748 results about "Semiconductor production" patented technology

The invention relates to the technical field of semiconductor manufacturing quality control, in particular to a semiconductor anomaly detection method and system based on physical causal relationship modeling, and the method comprises the following steps: S1, obtaining multi-dimensional sensor data of a semiconductor production line, and building a sensor causal relationship model based on an etching process physical mechanism; s2, performing time sequence alignment, abnormal propagation modeling and root cause positioning along a causal relationship path; s3, adaptive intelligent decision making based on the graph attention network; according to the invention, by establishing a physical causal relationship model between sensors, time sequence alignment and anomaly detection driven by the causal relationship are realized, and adaptive intelligent decision and predictive feedback optimization of the graph attention network are combined. The technical problems that in the prior art, time sequence alignment precision is not high, abnormal detection lacks root cause analysis, and system decision is not intelligent enough are solved.

The utility model relates to a semiconductor wafer box transfer device which has high precision, high stability and high automation level and is suitable for wafer box transfer in the semiconductor production process. The device comprises a connection table arranged in a bottom area, the connection table is provided with a power assembly and a groove transmission structure which are used for lifting and transmitting a wafer box, and the periphery of the connection table is provided with an anti-vibration device made of a flexible material. And the crown block is positioned at the upper part of the device and moves along the guide system track so as to ensure smooth transfer of the wafer box among different areas. A manipulator is arranged on one side of the connection table, the tail end of the manipulator is provided with a grabbing device of an open type U-shaped structure, and a positioning column is arranged to be matched with a positioning hole in the bottom of the wafer box, so that the positioning accuracy of the wafer box is guaranteed. An automatic induction device is installed above the grabbing device and cooperates with an inductor to monitor the position of the wafer box in real time. The power assembly adopts a belt transmission system to ensure stable transmission of the wafer box.

A lead frame transferring and stacking device relates to the field of semiconductor production, and comprises a support frame, two ends of which are provided with support rings in the length direction; the turnover mechanism comprises two gear rings which are rotatably mounted on the inner sides of the supporting rings respectively, two bearing plates which are symmetrically arranged and are parallel to the supporting frame in the length direction are arranged between the gear rings, the turnover mechanism is used for placing a transfer frame, and a plurality of lead frames are arranged on the transfer frame in a rectangular array mode; two stop levers which are symmetrically arranged and reciprocate in the width direction of the bearing plate are arranged on the bearing plate, the length direction of the stop levers is parallel to the axis of the gear ring, and the stop levers are used for limiting the lead frame; the bearing mechanism comprises two supporting plates which are arranged on the two sides of the supporting frame in the length direction respectively and move in the width direction and the vertical direction of the supporting frame, a plurality of material frames arranged at intervals are arranged on the top faces of the supporting plates in the length direction of the supporting plates, and during application, the upper ends of the material frames abut against the transfer frame and are used for collecting the lead frames. According to the device, the lead frames can be automatically stacked in the material frame, and the efficiency is improved.

The utility model relates to the technical field of semiconductor production, and particularly discloses a reagent placing assembly, a wet process machine table and an automatic liquid changing system. The reagent placing assembly comprises a supporting piece and a liquid receiving piece, a placing area is arranged on the supporting piece and is used for placing a reagent bottle; and the liquid receiving piece is arranged beside the placing area and is used for receiving drippings of the liquid taking pipe. And a liquid receiving piece of the reagent placing assembly can receive drippings of the liquid taking pipe. According to the scheme, dripping objects can be received through the liquid receiving piece, so that in the process of replacing the reagent bottle, after a bottle cap of the reagent bottle is taken down, the bottle cap can be moved to the position above the liquid receiving piece, the dripping objects of a liquid taking pipe on the bottle cap are received, pollution of reagents to a machine table and the working environment is effectively prevented, and the cleaning burden of workers is reduced.

