525 results about "Semiconductor production" patented technology

The invention relates to the technical field of semiconductor manufacturing quality control, in particular to a semiconductor anomaly detection method and system based on physical causal relationship modeling, and the method comprises the following steps: S1, obtaining multi-dimensional sensor data of a semiconductor production line, and building a sensor causal relationship model based on an etching process physical mechanism; s2, performing time sequence alignment, abnormal propagation modeling and root cause positioning along a causal relationship path; s3, adaptive intelligent decision making based on the graph attention network; according to the invention, by establishing a physical causal relationship model between sensors, time sequence alignment and anomaly detection driven by the causal relationship are realized, and adaptive intelligent decision and predictive feedback optimization of the graph attention network are combined. The technical problems that in the prior art, time sequence alignment precision is not high, abnormal detection lacks root cause analysis, and system decision is not intelligent enough are solved.

The utility model relates to a semiconductor wafer box transfer device which has high precision, high stability and high automation level and is suitable for wafer box transfer in the semiconductor production process. The device comprises a connection table arranged in a bottom area, the connection table is provided with a power assembly and a groove transmission structure which are used for lifting and transmitting a wafer box, and the periphery of the connection table is provided with an anti-vibration device made of a flexible material. And the crown block is positioned at the upper part of the device and moves along the guide system track so as to ensure smooth transfer of the wafer box among different areas. A manipulator is arranged on one side of the connection table, the tail end of the manipulator is provided with a grabbing device of an open type U-shaped structure, and a positioning column is arranged to be matched with a positioning hole in the bottom of the wafer box, so that the positioning accuracy of the wafer box is guaranteed. An automatic induction device is installed above the grabbing device and cooperates with an inductor to monitor the position of the wafer box in real time. The power assembly adopts a belt transmission system to ensure stable transmission of the wafer box.

The invention discloses a semiconductor production material carrying scheduling method, device and equipment and a readable storage medium, and relates to the field of production scheduling. According to the method, all the sub-tasks of the material carrying task are used as the minimum task sorting units to be sorted, all possible task execution sequences are obtained, and the optimal execution sequence is screened out from all the possible task execution sequences with the purpose of finding the shortest path. According to the method, the material carrying task is more flexible to execute, the proportion of the no-load stroke of the AGV can be reduced, and the transportation efficiency of the AGV is improved.

The utility model discloses coating equipment for improving the uniformity of a magnetron sputtering film, and belongs to the technical field of semiconductor production equipment.The coating equipment comprises a substrate table, the substrate table is provided with a cooling channel and a cooling air hole, and a supporting part is arranged at the upper end of the substrate table in a protruding mode; the air hole plug is arranged on the substrate table in a lifting adjusting manner; and the base plate is placed on the supporting part. Opening and closing of the cooling air holes in the corresponding positions can be adjusted according to the temperature distribution condition of the substrate in the debugging stage, the cooling air holes are opened in the high-temperature area to be communicated with the cooling channel, cooling air is used for cooling, and when the cooling air is sent out from the cooling air holes, the air uniformizing space can be used for uniformizing the cooling air in a small range, so that the cooling efficiency is improved. Regional cooling is achieved, the purpose of temperature regulation and control is achieved, the temperature of the surface of the substrate is uniform and consistent, and then the uniformity of coating is improved.

The invention provides a semiconductor SPC system data multi-thread rendering display device and method, and belongs to the field of semiconductor manufacturing, and the method specifically comprises the steps: obtaining sampling point data; displaying an interactive interface of the interactive operation to enable a user to select to-be-displayed interface content, and determining a rendering task according to the business operation corresponding to the selected interface content; performing service calculation on the sampling point data by adopting a multi-task concurrent mode, and outputting a task processing result; based on the data volume of the sampling point data and the business operation corresponding to the selected interface content, determining a rendering mode of the task processing result, and generating a to-be-rendered result; decomposing the rendering task into a plurality of stage tasks of framing rendering based on the to-be-rendered result; and performing framing rendering on a task processing result according to the stage task, and displaying a rendered page. By means of the processing scheme, the mass semiconductor production data can be dynamically rendered, and efficient self-adaptive display of the mass semiconductor monitoring data is achieved.

