307 results about "Semiconductor production" patented technology

The invention discloses a BUB bubble conveying system for a semiconductor production process and a control method, and belongs to the technical field of bubble conveying control, and the method specifically comprises the steps: in a fluid conveying pipeline of the semiconductor production process, generating a bubble group through a bubble generator, and adjusting the bubble generation frequency and volume distribution based on a liquid impedance feedback signal, the flow velocity, pressure and bubble distribution parameters of process liquid are collected, a pre-trained flow field prediction model is used for analyzing the bubble gathering trend, when the transmission retardation risk is detected, the opening degree of a micro valve is automatically adjusted, a bubble path is shunted, and a micro-pulse air pressure signal is applied to the throttling section of the semiconductor production process fluid conveying pipeline. Dynamically matching the bubble rupture phase with the fluid viscosity, and switching to a reverse bubbling mode to perform self-cleaning on the pipeline when detecting that the bubble residue exceeds a threshold value; linkage regulation and control of the multi-node micro valve are achieved, and the uniformity, repeatability and safety of fluid conveying can be kept in long-term operation.

The invention relates to the technical field of artificial intelligence and semiconductor manufacturing process monitoring, and particularly discloses a semiconductor valve analysis system integrating single Q table reinforcement learning and multi-head attention. Global representation is generated through a multi-head attention feature fusion engine, a single Q table reinforcement learning machine guided by physical constraints is combined with a physical mechanism model to limit an action space so as to output an optimal instruction, and finally, a value matrix is dynamically updated through a closed-loop execution and monitoring feedback module. According to the invention, deep feature association can be mined, decision is ensured to accord with physical rules, learning efficiency and control stability are significantly improved, and semiconductor production safety is guaranteed.

The invention relates to the technical field of semiconductor data analysis, in particular to a semiconductor root cause tracing method and system and a program product, and the method comprises the steps: obtaining semiconductor production line data which at least comprises: (1) information of a plurality of pieces of processing equipment experienced by a plurality of semiconductor products, (2) process parameters adopted when the semiconductor product goes through at least one processing device, and / or category information of the semiconductor product, and (3) measured values, a data analysis scheme is called for semiconductor production line data, and the data analysis scheme comprises a fault prediction algorithm; preprocessing the semiconductor production line data according to the data analysis scheme to generate a preprocessing result; the preprocessing result and the corresponding semiconductor production line data are input into a preset big data platform, and the big data platform correspondingly outputs an analysis result. According to the big data traceability analysis method provided by the invention, the data analysis efficiency can be improved, and meanwhile, the requirement on the computing power in the analysis process is reduced, so that the implementation cost is reduced.

The invention relates to the technical field of semiconductor data analysis, in particular to a root cause analysis method and system and a program product, and the method comprises the steps: obtaining semiconductor production line data which at least comprises: (1) information of a plurality of pieces of processing equipment experienced by a plurality of semiconductor products, (2) process parameters adopted when the semiconductor product goes through at least one processing device, and / or category information of the semiconductor product, and (3) measured values, a data analysis scheme is called for semiconductor production line data, and the data analysis scheme comprises a fault prediction algorithm; preprocessing the semiconductor production line data according to the data analysis scheme to generate a preprocessing result; the preprocessing result and the corresponding semiconductor production line data are input into a preset big data platform, and the big data platform correspondingly outputs an analysis result. According to the big data traceability analysis method provided by the invention, the data analysis efficiency can be improved, and meanwhile, the requirement on the computing power in the analysis process is reduced, so that the implementation cost is reduced.

The disclosure provides a semiconductor structure defect monitoring method and device, and relates to the technical field of semiconductors. The semiconductor structure defect monitoring method comprises the following steps: acquiring a overlay accuracy offset of a capacitor column and a support structure; acquiring an etching opening size of an etching film layer; determining a corresponding relationship between the overlay accuracy offset and the etching opening size; and monitoring a structure defect in a semiconductor production process based on the corresponding relationship. The technical problem of poor defect monitoring effect of the capacitor is solved, and the technical effect of improving the defect monitoring effect of the capacitor is achieved.