The invention discloses a silicon wafer column machining and grinding device for semiconductor production, and relates to the technical field of semiconductor production, the silicon wafer column machining and grinding device comprises a machining plate, a placing plate is fixedly mounted at the top of the machining plate, a linear driving mechanism fixedly penetrates through the top of the machining plate, and a driving motor is fixedly mounted at the top of the moving end of the linear driving mechanism; a loading plate is fixedly mounted at the output end of the driving motor, and a grinding mechanism fixedly penetrates through the end, away from the driving motor, of the loading plate. Wherein the clamping device comprises an electric push rod, a carrying plate, a T-shaped rod, a first spring, a rubber plate, a lifting plate, a first elastic piece, two connecting rods, an arc-shaped strip and a supporting rod, the polishing stability is improved through supporting force applied by the machining plate, then the arc-shaped strip is used for applying pressure to the silicon wafer column, and it is ensured that the silicon wafer column does not deflect in the polishing process, and the polishing effect is not affected.

The invention relates to the technical field of industrial waste gas treatment, in particular to a waste gas treatment method and system based on model optimization. The method comprises the following steps: carrying out multi-dimensional spectrum acquisition on the semiconductor production line waste gas to obtain VOCs molecular spectrum data; performing target VOCs molecule selection based on the VOCs molecule spectrum data to obtain target VOCs molecule positioning data; performing plasma energy field activation on the target VOCs molecules according to the target VOCs molecule positioning data to obtain VOCs molecule energy conversion data; and according to the VOCs molecule energy conversion data, carrying out selective molecular bond cleavage on the target VOCs molecule to obtain VOCs molecule degradable structure data. The VOCs in semiconductor production can be accurately identified and treated, and the pertinence and efficiency of waste gas treatment are improved.

The invention discloses an equipment end wafer caching system for semiconductor production, and particularly relates to the field of semiconductor manufacturing equipment, which comprises a task initialization module, an intelligent scheduling module, a round box transportation module, a caching scheduling module, an exception handling module and a task feedback module, according to the task initialization module, a production management system MES generates a wafer box carrying task according to the production plan; according to the intelligent scheduling module, the core scheduling control unit generates an optimal carrying strategy based on the carrying task; the intelligent scheduling system MCS monitors the state and position of the wafer box and the requirements of a production line in real time, the optimal wafer box carrying path and storage strategy can be selected, the carrying task is issued, it is ensured that the wafer box efficiently flows among the cache groove, the STK storage area, the SMIF equipment and the OHS air shuttle vehicle, the waiting time and invalid carrying are reduced, and the production efficiency is improved. And the overall production efficiency is improved.

The invention discloses a semiconductor production material carrying scheduling method, device and equipment and a readable storage medium, and relates to the field of production scheduling. According to the method, all the sub-tasks of the material carrying task are used as the minimum task sorting units to be sorted, all possible task execution sequences are obtained, and the optimal execution sequence is screened out from all the possible task execution sequences with the purpose of finding the shortest path. According to the method, the material carrying task is more flexible to execute, the proportion of the no-load stroke of the AGV can be reduced, and the transportation efficiency of the AGV is improved.

The utility model discloses coating equipment for improving the uniformity of a magnetron sputtering film, and belongs to the technical field of semiconductor production equipment.The coating equipment comprises a substrate table, the substrate table is provided with a cooling channel and a cooling air hole, and a supporting part is arranged at the upper end of the substrate table in a protruding mode; the air hole plug is arranged on the substrate table in a lifting adjusting manner; and the base plate is placed on the supporting part. Opening and closing of the cooling air holes in the corresponding positions can be adjusted according to the temperature distribution condition of the substrate in the debugging stage, the cooling air holes are opened in the high-temperature area to be communicated with the cooling channel, cooling air is used for cooling, and when the cooling air is sent out from the cooling air holes, the air uniformizing space can be used for uniformizing the cooling air in a small range, so that the cooling efficiency is improved. Regional cooling is achieved, the purpose of temperature regulation and control is achieved, the temperature of the surface of the substrate is uniform and consistent, and then the uniformity of coating is improved.