The utility model provides a plasma cleaning device, and belongs to the technical field of semiconductor production equipment, the plasma cleaning device comprises a cavity, and a chamber is arranged in the cavity; the cover plate covers the upper end of the cavity; the remote plasma source is connected to the central position of the protruding part; the gas blocking part is arranged in the conical cavity; the first gas homogenizing plate is arranged below the gas blocking part; the second gas uniformizing plate is arranged below the first gas uniformizing plate; and a substrate table. The cover plate and the gas blocking part can uniformly disperse plasma gas fed by a remote plasma source into the cavity, then the plasma gas is further homogenized through the first gas homogenizing plate to ensure the gas uniformity of a substrate area, and meanwhile, the vacuum mechanism is generally connected to the bottom of the cavity, so that the gas is downwards pumped through the second gas homogenizing plate during gas pumping, and the gas uniformity of the substrate area is ensured. The gas uniformity in the chamber can be effectively ensured, so that the etching uniformity and the etching rate are improved.

The invention discloses a BUB bubble conveying system for a semiconductor production process and a control method, and belongs to the technical field of bubble conveying control, and the method specifically comprises the steps: in a fluid conveying pipeline of the semiconductor production process, generating a bubble group through a bubble generator, and adjusting the bubble generation frequency and volume distribution based on a liquid impedance feedback signal, the flow velocity, pressure and bubble distribution parameters of process liquid are collected, a pre-trained flow field prediction model is used for analyzing the bubble gathering trend, when the transmission retardation risk is detected, the opening degree of a micro valve is automatically adjusted, a bubble path is shunted, and a micro-pulse air pressure signal is applied to the throttling section of the semiconductor production process fluid conveying pipeline. Dynamically matching the bubble rupture phase with the fluid viscosity, and switching to a reverse bubbling mode to perform self-cleaning on the pipeline when detecting that the bubble residue exceeds a threshold value; linkage regulation and control of the multi-node micro valve are achieved, and the uniformity, repeatability and safety of fluid conveying can be kept in long-term operation.

The invention belongs to the technical field of pipeline production, and particularly relates to a precise pipeline surface treatment device for semiconductor production. A pair of supporting frames are symmetrically and fixedly connected to the top of the workbench. A placing groove is formed in the top of the supporting frame; the top of the workbench is fixedly connected with a first electric sliding rail. A first electric sliding block is slidably connected to the middle of the first electric sliding rail. The top of the first electric sliding block is fixedly connected with a base. A first supporting rod is fixedly connected to the top of the base; the end part of the first supporting rod is fixedly connected with a first hollow lantern ring; a plurality of spray heads are fixedly connected to the inner side wall of the first hollow lantern ring; the spray head and the first hollow lantern ring are communicated with each other and are arranged circumferentially; a water tank is fixedly connected to the top of the base; before the pipeline is polished, the pipeline is fully cleaned, impurities on the surface of the pipeline are removed, and the subsequent machining quality of the pipeline is improved.

The invention relates to the technical field of artificial intelligence and semiconductor manufacturing process monitoring, and particularly discloses a semiconductor valve analysis system integrating single Q table reinforcement learning and multi-head attention. Global representation is generated through a multi-head attention feature fusion engine, a single Q table reinforcement learning machine guided by physical constraints is combined with a physical mechanism model to limit an action space so as to output an optimal instruction, and finally, a value matrix is dynamically updated through a closed-loop execution and monitoring feedback module. According to the invention, deep feature association can be mined, decision is ensured to accord with physical rules, learning efficiency and control stability are significantly improved, and semiconductor production safety is guaranteed.

The invention discloses a miniaturized monolithic integration method of a geomagnetic sensor and an MCU (Microprogrammed Control Unit). The method comprises the following steps of (1) low-temperature CMOS circuit layer preparation, (2) TSV three-dimensional interconnection structure processing, (3) magnetic-core-free planar coil manufacturing, (4) low-temperature electromagnetic shielding layer integration and (5) structure release and vacuum packaging. Process conflicts and hysteresis errors introduced by ferromagnetic materials are eliminated through a non-magnetic-core design, a TSV (through silicon via) three-dimensional interconnection technology is adopted to replace traditional plane wiring, the size of the module is compressed to the millimeter level, meanwhile, a broadband electromagnetic shielding layer is integrated, and it is ensured that in a weak magnetic field (lt; and the signal-to-noise ratio in a detection scene is greater than or equal to 30dB. The low-temperature compatibility with a CMOS (complementary metal oxide semiconductor) process can be realized, the mass production feasibility needs to adapt to a standard semiconductor production line, the cost of a single chip is reduced by more than 30%, and the method is suitable for navigation equipment, consumer electronics and industrial sensing systems.

