The invention discloses
tin-
bismuth jet printing
soldering paste modified by silver
powder particles. The
tin-
bismuth jet printing
soldering paste modified by the silver
powder particles comprises, byweight, 50 wt%-80 wt% of SnBi
soldering paste and 20 wt%-50 wt% of conductive silver
adhesive. The conductive silver
adhesive comprises, by
mass, 65 %-67% of Ag and 33%-35% of assistant. The assistant comprises
bisphenol-A
epoxy resin, a curing agent, a
coupling agent, a
diluent, an
accelerant and a defoaming agent. The invention further provides a preparation method of the
tin-
bismuth jet printing soldering paste modified by the silver
powder particles. According to the preparation method, the SnBi soldering paste and the conductive silver
adhesive are respectively prepared; the prepared soldering paste and the conductive silver adhesive are evenly mixed at a corresponding ratio, and the tin-bismuth jet printing soldering paste modified by the silver powder particles are obtained. By theadoption of the technical scheme, the modified soldering paste mixed with the
silver particles has good jet printing performance, the prepared jet printing soldering paste modified by the silver powder particles is free of lead and
halogen, when used, the prepared jet printing soldering paste modified by the silver powder particles is
environmentally friendly, harmless and good in
wetting performance; and during jet printing, the spot diameters are uniform, the heights are identical,
welding spots are smooth and full, and the mechanical performance is excellent.