The invention is applicable to the technical field of semiconductor production equipment, and provides polishing equipment for semiconductor glass substrate processing, which comprises a polishing assembly, and the polishing assembly is rotatably matched with a positioning assembly; the polishing assembly comprises a polishing piece and a supporting piece arranged on the polishing piece in a sliding fit mode, and the positioning assembly comprises a clamping piece arranged on the polishing piece in a rotating fit mode, a rotating piece arranged on the clamping piece in a rotating fit mode and a cam piece located on the rotating piece in an inserted connection mode. The equipment solves the problems that when an existing semiconductor glass substrate is subjected to polishing operation on the upper surface and the lower surface, generally when polishing operation on one end face is completed, the clamping and positioning process of the clamped and positioned semiconductor glass substrate needs to be relieved, then the semiconductor glass substrate is turned over, and finally the semiconductor glass substrate is subjected to clamping and positioning operation after being turned over; the whole polishing process is too tedious, and the polishing efficiency of the upper surface and the lower surface of the same semiconductor glass substrate is reduced.

The invention provides a semiconductor SPC system data multi-thread rendering display device and method, and belongs to the field of semiconductor manufacturing, and the method specifically comprises the steps: obtaining sampling point data; displaying an interactive interface of the interactive operation to enable a user to select to-be-displayed interface content, and determining a rendering task according to the business operation corresponding to the selected interface content; performing service calculation on the sampling point data by adopting a multi-task concurrent mode, and outputting a task processing result; based on the data volume of the sampling point data and the business operation corresponding to the selected interface content, determining a rendering mode of the task processing result, and generating a to-be-rendered result; decomposing the rendering task into a plurality of stage tasks of framing rendering based on the to-be-rendered result; and performing framing rendering on a task processing result according to the stage task, and displaying a rendered page. By means of the processing scheme, the mass semiconductor production data can be dynamically rendered, and efficient self-adaptive display of the mass semiconductor monitoring data is achieved.

The utility model provides a plasma cleaning device, and belongs to the technical field of semiconductor production equipment, the plasma cleaning device comprises a cavity, and a chamber is arranged in the cavity; the cover plate covers the upper end of the cavity; the remote plasma source is connected to the central position of the protruding part; the gas blocking part is arranged in the conical cavity; the first gas homogenizing plate is arranged below the gas blocking part; the second gas uniformizing plate is arranged below the first gas uniformizing plate; and a substrate table. The cover plate and the gas blocking part can uniformly disperse plasma gas fed by a remote plasma source into the cavity, then the plasma gas is further homogenized through the first gas homogenizing plate to ensure the gas uniformity of a substrate area, and meanwhile, the vacuum mechanism is generally connected to the bottom of the cavity, so that the gas is downwards pumped through the second gas homogenizing plate during gas pumping, and the gas uniformity of the substrate area is ensured. The gas uniformity in the chamber can be effectively ensured, so that the etching uniformity and the etching rate are improved.

The invention relates to the technical field of semiconductor device testing, in particular to an intelligent management and control system and method for semiconductor production process quality, and the method comprises the steps: obtaining target application scene information of a to-be-tested semiconductor device; a first intelligent test model is utilized to generate baseline test severity configuration matched with the target application scene according to the target application scene information, and the baseline test severity configuration comprises test limit values of a plurality of test parameters, test item selection and test conditions; in the testing process, quality feedback data and upstream process data related to the semiconductor device to be tested are obtained and analyzed in real time, and semiconductor real-time data are obtained; performing comprehensive analysis on the semiconductor real-time data and the baseline test severity configuration by using a semiconductor quality adjustment model, dynamically adjusting the baseline test severity configuration, and generating a final test severity configuration; and generating a control instruction based on the final test severity configuration, and testing the semiconductor device.