The invention relates to the technical field of semiconductor material production, in particular to a single crystal furnace for silicon carbide semiconductor production, which comprises a furnace body, a pressure relief mechanism is arranged at the top end in the furnace body, the pressure relief mechanism comprises a cylinder penetrating through the top end of the furnace body, a piston rod slides in the cylinder, and a push disc is arranged at the top end of the piston rod. When the air pressure in the furnace exceeds the pre-tightening force of the spring B, the piston rod drives the push disc to enable the plug to be separated from the air suction pipe, safe pressure relief and crystal growth environment stabilization are achieved, the push disc moves upwards to be in linkage with the rack A and the valve rod, the opening degree of the ball valve is adjusted, the water cooling flow is controlled according to needs, energy consumption is reduced, and the growth rate is increased; pulse water flow is generated through extrusion of the cam, heat exchange is enhanced, meanwhile, hydraulic pressure changes caused by extrusion of the water cooling pipe enable fan blades to rotate through gear transmission to generate negative pressure, pressure relief is accelerated, and the adverse effect of crystals with abnormal pressure and temperature is reduced.

A gallium boat, a source filling system, and a source filling method are disclosed, belonging to the field of semiconductor manufacturing. The technical solution is as follows: A gallium boat includes a boat body, with a filling port fixedly provided on the upper part of the boat body. A sealing cap is detachably installed on the filling port. A conical channel is provided inside the filling port. The sealing cap includes a cap body for covering and shielding the filling port. A conical plug is fixedly provided on the cap body and inserted into the conical channel. The outer wall of the plug and the side wall of the conical channel are both frosted. Through the cooperation of the cap body, the plug, and the filling port, multi-stage sealing is achieved, extending the path of communication between the filling port and the outside, improving the sealing effect. The outer wall of the plug and the inner wall of the filling port are fitted together by the frosted structure, resulting in a good sealing effect and solving the problem of high processing difficulty.

The invention relates to the technical field of semiconductor data analysis, in particular to a semiconductor root cause tracing method and system and a program product, and the method comprises the steps: obtaining semiconductor production line data which at least comprises: (1) information of a plurality of pieces of processing equipment experienced by a plurality of semiconductor products, (2) process parameters adopted when the semiconductor product goes through at least one processing device, and / or category information of the semiconductor product, and (3) measured values, a data analysis scheme is called for semiconductor production line data, and the data analysis scheme comprises a fault prediction algorithm; preprocessing the semiconductor production line data according to the data analysis scheme to generate a preprocessing result; the preprocessing result and the corresponding semiconductor production line data are input into a preset big data platform, and the big data platform correspondingly outputs an analysis result. According to the big data traceability analysis method provided by the invention, the data analysis efficiency can be improved, and meanwhile, the requirement on the computing power in the analysis process is reduced, so that the implementation cost is reduced.

The invention relates to the technical field of semiconductor data analysis, in particular to a root cause analysis method and system and a program product, and the method comprises the steps: obtaining semiconductor production line data which at least comprises: (1) information of a plurality of pieces of processing equipment experienced by a plurality of semiconductor products, (2) process parameters adopted when the semiconductor product goes through at least one processing device, and / or category information of the semiconductor product, and (3) measured values, a data analysis scheme is called for semiconductor production line data, and the data analysis scheme comprises a fault prediction algorithm; preprocessing the semiconductor production line data according to the data analysis scheme to generate a preprocessing result; the preprocessing result and the corresponding semiconductor production line data are input into a preset big data platform, and the big data platform correspondingly outputs an analysis result. According to the big data traceability analysis method provided by the invention, the data analysis efficiency can be improved, and meanwhile, the requirement on the computing power in the analysis process is reduced, so that the implementation cost is reduced.

The application discloses a lead welding device for semiconductor packaging and relates to the technical field of semiconductor production, which comprises a connecting seat, one end of which is fixedly connected to an external driving device, the middle part of the other end of the connecting seat is provided with a matching hole, a first transmission shaft is matched with the matching hole through a bearing, and the middle part of the first transmission shaft is provided with a first lead hole; a lead pulling assembly is distributed at the wall surface of the connecting seat close to the top side of the first transmission shaft and the bottom of the first transmission shaft; a driving assembly is arranged at one side of the bottom end of the connecting seat, the output end of the driving assembly is fixedly connected with an adjusting structure, the adjusting structure is fixedly connected with a welding head, the middle part of the welding head is provided with a second lead hole; a position-stopping assembly is arranged at the other side of the bottom end of the connecting seat, the position-stopping assembly can realize automatic transmission of the lead, can control the length of the lead pulled out from the bottom end of the welding head, and can ensure that the length of the lead pulled out from the welding head is unchanged when the welding head welds the lead.

