The invention belongs to the technical field of back contact cells, and particularly relates to a joint
passivation back contact
cell and a post-texturing preparation method thereof, and the method comprises the steps: S102, sequentially forming a first
semiconductor layer and a
mask layer on the back surface of a
silicon substrate; s103, cleaning and texturing are carried out, so that a texturing surface is formed on the light receiving surface of the
silicon substrate, and the maximum height of a
pyramid of the texturing surface of the light receiving surface is T1; s104, sequentially forming a
passivation layer and an anti-reflection layer on the light receiving surface of the
silicon substrate; s105, forming a second
semiconductor opening region; s106, cleaning and
etching are carried out, and a groove structure is at least formed in the second
semiconductor opening region on the back surface of the silicon substrate; and S107, depositing a second semiconductor layer on the back surface, wherein the second semiconductor layer comprises an amorphous
passivation layer and a second doped silicon layer. Under the conditions of simplifying the process steps and reducing the material cost, the interface
contact resistance of the second semiconductor opening region can be reduced, the minority
carrier lifetime is prolonged, and the
cell efficiency and the double-sided rate are improved.