The invention relates to the field of semiconductor production, in particular to high-purity semi-insulating silicon carbide heat treatment equipment which comprises a base, and a heat treatment mechanism and a lifting mechanism are arranged on the base. A plurality of heating modules are arranged in the heating cylinder, the lifting mechanism comprises a supporting frame, connecting plates are symmetrically arranged on the supporting frame, the connecting plates can move up and down along the supporting frame, and the connecting plates are fixedly connected to the upper end face of the end cover; lifting rods are symmetrically arranged on the lower surface of the end cover, a supporting plate is fixedly connected to the end parts of the lifting rods, and a crucible is placed on the supporting plate; a structure capable of completely placing materials in a stable environment for heat treatment is arranged, namely, a crucible is arranged in a heating cylinder with a heat preservation layer, the quality of the materials after heat treatment can be guaranteed, a plurality of probes of a temperature monitoring instrument are arranged, the heat treatment temperature is controlled, then a lifting mechanism is arranged, the crucible is arranged on an end cover, and the heat treatment temperature is controlled. The crucible can move along with the end cover, and feeding and discharging operation of the crucible and materials is facilitated.

The utility model relates to the technical field of semiconductor production equipment, and discloses a semiconductor chip production mold, which comprises a plurality of lower movable molds, an upper movable mold and a middle fixed mold which are matched with each other, and further comprises a rotating plate for driving the plurality of lower movable molds to rotate, a driving motor used for driving the rotating plate to rotate is fixedly installed in the fixing base, a plurality of fixing mold frames used for positioning the lower movable mold are arranged on the upper portion of the rotating plate, second receding openings are formed in the lower portions of the fixing mold frames in a penetrating mode, and a plurality of first receding openings matched with the second receding openings are formed in the rotating plate. A first telescopic device used for pushing the lower movable mold to move upwards is fixedly installed at the bottom in the fixing base, and a fixing frame is fixedly installed on one side of the fixing base. According to the utility model, the semiconductor chip in the lower movable die is taken and placed in the sintering process, so that the waiting time of the semiconductor chip in the sintering process is shortened, and the production efficiency of the semiconductor chip is improved.

The utility model provides a kind of wafer bearing device and thin film deposition equipment, wafer bearing device includes heating disc and bearing ring, bearing ring is sleeved in heating disc outside, and with heating disc upper and lower sliding connection, the height of bearing ring is greater than the height of heating disc, the upper surface of bearing ring is equipped with multiple interval arrangement's support gasket, support gasket is set by the upper surface of bearing ring upward protruding, for supporting wafer;Wherein, drive heating disc to move to its bottom and the top end of bearing ring when clamping, heating disc upper surface is higher or equal to support gasket upper surface.This application is by setting bearing ring in heating disc outside, and support gasket is equipped on bearing ring, support gasket is supported to wafer, to optimize the layout of heating wire in heating disc, simple structure, and improve the uniformity of heating disc temperature;While bearing ring has greater weight, so that bearing ring and heating disc are more smooth in movement, improve the stability of wafer bearing device when operating and production efficiency when semiconductor production.

The application provides a semiconductor processing equipment fault diagnosis method, an electronic device and a readable storage medium, and the method comprises the following steps: collecting current operation data of a semiconductor processing equipment to be diagnosed; inputting the current operation data of the semiconductor processing equipment to be diagnosed into a pre-trained fault prediction model to obtain a fault module type prediction result and a fault time prediction result of the semiconductor processing equipment to be diagnosed; and according to the fault module type prediction result of the semiconductor processing equipment to be diagnosed, using a pre-created fault diagnosis model of a corresponding module to diagnose the current operation data to obtain a fault cause diagnosis result of the semiconductor processing equipment to be diagnosed. The application can predict the fault module type, the fault time and the fault cause of the semiconductor processing equipment in advance, so that the equipment maintenance personnel can plan the countermeasures in advance, thereby reducing the loss in the semiconductor production process.

The coating method of the chamber for the deposition process according to the present invention comprises: a step a for forming a lower coating layer by performing an arc spraying process on an object to be coated using an aluminum wire; and a step b of forming an upper coating layer by subjecting a metal compound powder to a physical vapor deposition process on the lower coating layer formed in the step a, the metal compound in the step b has the same component as the PVD process by-product, so that the yield of semiconductor production can be increased by prolonging the maintenance and management period of the components in the chamber.