The invention discloses automatic crystal taking equipment for semiconductor production and processing and a crystal taking method thereof, and belongs to the technical field of semiconductor production. The device comprises a workbench, the upper side of the workbench is fixedly connected with a fixing base, the upper side of the workbench is further fixedly connected with a monitoring assembly, the upper side of the workbench is further fixedly connected with a mechanical arm, the end of the mechanical arm is fixedly connected with an inner threaded cylinder, and the end of the inner threaded cylinder is in threaded connection with a vacuum suction nozzle; a hydraulic cylinder is fixedly connected into the inner threaded barrel, and a piston plate is fixedly connected to the lower side of the hydraulic cylinder. When the wafer taking operation needs to be carried out, firstly, the cut wafer which is still attached to the cutting adhesive film is annularly placed on the workbench, then, the mechanical arm, the vacuum suction nozzle and the like are utilized, a good chip is transferred to a proper working position, and then the wafer taking operation is completed.

The utility model discloses a rectifier bridge turnover pipe plugging device and relates to the technical field of semiconductor production equipment. Comprising a blanking rail, a bearing seat and a clamping jaw cylinder which are obliquely arranged at an outlet of a pipe plug circular vibrating disc. When the pipe plug falls to the sinking position of the bearing seat, generally, after a material sensor corresponding to the side portion senses that the pipe plug falls, a piston rod of a feeding linear driving mechanism stretches out, and the pipe plug is pushed to the front side of a clamping jaw of a clamping jaw air cylinder; the clamping jaw air cylinder is pushed to slide on the second guide rail through the horizontally-arranged motor air cylinder, and after the tail of the pipe plug is clamped, the bearing base returns to the original position.

The disclosure provides a semiconductor structure defect monitoring method and device, and relates to the technical field of semiconductors. The semiconductor structure defect monitoring method comprises the following steps: acquiring a overlay accuracy offset of a capacitor column and a support structure; acquiring an etching opening size of an etching film layer; determining a corresponding relationship between the overlay accuracy offset and the etching opening size; and monitoring a structure defect in a semiconductor production process based on the corresponding relationship. The technical problem of poor defect monitoring effect of the capacitor is solved, and the technical effect of improving the defect monitoring effect of the capacitor is achieved.

The invention relates to the field of semiconductor production, in particular to high-purity semi-insulating silicon carbide heat treatment equipment which comprises a base, and a heat treatment mechanism and a lifting mechanism are arranged on the base. A plurality of heating modules are arranged in the heating cylinder, the lifting mechanism comprises a supporting frame, connecting plates are symmetrically arranged on the supporting frame, the connecting plates can move up and down along the supporting frame, and the connecting plates are fixedly connected to the upper end face of the end cover; lifting rods are symmetrically arranged on the lower surface of the end cover, a supporting plate is fixedly connected to the end parts of the lifting rods, and a crucible is placed on the supporting plate; a structure capable of completely placing materials in a stable environment for heat treatment is arranged, namely, a crucible is arranged in a heating cylinder with a heat preservation layer, the quality of the materials after heat treatment can be guaranteed, a plurality of probes of a temperature monitoring instrument are arranged, the heat treatment temperature is controlled, then a lifting mechanism is arranged, the crucible is arranged on an end cover, and the heat treatment temperature is controlled. The crucible can move along with the end cover, and feeding and discharging operation of the crucible and materials is facilitated.

The utility model relates to the technical field of semiconductor production equipment, and discloses a semiconductor chip production mold, which comprises a plurality of lower movable molds, an upper movable mold and a middle fixed mold which are matched with each other, and further comprises a rotating plate for driving the plurality of lower movable molds to rotate, a driving motor used for driving the rotating plate to rotate is fixedly installed in the fixing base, a plurality of fixing mold frames used for positioning the lower movable mold are arranged on the upper portion of the rotating plate, second receding openings are formed in the lower portions of the fixing mold frames in a penetrating mode, and a plurality of first receding openings matched with the second receding openings are formed in the rotating plate. A first telescopic device used for pushing the lower movable mold to move upwards is fixedly installed at the bottom in the fixing base, and a fixing frame is fixedly installed on one side of the fixing base. According to the utility model, the semiconductor chip in the lower movable die is taken and placed in the sintering process, so that the waiting time of the semiconductor chip in the sintering process is shortened, and the production efficiency of the semiconductor chip is improved.

