuous improvement of the problem of poor spatial consistency of LED light source color coordinates
The existing photoresist, due to the formula, process and other reasons, the high temperature resistance is not ideal, it is difficult to obtain a transparent thick film photoresist with good high temperature resistance

Method used

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  • High-temperature-resisting transparent thick-film photoresist and application thereof in preparing LED phosphor layer
  • High-temperature-resisting transparent thick-film photoresist and application thereof in preparing LED phosphor layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] 1) Preparation of high-temperature-resistant transparent thick-film photoresist: mix the following components by weight percentage to prepare high-temperature-resistant transparent thick-film photoresist:

[0035] Resin 50%

[0036] Sensitizer 15%

[0037] Solvent 35%;

[0038] The resin is a mixture of acrylic resin and its monomers and methacrylic resin and its monomers, and the acrylic resin and its monomers account for 5% to 95% of the total weight of the resin (eg 5%, 50%, 95%), The balance is methacrylic resin and its monomers; the acrylic resin and its monomers account for 20%; the methacrylic resin and its monomers account for 20%.

[0039] The solvent is n-butanol (or one or more of propylene glycol monomethyl ether acetate, cyclohexanone, and hexyl lactate);

[0040] The photosensitizer is azobisisobutyronitrile, a quinone azido compound.

[0041] 2) Pre-coat a layer of adhesion promoter: HMDS (or KH-560 or KH-570 or KH-550) on the surface of the chip to s...

Embodiment 2

[0047] Preparation of high temperature resistant transparent thick film photoresist: mix the following components by weight percentage to prepare high temperature resistant transparent thick film photoresist:

[0048] Resin 40%

[0049] Sensitizer 10%

[0050] Solvent 50%;

[0051] The resin is a mixture of acrylic resin and its monomers and methacrylic resin and its monomers, and the acrylic resin and its monomers account for 5% to 95% of the total weight of the resin (eg 5%, 50%, 95%), The balance is methacrylic resin and its monomers; the acrylic resin and its monomers account for 50%; the methacrylic resin and its monomers account for 50%.

[0052] All the other are with embodiment 1.

Embodiment 3

[0054] Preparation of high temperature resistant transparent thick film photoresist: mix the following components by weight percentage to prepare high temperature resistant transparent thick film photoresist:

[0055] Resin 45%

[0056] Sensitizer 12%

[0057] Solvent 43%;

[0058] The resin is a mixture of acrylic resin and its monomers and methacrylic resin and its monomers, and the acrylic resin and its monomers account for 5% to 95% of the total weight of the resin (eg 5%, 50%, 95%), The balance is methacrylic resin and its monomers; the acrylic resin and its monomers account for 30%; the methacrylic resin and its monomers account for 30%.

[0059] All the other are with embodiment 1.

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Abstract

The invention discloses a high-temperature-resisting transparent thick-film photoresist and an application thereof in preparing an LED phosphor layer. The photoresist is composed of resin, a photosensitizer, and a solvent. The resin is composed of acrylic resin and a mixture of a monomer of acrylic resin and a monomer of methacrylic resin. With the photoresist provided by the invention, a defect that a phosphor mixed liquid forms a spherical crown shape due to the influence of a support cup is overcome, and the obtained phosphor coating is uniform in thickness. With the method, the light spots of an obtained LED lamp are uniform and saturated; the color temperatures of different LED lamps are constant, and blue spots or yellow spots are prevented from occurring in light spots emitted during LED lamp illumination.

Description

technical field [0001] The invention relates to the field of optoelectronic technology, in particular to a high-temperature-resistant transparent thick-film photoresist and its application in preparing LED phosphor layers Background technique [0002] In the LED industry, LED lamps produced by traditional dispensing methods have defects in the uniform saturation performance of the light spot and the consistency of color temperature. With the continuous penetration of LED lamps into the general lighting market, market demand requires continuous improvement of LED phosphor coating technology, and continuous improvement of the problem of poor spatial consistency of LED light source color coordinates. The existing photoresist has unsatisfactory high temperature resistance due to the formula, process and other reasons, and it is difficult to obtain a transparent thick film photoresist with good high temperature resistance. Contents of the invention [0003] The object of the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027H01L33/50
Inventor 胡国兵
Owner 胡国兵
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