3results about How to "Realize integrated manufacturing" patented technology

This invention discloses a 3D printing method and apparatus for the integrated molding of heterogeneous multi-component components, specifically relating to the fields of advanced manufacturing and intelligent microsystems technology. This invention overcomes the limitations of traditional multi-material 3D printing, which can only integrate electronic components and cannot embed drivers. It employs a dual-mode embedding method combining vacuum adsorption and pneumatic gripping, achieving integrated manufacturing of micro-drivers, electronic components, high-precision conductive lines, and structural substrates. By preparing wires through mask scraping, it solves the problems of low precision and difficulty in adapting to micro-circuits in direct writing, improving interconnect reliability and miniaturization level. The direct embedding of mature drivers avoids the polarization process and performance degradation issues required for direct printing of piezoelectric materials, ensuring stable and reliable driving performance. Through in-situ wire fabrication and a closed-loop printing process, it eliminates the risk of post-assembly errors and interconnect failures.

The application relates to the field of 3D printing technology and discloses a functional gradient material light-curing 3D printing device which comprises a processing platform, a material conveying device, a printing device, a laser positioner, a material layering device, a positive pressure air path device and a controller. First, the functional gradient material is laid by the material layering device, is conveyed to the lower side of the printing platform by the material conveying device, is pre-light-cured, and then is recycled to print the next layer, and is solidified, so that the material transition problem in the printing process of multiple photosensitive materials can be solved, and the precise, integrated and efficient manufacturing of the functional gradient material structure can be realized.

The present invention discloses a hierarchically porous CO2 adsorption material and a preparation method thereof. The hierarchically porous CO2 adsorption material is prepared by photocuring 3D printing a photosensitive resin made of a photopolymerizable ionic liquid monomer, an amino-containing comonomer, a multi-functional crosslinking agent, a non-reactive pore-forming agent, etc., and then removing the pore-forming agent by supercritical drying. The present invention realizes the molecular-level uniform distribution of amino active sites, avoids the defects of traditional post-modification processes, and successfully constructs a multi-level pore structure conducive to gas mass transfer by combining polymerization-induced phase separation and supercritical drying. The prepared material has excellent CO2 adsorption performance and cycle stability, with an adsorption capacity of 4.5 mmol / g at 25 °C and 0.1 MPa, and a performance retention rate > 95% after 5 cycles.