The utility model provides a kind of wafer bearing device and thin film deposition equipment, wafer bearing device includes heating disc and bearing ring, bearing ring is sleeved in heating disc outside, and with heating disc upper and lower sliding connection, the height of bearing ring is greater than the height of heating disc, the upper surface of bearing ring is equipped with multiple interval arrangement's support gasket, support gasket is set by the upper surface of bearing ring upward protruding, for supporting wafer;Wherein, drive heating disc to move to its bottom and the top end of bearing ring when clamping, heating disc upper surface is higher or equal to support gasket upper surface.This application is by setting bearing ring in heating disc outside, and support gasket is equipped on bearing ring, support gasket is supported to wafer, to optimize the layout of heating wire in heating disc, simple structure, and improve the uniformity of heating disc temperature;While bearing ring has greater weight, so that bearing ring and heating disc are more smooth in movement, improve the stability of wafer bearing device when operating and production efficiency when semiconductor production.

The utility model relates to the technical field of semiconductors, and discloses a semiconductor production processing electroplating device which comprises a cleaning assembly and a mixing assembly, the cleaning assembly is arranged above the mixing assembly, the cleaning assembly comprises an electroplating box, the lower end of the electroplating box is connected with fixed supporting legs, the upper end of the electroplating box is connected with a cleaning motor, and the cleaning motor is connected with the mixing assembly. The output end of the cleaning motor is fixedly connected with a threaded rod, and the threaded rod is connected with a fixing frame. According to the utility model, during electroplating, solutes such as various metal ions and the like are more uniformly distributed in a solution, so that the quality of a metal layer deposited on the surface of a semiconductor is more stable and uniform, and the performance and quality consistency of semiconductor products can be improved, thereby improving the electroplating efficiency, shortening the processing time, facilitating the replacement of the cleaning brush, and reducing the cost. The cleaning brush can be directly and manually pulled out without a tool, so that the time for replacing the cleaning brush is shortened, and the speed for replacing the cleaning brush is increased.

The utility model discloses a semiconductor packaging die demolding structure relates to semiconductor production processing technical field. The utility model discloses a plurality of ejection units of cooperation installation on the movable mould, and the output of ejection unit is after its end portion is supported on the fixed mould after stretching out, and ejection unit includes the inner sleeve and outer sleeve of mutual sealing cooperation, and the outer sleeve is fixedly installed to movable mould, and the end portion of inner sleeve is connected with the ejector block that is supported on the fixed mould after stretching out, and the spring is connected between inner sleeve and outer sleeve, the outer sleeve is fixed on a base plate, and the inlet and outlet hole is set up on the base plate, and the inlet and outlet hole are communicated air pump through pipeline. The utility model discloses the output of ejection unit is supported on the fixed mould, and the controllable demolding force is provided to cooperation pneumatic system, and improve demolding stability and product yield, and pneumatic auxiliary reduces mechanical wear and tear, prolongs the life of mould, and compact structure is convenient for integrated to the existing mould system.

The invention provides an EtherCAT slave station gateway for semiconductor temperature control equipment. The EtherCAT slave station gateway comprises a hardware layer and a software layer, wherein the hardware layer comprises an embedded semiconductor industrial equipment communication gateway, an integrated power supply module, a main control module, an Ethernet communication module, an EtherCAT slave station module and a 24V input and output port module; the software layer is an embedded software system with a layered architecture, is divided into an application layer, a protocol layer and a hardware abstraction layer, and realizes business logic processing, communication protocol conversion and software and hardware interaction decoupling. Through cooperative work of hardware and software, data transmission based on the EtherCAT protocol between the semiconductor production equipment host and the Chiller can be achieved, the real-time performance, accuracy and system maintainability of data transmission are improved, and the requirements of semiconductor production for high precision and high stability of temperature control are met.

The application provides a semiconductor processing equipment fault diagnosis method, an electronic device and a readable storage medium, and the method comprises the following steps: collecting current operation data of a semiconductor processing equipment to be diagnosed; inputting the current operation data of the semiconductor processing equipment to be diagnosed into a pre-trained fault prediction model to obtain a fault module type prediction result and a fault time prediction result of the semiconductor processing equipment to be diagnosed; and according to the fault module type prediction result of the semiconductor processing equipment to be diagnosed, using a pre-created fault diagnosis model of a corresponding module to diagnose the current operation data to obtain a fault cause diagnosis result of the semiconductor processing equipment to be diagnosed. The application can predict the fault module type, the fault time and the fault cause of the semiconductor processing equipment in advance, so that the equipment maintenance personnel can plan the countermeasures in advance, thereby reducing the loss in the semiconductor production process.