The invention discloses a BUB bubble conveying system for a semiconductor production process and a control method, and belongs to the technical field of bubble conveying control, and the method specifically comprises the steps: in a fluid conveying pipeline of the semiconductor production process, generating a bubble group through a bubble generator, and adjusting the bubble generation frequency and volume distribution based on a liquid impedance feedback signal, the flow velocity, pressure and bubble distribution parameters of process liquid are collected, a pre-trained flow field prediction model is used for analyzing the bubble gathering trend, when the transmission retardation risk is detected, the opening degree of a micro valve is automatically adjusted, a bubble path is shunted, and a micro-pulse air pressure signal is applied to the throttling section of the semiconductor production process fluid conveying pipeline. Dynamically matching the bubble rupture phase with the fluid viscosity, and switching to a reverse bubbling mode to perform self-cleaning on the pipeline when detecting that the bubble residue exceeds a threshold value; linkage regulation and control of the multi-node micro valve are achieved, and the uniformity, repeatability and safety of fluid conveying can be kept in long-term operation.

The invention belongs to the technical field of semiconductor wafer processing, and particularly relates to a grinding device for semiconductor production and processing, which comprises a workbench, a protective cover, a moving assembly and a liquid spraying assembly, and the moving assembly drives a grinding adjusting assembly to move; the polishing adjusting assembly comprises a box cover and a polishing box, an adjusting motor is installed on the box cover and connected with a transmission shaft and a reciprocating lead screw, and the transmission shaft drives the polishing box to rotate intermittently through the liquid spraying assembly. The polishing blocks are driven by the polishing adjusting assembly to press and fit the wafer disc, the polishing box is driven by the adjusting driving assembly to rotate intermittently, then the next group of polishing blocks is switched to be matched with the inserting block to move downwards again to press the pressing plate, and the effect that each group of polishing blocks fit the wafer disc is achieved. The polishing blocks are adjusted one by one through the polishing adjusting assembly, so that all the sets of polishing blocks can be attached to the uneven surface of the wafer disc, the polishing efficiency of the polishing blocks is improved, it is ensured that the thickness of the wafer disc is uniform, and uneven stress distribution of the wafer disc is avoided.

The invention belongs to the technical field of pipeline production, and particularly relates to a precise pipeline surface treatment device for semiconductor production. A pair of supporting frames are symmetrically and fixedly connected to the top of the workbench. A placing groove is formed in the top of the supporting frame; the top of the workbench is fixedly connected with a first electric sliding rail. A first electric sliding block is slidably connected to the middle of the first electric sliding rail. The top of the first electric sliding block is fixedly connected with a base. A first supporting rod is fixedly connected to the top of the base; the end part of the first supporting rod is fixedly connected with a first hollow lantern ring; a plurality of spray heads are fixedly connected to the inner side wall of the first hollow lantern ring; the spray head and the first hollow lantern ring are communicated with each other and are arranged circumferentially; a water tank is fixedly connected to the top of the base; before the pipeline is polished, the pipeline is fully cleaned, impurities on the surface of the pipeline are removed, and the subsequent machining quality of the pipeline is improved.

The invention relates to the technical field of artificial intelligence and semiconductor manufacturing process monitoring, and particularly discloses a semiconductor valve analysis system integrating single Q table reinforcement learning and multi-head attention. Global representation is generated through a multi-head attention feature fusion engine, a single Q table reinforcement learning machine guided by physical constraints is combined with a physical mechanism model to limit an action space so as to output an optimal instruction, and finally, a value matrix is dynamically updated through a closed-loop execution and monitoring feedback module. According to the invention, deep feature association can be mined, decision is ensured to accord with physical rules, learning efficiency and control stability are significantly improved, and semiconductor production safety is guaranteed.

