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Three-dimensional molding based microwave absorbing body preparing method and corresponding microwave absorbing body

A three-dimensional molding and system technology, which is used in processing and manufacturing, devices that apply liquid to surfaces, electrical components, etc., can solve the problems of single powder addition ratio for molding, limited to flat materials, and difficulty in ensuring accuracy, and achieve molding. The effect of high efficiency, low preparation cost and good designability

Active Publication Date: 2018-06-01
SHANGHAI RADIO EQUIP RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The document "Zhou Ding, Huang Xiaozhong et al. Preparation of structural absorbing materials by 3D printing technology and their performance research. China Science and Technology Papers Online. 2014" reported a printed absorbing plate, each tiny cone on the plate contains 100,000 physical units, which materials are used in each unit, and how these materials are combined are all constructed through the design of microstructures. However, the absorbing materials proposed in this document are limited to flat materials.
[0005] In summary, reports on the preparation of microwave-absorbing materials based on three-dimensional molding mainly focus on three-dimensional molding technology, internal absorbent preparation, interlayer absorbent addition ratio, etc., and the design and manufacturing process is heavily dependent on the powder used for molding. , the addition ratio of molding powder is single, it is difficult to control, and it is difficult to ensure the accuracy. There is still a lot of room for improvement in design principles and manufacturing methods

Method used

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  • Three-dimensional molding based microwave absorbing body preparing method and corresponding microwave absorbing body
  • Three-dimensional molding based microwave absorbing body preparing method and corresponding microwave absorbing body
  • Three-dimensional molding based microwave absorbing body preparing method and corresponding microwave absorbing body

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Embodiment Construction

[0039] The present invention will be further elaborated below by describing a preferred specific embodiment in detail in conjunction with the accompanying drawings.

[0040] like figure 1 As shown, the present invention provides a method for preparing a wave absorber based on three-dimensional molding, which comprises the following steps:

[0041] S1. Manufacture a three-dimensionally formed wave-absorbing material template 1;

[0042] S2. Spraying slurry on the surface of the wave-absorbing material template to form the first coating 2;

[0043] S3. Spraying slurry on the inner surface of the wave-absorbing material template to form the second coating 3 .

[0044] Different from the spraying and molding mechanism of other conventional wave-absorbing materials, the forming method is a combination of spraying and three-dimensional forming to prepare gradient wave-absorbing materials, which can meet the expected requirements of electromagnetic characteristics and realize the w...

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Abstract

The invention discloses a three-dimensional molding based microwave absorbing body preparing method. The three-dimensional molding based microwave absorbing body preparing method comprises the following steps that S1, a three-dimensional molding microwave absorbing material mold plate is manufactured; S2, the surface of the microwave absorbing material mold plate is sprayed with slurry to form a first coating; and S3, the inner face of the microwave absorbing material mold plate is sprayed with slurry to form a second coating. The three-dimensional molding based microwave absorbing body preparing method has the beneficial effect that the excellent electromagnetic wave absorbing or shielding effect can be achieved, and meanwhile, the three-dimensional molding based microwave absorbing bodypreparing method has the beneficial effects of being small in thickness, resistant to oxidation, small in mass, low in cost and the like.

Description

technical field [0001] The invention relates to the technical field of design and molding manufacturing of high-performance lightweight electromagnetic materials, in particular to a method for preparing a wave absorbing body based on three-dimensional molding and a corresponding wave absorbing body. Background technique [0002] Absorbing materials are widely used in electromagnetic protection and electromagnetic interference. When electromagnetic waves pass through internal absorbing particles, microwave energy is lost through resistive loss, dielectric loss or magnetic loss. Compared with the previous electromagnetic shielding materials, the absorbing material not only reduces the reflected power of the material surface, but also reduces the transmitted power of the material. In terms of structural form, absorbing materials include two types: structural type and coating type. Among them, the coating-type absorbing materials are mainly prepared by spraying, such as manual ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D5/00B05D1/02H01Q17/00B29C64/10B33Y10/00
CPCB05D1/02B05D5/00B33Y10/00H01Q17/00
Inventor 许勇刚袁黎明王晓冰梁子长
Owner SHANGHAI RADIO EQUIP RES INST
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