Electronic component package and manufacturing method thereof

A technology for electronic components and packaging bodies, which is applied in the field of packaging substrate structure and processing of embedded thermoelectric refrigeration components, can solve problems such as increasing the space of the packaging body, and achieve the effects of high productivity, controllable cooling efficiency, and flexible embedding positions

Active Publication Date: 2012-11-28
NAT CENT FOR ADVANCED PACKAGING
View PDF8 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In "Thermoelectric 3d cooling" (public (published) number: CN101091246A), M. Farahani of Intel Corporation and others proposed a method of making a TEC structure on the surface of a

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic component package and manufacturing method thereof
  • Electronic component package and manufacturing method thereof
  • Electronic component package and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0032] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings, in which the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary, and are only used to explain the present invention, and cannot be construed as limiting the present invention. The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are only examples, and are not intended to limit the invention. In addition, the present invention may repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an electronic component package and a manufacturing method thereof, wherein, the electronic component package comprises a thermoelectric refrigeration unit and an active component, which are positioned in the package and are coupled together. The thermoelectric refrigeration unit comprises at least one N-type refrigeration element and at least one P-type refrigeration element which are connected in series. Correspondingly, the invention also provides the manufacturing method for two electronic component package structures. A single thermoelectric refrigeration unit or a plurality of the thermoelectric refrigeration units are embedded in a multilayered packaging baseplate in series, so that effective heat dissipation is provided to active component embedding technology. The electronic component package and the manufacturing method thereof can solve the problem of dimensional system packaging and especially the problem that the heat quantity cannot be brought out in the active component embedding packaging technology, and the heat dissipation performance can be improved.

Description

technical field [0001] The invention relates to the fields of two-dimensional or three-dimensional multi-chip system level packaging, manufacturing of packaging substrates, and semiconductor refrigeration, in particular to a packaging substrate structure and processing method for embedding thermoelectric cooling components. Background technique [0002] With the development of high-speed, high-density, and high-performance microelectronic chips, thermal management has become a very important issue in microsystem packaging. In high-performance computers, such as servers, mainframes and supercomputers, the heat dissipation of multi-chip components will directly affect the design performance and operational performance of the computer, and the failure of the system is often caused by hot spots (hotspots) caused by local heat concentration. ). Therefore, heat dissipation in microelectronic packages has always been one of the key issues in package design. In addition, with the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L23/38H01L21/48
CPCH01L21/568H01L2224/04105H01L2224/16225H01L2224/19H01L2224/2518H01L2224/32225H01L2224/73204H01L2224/73253H01L2224/73259H01L2224/73267H01L2224/92224
Inventor 张静宋崇申张霞
Owner NAT CENT FOR ADVANCED PACKAGING
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap