Electronic component package and manufacturing method thereof

Abstract

The invention discloses an electronic component package and a manufacturing method thereof, wherein, the electronic component package comprises a thermoelectric refrigeration unit and an active component, which are positioned in the package and are coupled together. The thermoelectric refrigeration unit comprises at least one N-type refrigeration element and at least one P-type refrigeration element which are connected in series. Correspondingly, the invention also provides the manufacturing method for two electronic component package structures. A single thermoelectric refrigeration unit or a plurality of the thermoelectric refrigeration units are embedded in a multilayered packaging baseplate in series, so that effective heat dissipation is provided to active component embedding technology. The electronic component package and the manufacturing method thereof can solve the problem of dimensional system packaging and especially the problem that the heat quantity cannot be brought out in the active component embedding packaging technology, and the heat dissipation performance can be improved.

Description

technical field [0001] The invention relates to the fields of two-dimensional or three-dimensional multi-chip system level packaging, manufacturing of packaging substrates, and semiconductor refrigeration, in particular to a packaging substrate structure and processing method for embedding thermoelectric cooling components. Background technique [0002] With the development of high-speed, high-density, and high-performance microelectronic chips, thermal management has become a very important issue in microsystem packaging. In high-performance computers, such as servers, mainframes and supercomputers, the heat dissipation of multi-chip components will directly affect the design performance and operational performance of the computer, and the failure of the system is often caused by hot spots (hotspots) caused by local heat concentration. ). Therefore, heat dissipation in microelectronic packages has always been one of the key issues in package design. In addition, with the ...

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Problems solved by technology

In "Thermoelectric 3d cooling" (public (published) number: CN101091246A), M. Farahani of Intel Corporation and others proposed a method of making a TEC structure on the surface of a chip to dissipate heat and a process for making a TEC. The disadvantage is that it needs to be assembled on the PCB or substrate, which will increase the space of the entire package

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