Semiconductor made thick photoresist film coating device and application method thereof

Abstract

The invention relates to the field of semiconductor processing, in particular to a semiconductor made thick photoresist film coating device and an application method thereof. The semiconductor made thick photoresist film coating device comprises an electric cylinder, spraying heads, a photoresist cup assembly, a rotary adsorption mechanism and a base plate. The electric cylinder and the photoresist cup assembly are both arranged on the base plate. A movable beam is arranged on the electric cylinder. The spraying heads spraying heads of which the intervals and the height can be all adjusted are arranged on the movable beam. The rotary adsorption mechanism is provided with a rotary adsorption disk used for adsorbing a wafer. The adsorption disk is arranged in the middle of the photoresist cup assembly. During photoresist film coating, the spraying heads are driven by the movable beam of the electric cylinder to move horizontally above the adsorption disk. The to-be-processed wafer is put on the adsorption disk. The multiple spraying heads are driven by the electric cylinder to move synchronously and horizontally and spraying photoresist, and then the wafer is fixedly adsorbed by the adsorption disk. The multiple spraying heads are driven by the electric cylinder to move synchronously and horizontally and spray the atomized photoresist. According to the semiconductor made thick photoresist film coating device and the application method thereof, even spraying is ensured, the film thickness of the whole wafer is made to be uniform, and edge protrusions of the wafer is avoided completely.

Description

technical field [0001] The invention relates to the field of semiconductor processing, in particular to a thick glue film coating device made of semiconductors and a method for using the same. Background technique [0002] In the field of semiconductor processing, in the existing spraying photoresist technology, the coating of thick film is processed by spin coating. Because the film is thick, it needs to be coated more than two times and the spreading process is slow. It is very low, and the uniformity is difficult to control, and there is a circle of bumps on the edge of the wafer after spin coating, which makes the edge of the wafer unusable and reduces the utilization rate of the product. As semiconductor production refinement and high integration requirements are getting higher and higher, wafer productivity and yield are getting more and more attention. In various processing processes, the treatment of spraying photoresist on the wafer surface is particularly important...

AI Technical Summary

Problems solved by technology

[0002] In the field of semiconductor processing, in the existing spraying photoresist technology, the coating of thick film is processed by spin coating. Because the film is thick, it needs to be coated more than two times and the spreading process is slow. Very low, and the uniformity is difficult to control, and there is a circle of bumps on the edge of the wafer after spin coating, which makes the edge of the wafer unusable and reduces the utilization rate of the product

As semiconductor production refinement and high integration requirements are getting higher and higher, wafer productivity and yield are getting more and more attention. In various processing processes, the treatment of spraying photoresist on the wafer surface is particularly important, especially The optimization of the spraying processing speed on the wafer surface has an important impact on increasing production capacity, reducing costs, and increasing benefits. However, there is an inverse relationship between the spraying speed and the spraying thickness. When the thickness is high, multiple sprayings need to be repeated back and forth, which also greatly increases the time-consuming of single-wafer spraying processing, resulting in a decrease in production capacity

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