The utility model relates to the technical field of semiconductor production equipment, in particular to a material pouring box device capable of automatically counting products, which comprises a base, an empty material box and a full material box which are communicated with each other are arranged at the top of the base, and the empty material box and the full material box are adjacently connected side by side and are communicated through a flow guide channel; the material pushing mechanism comprises a material pushing air cylinder fixed to the base and a material pushing plate connected to the tail end of a piston rod of the material pushing air cylinder, and the section shape of the material pushing plate is matched with the cross section of the cavity of the full material box; the detection control module is vertically fixed to the side, away from the full material box, of the empty material box and extends towards the inlet direction of the flow guide channel. Through PLC control, sensor detection and material pushing mechanism linkage, automatic material pouring and accurate counting are achieved, buffer protection and traceable data export functions are matched, the problems of material leakage, counting errors and low efficiency of manual material pouring are solved, and the automation degree, the product protection performance and the quality traceability of the semiconductor production process are improved.

The utility model discloses a polishing device for semiconductor production, which relates to the technical field of wafer processing and comprises a base, a support is mounted at the upper end of the base, a polishing mechanism is arranged at the lower end of the support and comprises an electric push rod mounted at the lower end of the support, and a servo motor is mounted at the end of a piston rod of the electric push rod. The end part of an output shaft of the servo motor is fixedly connected with an upper tripod; the lower end of the upper tripod is connected with a lower tripod; a driving gear is arranged in the middle of the lower end of the lower tripod, a connecting shaft connected with the lower tripod through a bearing is fixedly connected to the driving gear, and a worm gear is fixedly connected to the upper end of the connecting shaft; the driving gear is adopted to drive the driven gear to rotate so as to drive the linkage rod to rotate, and the caliber between the polishing rollers is adjusted, so that the polishing requirements of wafers with different outer diameters are met; and automatic uniform polishing is adopted, the polishing uniformity of the corners of the wafer is guaranteed, the polishing efficiency of the semiconductor wafer is high, and practicability is achieved.

The utility model provides an integrated base for semiconductor production, which comprises a base body, the base body comprises a single body I, a single body II and a single body III, an interface board D, an interface board E and an interface board G are arranged on the single body I, an interface board A, an interface board B, an interface board F and an interface board H are arranged on the single body II, and an interface board C is arranged on the single body III. According to the utility model, pipeline installation is modularized, various installation accessories are intensively designed on the interface board, the interface board is installed on the anti-micro-vibration base, the anti-micro-vibration base and pipeline installation are integrated, the pipelines are directly connected through accessory interfaces on the interface board during installation, the installation is rapid and convenient, and the construction period is shortened; and the interface board and all the accessories are connected in a bolting mode, so that mounting and dismounting are convenient, the universality is high, and dismounting and maintenance are convenient.

The utility model provides a self-alignment brazing mold for a ceramic packaging shell and a PIN needle and semiconductor production equipment, which belong to the field of semiconductor manufacturing and comprise an upper mold and a lower mold, a ceramic shell and a pin-shaped piece are arranged on the lower mold, and the pin-shaped piece is arranged on the upper mold. The centering inclined plane formed by the recess of the upper die can center and position the ceramic shell in the downward moving process, and the first positioning plane on the periphery of the upper die can be in guide fit with the second positioning plane on the inner side of the lower die, so that the upper die is prevented from deviating in the vertical moving process. Compared with the prior art, the positioning die for welding the ceramic shell is improved, so that the technical problem that the positioning precision and efficiency of the PIN and the ceramic shell are poor in the welding process of the existing semiconductor device is solved.

The utility model relates to the technical field of semiconductor production, in particular to semiconductor laminating production equipment which comprises a laminating machine body, and a rotating assembly is arranged on the inner side of the laminating machine body. The discharging assembly is fixedly installed on the lower surface in the overlying machine body, the detection assembly is fixedly installed on the upper surface in the overlying machine body, the detection assembly comprises a supporting frame, a limiting plate is slidably connected into a sliding rail, and a pressure sensor is fixedly installed at one end of the upper surface of the limiting plate in an embedded mode. According to the utility model, the flange above the upper pressure plate abuts against the pressure sensor to detect the pressing pressure, and meanwhile, when the pressure is relatively large, the limiting plate abuts against the lower part of the flange to limit the maximum downward moving distance of the upper pressure plate, so that the damage to materials due to overlarge pressure caused by the reduction of the precision of the hydraulic cylinder is avoided, and the pressing precision of the materials is improved; and the lower pressing disc is turned over after moving downwards, and the pressed materials are turned over towards one side, so that the pressed materials can be discharged more smoothly.

