Adapter plate structure and manufacturing method thereof

Abstract

The invention discloses an adapter plate structure. The adapter plate structure comprises a substrate, electricity inter-communication holes and a thermoelectric cooling unit, wherein the electricity inter-communication hole penetrates through the substrate; the thermoelectric cooling unit comprises at least one N-type thermoelectric element and at least one P-type thermoelectric element which are alternately serially connected; the N-type thermoelectric element and the P-type thermoelectric element are electricity inter-communication holes which are made of N-type thermoelectric materials and P-type thermoelectric materials; and the electricity inter-communication holes are serially connected by imaging conductive material layers, on the opposite first surface and second surface, of the substrate and are also can be made of the N-type thermoelectric materials or the P-type thermoelectric materials. Correspondingly, the invention also provides a method for manufacturing the adapter plate structure. The adapter plate structure and method can be used for realizing electric inter-connection and thermoelectric cooling of the through holes, and are short in an inter-connection distance, small in size, high in integration degree and simple in process; the heat radiation efficiency can be controlled; and the problems of interconnection and heat radiation of a three-dimensional multi-chip stacking structure and concentrated local heat energy of a packaging body can be solved.

Description

technical field [0001] The invention relates to the technical fields of semiconductor manufacturing, microelectronic packaging and three-dimensional integration, in particular to an adapter plate structure including a thermoelectric refrigeration component and its realization method, in particular to an adapter plate structure capable of realizing through-hole interconnection and controllable heat dissipation at the same time. Board connection structure and its realization method. Background technique [0002] With the development of high-speed, high-density, and high-performance microelectronic chips, thermal management has become a very important issue in microsystem packaging. In high-performance computers, such as servers, mainframes and supercomputers, the heat dissipation of multi-chip components will directly affect the design performance and operating performance of the computer, and the failure of the system is often caused by hot spots caused by local heat concentr...

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Problems solved by technology

In "Thermoelectric 3d cooling" (published (published) number: CN 101091246A), M. Farahani of Intel Corporation and others proposed a method of making a TEC structure heat dissipation on the chip surface through a thin film process and a process for making a TEC. The disadvantage of the method is that it needs to be assembled on the PCB or substrate, which will increase the space of the entire package

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