628results about How to "Reduce environmental load" patented technology

A system for manufacturing an electronic device having a processing unit which includes a timer that processes a plurality of lots each having a plurality of work pieces and measuring in units of lots a processing time of the work pieces constituting the respective lots, an environmental information measurement module that measures environmental information corresponding to the processing time of the work pieces measured in units of lots, and a communication module for transmission and reception, and a work information management unit having a storage module which is provided to correspond to each lot, communicates with the communication module of the processing unit, and receives and stores the processing time and the environmental information of the work pieces of the lot.

A cooling apparatus and method are provided for facilitating cooling of an electronic apparatus that includes a semiconductor element. The cooling apparatus includes an evaporator containing a coolant and evaporating the coolant under a reduced pressure lower than an ambient pressure to generate a chilled coolant, a condenser regenerating the coolant from a vapor of the coolant and being fluid-communicated with the evaporator through a bypass line, and a circulating pump and a line supplying the chilled coolant to a heat exchange area of the electronic apparatus to conduct a heat exchange with an air flow passing though the semiconductor element at a hot side of the electronic apparatus and returning the coolant after the heat exchange to the condenser.

A cooling apparatus and method are provided for facilitating cooling of an electronic apparatus that includes a semiconductor element. The cooling apparatus includes an evaporator containing a coolant and evaporating the coolant under a reduced pressure lower than an ambient pressure to generate a chilled coolant, a condenser regenerating the coolant from a vapor of the coolant and being fluid-communicated with the evaporator through a bypass line, and a circulating pump and a line supplying the chilled coolant to a heat exchange area of the electronic apparatus to conduct a heat exchange with an air flow passing though the semiconductor element at a hot side of the electronic apparatus and returning the coolant after the heat exchange to the condenser.

Provided is a gas barrier laminate that maintains the outstanding gas barrier properties of a cellulose film even under high humidity, and which can minimize the contamination of and penetration into a film of water vapor and / or foreign bodies etc., which cause deterioration. The gas barrier laminate comprises a base material, and a gas barrier layer which is provided to at least one side of the base material. The gas barrier layer contains at least cellulose fibers and one or more types of water-soluble polymer. The fiber width of the cellulose fibers falls within the range of 3 nm to 50 nm.

This high strength hot rolled steel sheet has a composition that contains, in mass%, from 0.05% to 0.18% (inclusive) of C, 1.0% or less of Si, from 1.0% to 3.5% (inclusive) of Mn, 0.04% or less of P, 0.006% or less of S, 0.10% or less of Al, 0.008% or less of N, from 0.05% to 0.20% (inclusive) of Ti and more than 0.1% but 0.3% or less of V with the balance made up of Fe and unavoidable impurities. This high strength hot rolled steel sheet has a structure that contains a bainite phase as the main phase in an area ratio of more than 85%, while containing one or more phases selected from among a ferrite phase, a martensite phase and a residual austenite phase as the second phase in an area ratio of 0% or more but less than 15%. The average lath interval of the laths of the bainite phase is 400 nm or less, and the average length of long axes of the laths is 5.0 μm or less. This high strength hot rolled steel sheet has a tensile strength (TS) of 980 MPa or more.