The invention discloses a low-etching cleaning solution suitable for cleaning relatively thick photoresist. The low-etching photoresist cleaning solution contains potassium hydroxide, solvent, alkylol amine, organic phenol, benzoic acid and derivative thereof or salt thereof, and polycarboxylate corrosion inhibitor. The photoresist cleaning solution can be used for removing the photoresist or other residues on metal, metal alloy or dielectric substrate, has relatively low etching rate on the metals such as copper, aluminum, tin, lead and silver, and has good application prospect in the micro-electronics field such as semiconductor chip cleaning.