The present invention discloses a wafer defect detection device for semiconductor production, which relates to the field of wafer detection and solves the problem that the existing detection device has too large a clamping force on the wafer when turning the wafer over. It includes: a detection platform and a support plate. An installation disk is arranged on the outside of the support plate. An L-shaped bracket is arranged on the outside of the installation disk. An infrared detector is installed at one end of the L-shaped bracket. An installation frame is installed on the top of the detection platform. A detection box is installed on the top of the installation frame. A transparent placement plate is arranged inside the detection box; it further includes: a detection mechanism for double-sided detection of the wafer on the transparent placement plate, and the detection mechanism is installed inside the detection box; through the detection mechanism of the present invention, it is possible to detect the top and bottom of the wafer without flipping the wafer, reduce the contact with the wafer during detection, solve the problem that the traditional detection device has too large a clamping force on the wafer, prevent the wafer from being damaged, and thus achieve the effect of safe and multi-sided detection.

The present invention provides a semiconductor lead frame cutting device, which relates to the technical field of semiconductor production. It includes a support mechanism, a limiting mechanism, a lifting mechanism and a laser cutting mechanism; the support mechanism includes a longitudinal support member and a transverse support member, and longitudinal support members are connected to both ends of the transverse support member; the limiting mechanism includes a movable block, a suction cup and a vacuum pump. The suction cup is installed on the transverse support member and communicated with the vacuum pump, and the suction cup is used for adsorbing the upper side of the semiconductor; the movable block is located below the suction cup and is used for supporting the lead frame; the lifting mechanism is used for longitudinally moving the movable block; the laser cutting mechanism includes a laser and a plurality of laser heads connected by optical fibers. The laser has a beam splitter, and the laser heads are installed on the transverse support member and are used for cutting the leads. The present invention uses the laser cutting mechanism to cut the leads, and there is no need to frequently replace the worn cutting tool, nor is it necessary to accurately determine or detect the degree of tool wear before replacing the cutting tool.

The invention discloses a multi-station mechanical arm for wafer interactive transmission, and relates to the field of semiconductor production, the multi-station mechanical arm comprises an X-axis walking unit, the X-axis walking unit comprises a protection bin body and a first movement driving mechanism, the first movement driving mechanism is installed in the protection bin body, and a Y-axis arm telescopic unit comprises a wafer taking arm, a first supporting table and a second movement driving mechanism; one side of the wafer taking arm is connected with a second movement driving mechanism used for driving the wafer taking arm to move in the length direction of the first supporting table, the second movement driving mechanism is installed on the first supporting table, the rotation driving unit is installed at the bottom of the first supporting table, and the rotation driving unit comprises a rotation driving piece A; according to the multi-station mechanical arm for wafer interactive transmission, the automatic production requirement of a semiconductor yellow light area Inline can be met, the designed mechanical arm can automatically rotate by 350 degrees to take and place wafers at multiple stations, the position precision reaches 0.1 mm or above, and the transmission efficiency WPH reaches 180 wafers or above.

The invention discloses a miniaturized monolithic integration method of a geomagnetic sensor and an MCU (Microprogrammed Control Unit). The method comprises the following steps of (1) low-temperature CMOS circuit layer preparation, (2) TSV three-dimensional interconnection structure processing, (3) magnetic-core-free planar coil manufacturing, (4) low-temperature electromagnetic shielding layer integration and (5) structure release and vacuum packaging. Process conflicts and hysteresis errors introduced by ferromagnetic materials are eliminated through a non-magnetic-core design, a TSV (through silicon via) three-dimensional interconnection technology is adopted to replace traditional plane wiring, the size of the module is compressed to the millimeter level, meanwhile, a broadband electromagnetic shielding layer is integrated, and it is ensured that in a weak magnetic field (lt; and the signal-to-noise ratio in a detection scene is greater than or equal to 30dB. The low-temperature compatibility with a CMOS (complementary metal oxide semiconductor) process can be realized, the mass production feasibility needs to adapt to a standard semiconductor production line, the cost of a single chip is reduced by more than 30%, and the method is suitable for navigation equipment, consumer electronics and industrial sensing systems.

