Tin-bismuth jet printing soldering paste modified by silver powder particles and preparation method thereof

A technology of solder paste and particles, which is applied in the field of electronic welding, can solve the problems of affecting the quality of spray printing solder paste, reducing the wettability of solder paste, and easy to block nozzles, etc., and achieves environmentally friendly and harmless wettability, excellent mechanical properties, and solder point smooth full effect

Active Publication Date: 2018-03-23
ZHANGJIAGANG DONGDA IND TECH RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the particle size of the tin powder is large, it is easy to block the nozzle and affect the quality of the printed solder paste
If the particle size of the tin powder is small, agglomeration will occur, which will reduce the wettability of the solder paste, and it will be prone to splashing during the subsequent reflow process, forming bridges, short circuits, etc.

Method used

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  • Tin-bismuth jet printing soldering paste modified by silver powder particles and preparation method thereof
  • Tin-bismuth jet printing soldering paste modified by silver powder particles and preparation method thereof
  • Tin-bismuth jet printing soldering paste modified by silver powder particles and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] (1) Preparation of solder paste: Take 42Sn58Bi particles (No. 5 powder), and prepare solder paste by stirring according to the mass ratio of tin powder and flux of 17:3. Mix it by hand until there is no obvious dry powder, then put it in a mixer for mixing.

[0039] (2) Preparation of conductive silver glue: take silver powder particles (2-10 μm), and prepare conductive silver glue by stirring according to the mass ratio of silver powder particles and flux of 13:7. See the table below for flux composition.

[0040]

[0041] (3) Preparation of silver particle modified printing solder paste: mix the solder paste prepared in step (1) (2) with the conductive silver glue in a ratio of 1:1, first use a spiral oscillator for mechanical stirring, and then Use an ultrasonic cleaner to perform ultrasonic oscillation, stir evenly, and the solder paste is completed.

Embodiment 2

[0043] (1) Preparation of solder paste: Take 42Sn58Bi particles (No. 5 powder), and prepare solder paste by stirring according to the mass ratio of tin powder and flux of 17:3. Mix it by hand until there is no obvious dry powder, then put it in a mixer for mixing.

[0044] (2) Preparation of conductive silver glue: take silver powder particles (2-10 μm), and prepare conductive silver glue by stirring according to the mass ratio of silver powder particles and flux of 13:7.

[0045] (3) Preparation of silver particle modified spray printing solder paste: mix the solder paste prepared in step (1)(2) with conductive silver glue according to the ratio of 13:7, first use a spiral oscillator to mechanically stir, and then Use an ultrasonic cleaner to perform ultrasonic oscillation, stir evenly, and the solder paste is completed.

Embodiment 3

[0047] (1) Preparation of solder paste: Take 42Sn58Bi particles (No. 5 powder), and prepare solder paste by stirring according to the mass ratio of tin powder and flux of 17:3. Mix it by hand until there is no obvious dry powder, then put it in a mixer for mixing.

[0048] (2) Preparation of conductive silver glue: take silver powder particles (2-10 μm), and prepare conductive silver glue by stirring according to the mass ratio of silver powder particles and flux of 13:7.

[0049] (3) Preparation of silver particle modified spray printing solder paste: mix the solder paste prepared in step (1)(2) with the conductive silver glue in a ratio of 4:1, first use a spiral oscillator for mechanical stirring, and then Use an ultrasonic cleaner to perform ultrasonic oscillation, stir evenly, and the solder paste is completed.

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PUM

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Abstract

The invention discloses tin-bismuth jet printing soldering paste modified by silver powder particles. The tin-bismuth jet printing soldering paste modified by the silver powder particles comprises, byweight, 50 wt%-80 wt% of SnBi soldering paste and 20 wt%-50 wt% of conductive silver adhesive. The conductive silver adhesive comprises, by mass, 65 %-67% of Ag and 33%-35% of assistant. The assistant comprises bisphenol-A epoxy resin, a curing agent, a coupling agent, a diluent, an accelerant and a defoaming agent. The invention further provides a preparation method of the tin-bismuth jet printing soldering paste modified by the silver powder particles. According to the preparation method, the SnBi soldering paste and the conductive silver adhesive are respectively prepared; the prepared soldering paste and the conductive silver adhesive are evenly mixed at a corresponding ratio, and the tin-bismuth jet printing soldering paste modified by the silver powder particles are obtained. By theadoption of the technical scheme, the modified soldering paste mixed with the silver particles has good jet printing performance, the prepared jet printing soldering paste modified by the silver powder particles is free of lead and halogen, when used, the prepared jet printing soldering paste modified by the silver powder particles is environmentally friendly, harmless and good in wetting performance; and during jet printing, the spot diameters are uniform, the heights are identical, welding spots are smooth and full, and the mechanical performance is excellent.

Description

technical field [0001] The invention relates to the field of electronic welding, in particular to a tin-bismuth spray printing solder paste. Background technique [0002] With the inflection point of Moore's Law, semiconductor manufacturing technology is facing challenges. The surface mount technology industry is moving towards micro-packaging with higher component density, and the traditional screen printing technology is gradually unable to meet the demand. Jet printing technology has gradually entered people's sight. Its main advantages are: fast printing speed, the highest printing efficiency can reach 30,000cph; no need to make screens, and it is easier to realize customized production; the quality of printing points can be automatically checked, and can be added Artificial intelligence control unit. [0003] The particle size of tin powder has a great influence on the printing technology. Among the solder paste products suitable for jet printing technology, the part...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/26
CPCB23K35/22B23K35/26
Inventor 周健李赛鹏孙凯郝建田爽薛烽白晶
Owner ZHANGJIAGANG DONGDA IND TECH RES INST
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