The invention is suitable for the technical field of semiconductor production, and provides dispensing equipment. The dispensing equipment comprises a workbench, a dispensing device and a product conveying device. The glue dispensing device comprises a plurality of glue dispensing working groups, each glue dispensing working group comprises a glue dispensing valve, a detection unit and an adjusting mechanism, the adjusting mechanisms are arranged on the workbench, and the glue dispensing valves and the detection units are arranged at the adjusting ends of the adjusting mechanisms. And during dispensing operation, the plurality of dispensing working groups can realize synchronous or asynchronous dispensing, so that the dispensing working efficiency is improved. And meanwhile, each dispensing working group is provided with an independent dispensing valve and a detection unit, so that the positions of the chips on the product can be identified in real time through the detection units while the dispensing working groups perform dispensing work, and the dispensing accuracy of the dispensing equipment is improved while the dispensing efficiency of the dispensing equipment is ensured.

The coating method of the chamber for the deposition process according to the present invention comprises: a step a for forming a lower coating layer by performing an arc spraying process on an object to be coated using an aluminum wire; and a step b of forming an upper coating layer by subjecting a metal compound powder to a physical vapor deposition process on the lower coating layer formed in the step a, the metal compound in the step b has the same component as the PVD process by-product, so that the yield of semiconductor production can be increased by prolonging the maintenance and management period of the components in the chamber.

The utility model relates to the technical field of semiconductor production equipment, in particular to a material pouring box device capable of automatically counting products, which comprises a base, an empty material box and a full material box which are communicated with each other are arranged at the top of the base, and the empty material box and the full material box are adjacently connected side by side and are communicated through a flow guide channel; the material pushing mechanism comprises a material pushing air cylinder fixed to the base and a material pushing plate connected to the tail end of a piston rod of the material pushing air cylinder, and the section shape of the material pushing plate is matched with the cross section of the cavity of the full material box; the detection control module is vertically fixed to the side, away from the full material box, of the empty material box and extends towards the inlet direction of the flow guide channel. Through PLC control, sensor detection and material pushing mechanism linkage, automatic material pouring and accurate counting are achieved, buffer protection and traceable data export functions are matched, the problems of material leakage, counting errors and low efficiency of manual material pouring are solved, and the automation degree, the product protection performance and the quality traceability of the semiconductor production process are improved.

The utility model discloses a polishing device for semiconductor production, which relates to the technical field of wafer processing and comprises a base, a support is mounted at the upper end of the base, a polishing mechanism is arranged at the lower end of the support and comprises an electric push rod mounted at the lower end of the support, and a servo motor is mounted at the end of a piston rod of the electric push rod. The end part of an output shaft of the servo motor is fixedly connected with an upper tripod; the lower end of the upper tripod is connected with a lower tripod; a driving gear is arranged in the middle of the lower end of the lower tripod, a connecting shaft connected with the lower tripod through a bearing is fixedly connected to the driving gear, and a worm gear is fixedly connected to the upper end of the connecting shaft; the driving gear is adopted to drive the driven gear to rotate so as to drive the linkage rod to rotate, and the caliber between the polishing rollers is adjusted, so that the polishing requirements of wafers with different outer diameters are met; and automatic uniform polishing is adopted, the polishing uniformity of the corners of the wafer is guaranteed, the polishing efficiency of the semiconductor wafer is high, and practicability is achieved.

The utility model provides an integrated base for semiconductor production, which comprises a base body, the base body comprises a single body I, a single body II and a single body III, an interface board D, an interface board E and an interface board G are arranged on the single body I, an interface board A, an interface board B, an interface board F and an interface board H are arranged on the single body II, and an interface board C is arranged on the single body III. According to the utility model, pipeline installation is modularized, various installation accessories are intensively designed on the interface board, the interface board is installed on the anti-micro-vibration base, the anti-micro-vibration base and pipeline installation are integrated, the pipelines are directly connected through accessory interfaces on the interface board during installation, the installation is rapid and convenient, and the construction period is shortened; and the interface board and all the accessories are connected in a bolting mode, so that mounting and dismounting are convenient, the universality is high, and dismounting and maintenance are convenient.