Function gradient material and structure integrated manufacturing 3D printing device and printing method

Abstract

The invention discloses a function gradient material and structure integrated manufacturing 3D printing device and printing method. The 3D printing device comprises a three-dimensional moving supportand a printing nozzle mounted on the three-dimensional moving support and including a stepping motor, a stirring paddle, a shell and a spray nozzle, the stepping motor is mounted at the end of the shell, one end of the stirring paddle is connected with an output shaft of the stepping motor through a coupling, the other end of the stirring paddle extends into a mixing chamber in the shell, the output shaft of the stepping motor and the shell are sealed, the spray nozzle and the stepping motor are oppositely mounted at the other end of the shell, the position, between the nozzle and the mixing chamber, of a material runner is provided with a control valve, a printing material I inlet and a printing material II inlet are formed in the side wall of the mixing chamber and are connected with a printing material I supply pump and a printing material II supply pump correspondingly, and a gas path I opening and a gas path II opening are formed in the position, between the mixing chamber and thestepping motor, of the side wall of the shell, and are connected with a gas source and a vacuum pump.

Description

technical field [0001] The invention belongs to the technical field of additive manufacturing and functionally graded material / structure manufacturing, and specifically relates to a 3D printing device and a printing method for integrated manufacturing of functionally graded materials and structures. Background technique [0002] The information disclosed in this background section is only intended to increase the understanding of the general background of the present invention, and is not necessarily taken as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to those skilled in the art. [0003] Functionally Gradient Material (Functionally Gradient Material, referred to as FGM) refers to the use of advanced composite technology in the preparation process of the material, so that the microscopic elements of the material (including material components and microstructure) are continuous in a specific direction (or Quasi-con...

AI Technical Summary

Problems solved by technology

[0007] According to the existing research results and information that have been published at home and abroad, the 3D printing technologies and processes that have been proposed for the manufacture of functionally graded materials / structural parts mainly include: directed energy deposition (LENS), laser cladding, and fused deposition modeling (FDM). , polymer injection (Polyjet), powder bed fusion, etc., but, according to the research of the inventor, it is found that these existing 3D printing technologies still have many defects and deficiencies when manufacturing functionally graded materials / structural parts: (1) Inhomogeneous mixing of ingredients

However, in the mixing process of liquid and solid powder, there are the following problems: (1) in the mixing process, the powder is easy to agglomerate and difficult to disperse, which is a common problem in existing solid-liquid mixing; (2) if the viscosity of the liquid is too high, Air will be brought in during the mixing process, prone to bubbles, and it is difficult for solid powder to mix evenly in the liquid; (3) Solid-liquid mixed materials with different ratios can be fed, mixed and extruded during the printing process. The whole process takes a short time and requires fast response

For example, for PDMS-based functionally graded materials, PDMS has a high viscosity, and it is difficult for solid nanoparticles to mix uniformly in PDMS liquid, and bubbles are prone to appear during the mixing process. The uneven distribution of solid nanoparticles and the generated bubbles will seriously affect 3D printing. product quality, etc.

For the field of flexible electronics, various single-material flexible substrates widely used at present are increasingly unable to meet the needs of practical engineering applications.

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