The invention discloses a crown block track surface cleaning device in a semiconductor workshop, which comprises a bottom plate, a frame is arranged on the bottom plate, and a first negative pressure fan and a second negative pressure fan are arranged in the frame; a negative-pressure air draft longitudinal cylinder extending upwards is arranged in the frame, and the bottom end of the negative-pressure air draft longitudinal cylinder is connected with a first negative-pressure fan and a second negative-pressure fan through pipelines in a communicating mode. A negative pressure air draft transverse barrel is arranged at the top end of the negative pressure air draft longitudinal barrel, the negative pressure air draft transverse barrel is vertically arranged at the top end of the negative pressure air draft longitudinal barrel, and the negative pressure air draft transverse barrel is communicated and connected with the negative pressure air draft longitudinal barrel; the two ends of the negative-pressure air draft transverse barrel are provided with dust removal modules which protrude downwards and are matched and symmetrical, and each dust removal module comprises a dust removal head cavity. Through non-contact suspended positive and negative air passage cleaning, efficient and automatic cleaning of the crown block rail surface of the semiconductor workshop is achieved, and the cleanliness of the semiconductor production environment is effectively improved.

The invention discloses a semiconductor production business report calculation method, system and device and a medium, and the method comprises the steps: receiving a report calculation request defined by a user through a real-time dispatching system platform, wherein the report calculation request comprises a data query mode and calculation logic of an output index; deploying a plurality of calculation service instances based on evaluation of report data scale and calculation complexity; splitting the report calculation request into a plurality of sub-requests, and distributing the sub-requests to each calculation service instance through a load balancing mechanism; in each calculation service instance, output indexes are calculated in parallel by adopting a memory calculation mode, including preloading dependent data to a memory when a system is started, and a parallel architecture is adopted to calculate a plurality of indexes at the same time; and the calculation results of the calculation service instances are inserted into the same data table of the database management system, so that uniform output and integrity of data are ensured. According to the method, the problems of too long time consumption and performance bottleneck of complex report calculation are effectively solved.

The invention belongs to the technical field of semiconductor production, and discloses a cover tape replacement assembly for a marking and testing all-in-one machine, and the assembly comprises a housing, and also comprises a support which is fixedly connected to the outer wall of the top end of the housing, and the outer wall of the support is fixedly connected with a motor; the mounting roller is arranged on the outer wall of the support through a connecting mechanism, and a separating mechanism is arranged on the outer wall of the mounting roller; the baffle is arranged on the outer wall of the mounting roller, and an adjusting mechanism is arranged on the outer wall of the baffle; wherein the connecting mechanism comprises a rotating shaft, and the outer wall of the rotating shaft is slidably connected with a moving ring; through cooperation of the sliding blocks, the moving rings and other structures, the positions of the sliding blocks can be adjusted, the sliding blocks correspond to bolt holes in the mounting rollers in position, then after the mounting rollers of different sizes and specifications are replaced, the problem that mounting cannot be achieved due to possible changes of the positions of threaded holes is solved, and adaptability is high.

The utility model relates to technical field of semiconductor production discloses a kind of crystal bar end cap automatic alignment device, material rotating subassembly, including material rotating disc and material rotating drive, material rotating drive is rotatively connected with material rotating disc, and material rotating disc is equipped with accommodating groove;Feeding mechanism, including feeding clamp jaw;Discharging mechanism, including discharging clamp jaw;Lower end cap assembly mechanism, including first base and first push drive, first push drive is connected in first base, and first base is equipped with first through-hole and lower end cap feeding area, and lower end cap feeding area is located between first through-hole and first push drive;Upper end cap assembly mechanism, including second base and second push drive, second push drive is connected in second base, and second base is equipped with second through-hole and upper end cap feeding area, and upper end cap feeding area is located between second through-hole and second push drive.The utility model's crystal bar end cap automatic alignment device improves the alignment accuracy of end cap and crystal bar, improves yield and assembly efficiency.

The invention provides a semiconductor manufacturing equipment scheduling method and device, electronic equipment and a storage medium, and relates to the technical field of semiconductors. The method comprises the following steps: acquiring a machine scheduling request; determining a next process and a plurality of available candidate machines meeting the requirements of the next process according to the wafer batch identifier and the current process identifier; according to the machine identifier of the current process, multi-dimensional scheduling information of each available candidate machine is obtained, and the multi-dimensional scheduling information at least comprises distance information, state information and load information; and according to the multi-dimensional scheduling information of each candidate machine, determining a target machine in the plurality of available candidate machines, and executing the next process through the target machine. According to the method, the scheduling score of each candidate machine is comprehensively evaluated by fusing three key dimensions including distance, state and load, accurate modeling and quick response to a complex dynamic environment in a semiconductor production line are realized, the production cycle is remarkably shortened, and the equipment utilization rate is improved.