The invention belongs to the technical field of semiconductor manufacturing, and particularly discloses a dynamic bottleneck prediction method and device for semiconductor production equipment and electronic equipment. The method comprises the following steps: acquiring a multi-source operation data set of each semiconductor production device on a semiconductor production line; performing standardization processing on various kinds of operation data in each multi-source operation data set to obtain each standardized multi-source operation data set; inputting each standardized multi-source operation data set into an equipment bottleneck prediction model to obtain a bottleneck prediction result of each semiconductor production equipment output by the equipment bottleneck prediction model; the equipment bottleneck prediction model is obtained by training according to a multi-source operation data set sample and a corresponding equipment bottleneck label; the multi-source operation data set comprises product-in-process water level data, equipment energy efficiency data, equipment normal operation duration data and equipment productivity data. According to the invention, the bottleneck equipment on the production line can be effectively identified, and the dynamic bottleneck prediction precision of the semiconductor production equipment is improved.

The invention relates to the technical field of semiconductor material production, in particular to a single crystal furnace for silicon carbide semiconductor production, which comprises a furnace body, a pressure relief mechanism is arranged at the top end in the furnace body, the pressure relief mechanism comprises a cylinder penetrating through the top end of the furnace body, a piston rod slides in the cylinder, and a push disc is arranged at the top end of the piston rod. When the air pressure in the furnace exceeds the pre-tightening force of the spring B, the piston rod drives the push disc to enable the plug to be separated from the air suction pipe, safe pressure relief and crystal growth environment stabilization are achieved, the push disc moves upwards to be in linkage with the rack A and the valve rod, the opening degree of the ball valve is adjusted, the water cooling flow is controlled according to needs, energy consumption is reduced, and the growth rate is increased; pulse water flow is generated through extrusion of the cam, heat exchange is enhanced, meanwhile, hydraulic pressure changes caused by extrusion of the water cooling pipe enable fan blades to rotate through gear transmission to generate negative pressure, pressure relief is accelerated, and the adverse effect of crystals with abnormal pressure and temperature is reduced.

The invention relates to the field of semiconductor production processes, and provides a wafer alignment device for a photoetching machine and the photoetching machine. The wafer alignment device for the photoetching machine comprises a wafer carrying table used for carrying a wafer; the clamping assembly comprises a clamping driving part and a pair of clamping discs which are in transmission connection, the clamping driving part is used for driving the pair of clamping discs to move in the first direction and enabling the clamping discs to be switched between a clamping position and a separation position, in the clamping position, the pair of clamping discs are close to each other to clamp a wafer, and in the separation position, the pair of clamping discs are close to each other to clamp the wafer. The pair of clamping discs are far away from each other to release the wafer; the pair of lifting driving pieces are in one-to-one correspondence with the pair of clamping discs and are in transmission connection with the corresponding clamping discs respectively to drive the pair of clamping discs to ascend and descend in the second direction, and the first direction and the second direction are perpendicular to each other in the plane perpendicular to the wafer carrying table; the detection assembly is installed on the wafer carrying table, and the detection assembly is used for detecting the relative position of the wafer and the target bearing position. The wafer alignment device for the photoetching machine can be used for clamping wafers with different specifications, so that the accuracy is improved.

A gallium boat, a source filling system, and a source filling method are disclosed, belonging to the field of semiconductor manufacturing. The technical solution is as follows: A gallium boat includes a boat body, with a filling port fixedly provided on the upper part of the boat body. A sealing cap is detachably installed on the filling port. A conical channel is provided inside the filling port. The sealing cap includes a cap body for covering and shielding the filling port. A conical plug is fixedly provided on the cap body and inserted into the conical channel. The outer wall of the plug and the side wall of the conical channel are both frosted. Through the cooperation of the cap body, the plug, and the filling port, multi-stage sealing is achieved, extending the path of communication between the filling port and the outside, improving the sealing effect. The outer wall of the plug and the inner wall of the filling port are fitted together by the frosted structure, resulting in a good sealing effect and solving the problem of high processing difficulty.