The invention relates to a semiconductor defect data augmentation method, device and equipment, a medium and a program product. The method comprises the following steps: acquiring real-time defect images and classification labels corresponding to the defect images from a semiconductor production system; selecting each augmentation strategy corresponding to each classification label; and generating augmented defect images consistent with the distribution of the defect images based on the augmentation strategies. By adopting the method, the quality of the augmented defect image can be improved.

The application relates to the technical field of artificial intelligence and semiconductor manufacturing process monitoring, and particularly discloses a semiconductor valve analysis system based on single-Q table reinforcement learning and multi-head attention, which collects parameters through a multi-dimensional perception front end, constructs a state vector by using a heterogeneous data preprocessing module, generates global representation by a multi-head attention feature fusion engine, and outputs optimal instructions by combining a physical mechanism model to limit an action space through a physical constraint guided single-Q table reinforcement learning machine, and finally dynamically updates a value matrix through a closed-loop execution and monitoring feedback module. The application can mine deep feature correlations, ensure that decisions conform to physical laws, significantly improve learning efficiency and control stability, and guarantee semiconductor production safety.

The utility model discloses a pin correction device, and belongs to the field of semiconductor production equipment. The pin correction device comprises a positioning mechanism and a correction mechanism, the correction mechanism is arranged on one side of the positioning mechanism, the correction mechanism comprises an eccentric wheel motor and a mold, the mold is installed on the eccentric wheel motor, the positioning mechanism is used for fixing a semiconductor, a pin of the semiconductor is located on one side of the positioning mechanism, and the mold is arranged on one side of the positioning mechanism. And the eccentric wheel motor is used for driving the mold to move in a reciprocating manner, so that the moving direction of the mold is matched with the correction direction of the semiconductor pin. According to the utility model, the die can correct the semiconductor pin at a high speed, and compared with a pin correction device using a lead screw mechanism in the prior art, the pin correction device using the eccentric wheel motor has the advantages that the size of the pin correction device is reduced, and the problem that the size of the pin correction device using the lead screw mechanism in the prior art is too large is solved.

The utility model provides a kind of high pressure electron diffraction screen and deposition equipment for RHEED, belong to semiconductor production equipment technical field, including window subassembly, camera subassembly, support subassembly, fluorescence screen, fluorescence screen is set in the side of support subassembly away from window subassembly, can shorten the distance between fluorescence screen and sample, effectively improve measurement accuracy, to solve the deficiency of traditional structure. Wherein window subassembly can be defined on vacuum window in coating cavity, so that there is no obstruction between camera subassembly and fluorescence screen, while not affecting the sealing of coating cavity.

The utility model provides a magnetic target distance adjusting structure and coating equipment, which belongs to the technical field of semiconductor production equipment and comprises a first mounting part, a Z-axis driving component, a second mounting part, a Y-axis driving component, a magnetron and an X-axis driving component. And at least one of a position between the Z-axis driving assembly and the first mounting part, a position between the Y-axis driving assembly and the second mounting part, and a position between the X-axis driving assembly and the magnetron is in floating connection. When the material of the sputtering surface is reduced and the distance between the magnetron and the sputtering surface of the target material is changed, the magnetron can be controlled to move upwards by utilizing the Z-axis driving assembly, so that the distance between the magnetron and the sputtering surface is adjusted, the distance is always kept consistent along with the prolonging of the processing time, and the coating consistency is further ensured. Wherein floating connection is adopted in the X-axis direction, the Y-axis direction and the Z-axis direction, so that the smoothness of movement adjustment is improved, and normal implementation of an adjustment mechanism is ensured.

The invention relates to the technical field of single crystal furnaces, in particular to a semiconductor production single crystal furnace capable of automatically cleaning waste liquid, which comprises a single crystal furnace main body, a driving assembly and a discharge valve group. A waste discharge valve port is formed in the bottom of the single crystal furnace main body, and a rotational flow valve in the discharge valve group is slidably sleeved on the inner side of the waste discharge valve port and is communicated with the liquid discharge cabin through a liquid discharge pipe to form a waste liquid discharge channel. The driving assembly comprises a motor, a key shaft rod, an output shaft rod and a magnetic control ring, and the magnetic control ring generates magnetic repulsive force through a permanent magnet ring on the output shaft rod after being powered on. A rotational flow channel is arranged in the rotational flow valve, and an axial flow rotary vane is arranged on the inner side of the liquid discharge pipe, so that rotational flow and axial flow composite conveying is formed in the waste liquid discharge process, and active suction and stable discharge of the waste liquid at the bottom of the single crystal furnace are realized. By means of the structure, automatic opening, continuous conveying and reliable closing in the waste liquid discharging process can be achieved, waste liquid retention and blockage are avoided, and the automation level and operation reliability of single crystal furnace waste liquid treatment are improved.

The utility model discloses a semiconductor turnover device, and belongs to the field of semiconductor production equipment. The turnover device comprises a linear power mechanism, a rotary power mechanism, a telescopic shaft and a clamping jaw, the telescopic shaft is rotatably installed on the linear power mechanism, the rotary power mechanism is arranged on the telescopic shaft in a sleeving mode, the clamping jaw is installed on the telescopic shaft, and the linear power mechanism is used for driving the telescopic shaft to linearly move, so that the telescopic shaft drives the clamping jaw to linearly move. The rotary power mechanism is used for driving the telescopic shaft to rotate, so that the telescopic shaft drives the clamping jaw to rotate, and the clamping jaw is used for clamping semiconductor products. According to the utility model, the clamping jaw can take materials from the material box and then turn over the products, and the material taking and turning work of the semiconductor products can be completed only by arranging the turning device on one side of the material box, so that the problem that the air cylinder, the moving mechanism and the turning mechanism need to be respectively arranged on two sides of the material box to work cooperatively in the prior art is solved; and the space utilization rate is low.

The invention relates to the field of wafer code reading, and provides a wafer code reading method and system based on intelligent enhancement and dynamic optimization, and the method comprises the steps: firstly obtaining a wafer character image, and carrying out the image quality evaluation and image preprocessing; then, the preprocessed wafer character image is input into a deep transfer learning character large model for wafer character recognition, a wafer character recognition result and recognition confidence are obtained, and the model structure of the deep transfer learning character large model comprises a double-branch convolutional neural network and a Transform fusion framework; an incremental learning mechanism is introduced for abnormal sample learning; and finally, according to the wafer character recognition result and the recognition confidence coefficient, performing verification through a checksum algorithm, and judging whether a wafer code is directly obtained or a wafer character image corresponding to the wafer character recognition result is marked as an abnormal sample. According to the method, the accuracy, the adaptive capability and the engineering availability of a wafer code reading system in a semiconductor production environment can be remarkably improved.

The invention relates to the technical field of semiconductor production and manufacturing, in particular to a switching circuit for a semiconductor miniaturized quick-response pressure switch and the pressure switch, and the switching circuit comprises a power supply circuit, a sensor power supply circuit, a signal processing circuit, a comparison circuit and an indication and output circuit which are electrically connected in sequence. The power supply circuit is used for receiving an external power supply and converting the external power supply into power supply voltage required by the whole circuit system and the sensor; and the sensor power supply circuit is used for receiving the voltage output by the power supply circuit and adjusting the voltage according to the power supply requirement of the sensor so as to supply power to the sensor. The problems that a traditional pressure switch is large in size, slow in response, high in power consumption, complex in debugging and poor in adaptability are solved, and the pressure sensor has the advantages of being small in size, fast in response, low in power consumption, convenient and fast to debug and wide in adaptability and can be widely applied to semiconductor production and pressure monitoring of related industrial scenes.

The utility model relates to an automatic anti-falling device, which belongs to the field of semiconductor production equipment and comprises a fixed frame, a movable plate is arranged on one side of the fixed frame, an air cylinder is connected onto the fixed frame, a piston end of the air cylinder is fixedly connected with the movable plate, and the movable plate is controlled by the air cylinder to move towards or away from the fixed frame. A first spring is arranged between the movable plate and the fixed frame, the two ends of the first spring are connected with the fixed frame and the movable plate respectively, the first spring is in a stretched state, a movable rod is movably arranged on the fixed frame in a penetrating mode, the movable rod is parallel to the moving direction of the movable plate, and one end of the movable rod is fixedly arranged on the movable plate. When an air source connected with the sealing cutter breaks down, the moving rod moves through the elastic acting force of the first spring, so that the supporting plate supports the sealing cutter, the sealing cutter is prevented from continuously descending to the position of a product to damage the product, and the anti-falling effect of the sealing cutter is achieved.