The invention relates to the technical field of temperature sensing, and provides a temperature sensor detection circuit and semiconductor temperature control equipment, and the circuit comprises a constant current source module which is used for providing constant current; the thermosensitive module is connected with the constant current source module, and the thermosensitive module is used for obtaining the constant current to form temperature detection voltage corresponding to the temperature; the input end of the multi-stage differential module is connected with the thermosensitive module, the output end of the multi-stage differential module is used for being connected with the analog-to-digital conversion module, and the multi-stage differential module is used for carrying out at least two-stage differential processing on the temperature detection voltage to form a detection output signal. The thermosensitive module outputs temperature detection voltage corresponding to the temperature under the action of constant current, the multi-stage differential module obtains the temperature detection voltage for differential processing, the influence of common-mode interference is reduced, the multi-stage differential module carries out at least two-stage differential processing, the common-mode interference is further removed, and an output detection output signal has the advantage of high precision. And the requirement of semiconductor production on temperature detection is met.

The invention relates to the technical field of semiconductor data analysis, in particular to a semiconductor root cause tracing method and system and a program product, and the method comprises the steps: obtaining semiconductor production line data which at least comprises: (1) information of a plurality of pieces of processing equipment experienced by a plurality of semiconductor products, (2) process parameters adopted when the semiconductor product goes through at least one processing device, and / or category information of the semiconductor product, and (3) measured values, a data analysis scheme is called for semiconductor production line data, and the data analysis scheme comprises a fault prediction algorithm; preprocessing the semiconductor production line data according to the data analysis scheme to generate a preprocessing result; the preprocessing result and the corresponding semiconductor production line data are input into a preset big data platform, and the big data platform correspondingly outputs an analysis result. According to the big data traceability analysis method provided by the invention, the data analysis efficiency can be improved, and meanwhile, the requirement on the computing power in the analysis process is reduced, so that the implementation cost is reduced.

The invention provides a semiconductor production index prediction method and device, electronic equipment and a medium, and relates to the technical field of semiconductor manufacturing. The method comprises the following steps: acquiring the number of first in-process products generated by an equipment group in a target production line in the process of processing each product with different product characteristics in a first time period; using a pre-trained production cycle calculation model to calculate a target production cycle required by the equipment group to process each product with different product characteristics according to the number of the first in-process products, the corresponding product characteristics and the identifier of the corresponding equipment group; according to the first quantity of the products in process and the target production cycle, predicting a second quantity of the products in process generated by the equipment group in the process of processing the products with different product characteristics in a second time period; wherein the second time period is later than the first time period. According to the mode, the prediction accuracy of the two semiconductor production indexes, namely the target production cycle and the second product quantity in process, is improved.

The invention provides a semiconductor production scheduling method and device, equipment and a storage medium. The method comprises the following steps: acquiring an initial population of a plurality of batches of products; decoding each chromosome in the initial population to obtain the scheduling time corresponding to each chromosome; performing genetic algorithm iterative computation based on a preset fitness function and the scheduling time corresponding to each chromosome, and outputting N chromosomes with relatively large fitness function values; aiming at the N chromosomes, respectively calculating average in-process waiting time corresponding to each non-bottleneck process, and determining a target chromosome according to the average in-process waiting time corresponding to each non-bottleneck process; and decoding the target chromosome to obtain target scheduling time corresponding to the target chromosome, so that all bottleneck processes and non-bottleneck processes of all batches of products are executed according to the target scheduling time to produce all batches of products. The method provided by the invention is helpful for improving the production efficiency of the semiconductor.