926 results about "Semiconductor production" patented technology

The invention relates to the technical field of semiconductor manufacturing quality control, in particular to a semiconductor anomaly detection method and system based on physical causal relationship modeling, and the method comprises the following steps: S1, obtaining multi-dimensional sensor data of a semiconductor production line, and building a sensor causal relationship model based on an etching process physical mechanism; s2, performing time sequence alignment, abnormal propagation modeling and root cause positioning along a causal relationship path; s3, adaptive intelligent decision making based on the graph attention network; according to the invention, by establishing a physical causal relationship model between sensors, time sequence alignment and anomaly detection driven by the causal relationship are realized, and adaptive intelligent decision and predictive feedback optimization of the graph attention network are combined. The technical problems that in the prior art, time sequence alignment precision is not high, abnormal detection lacks root cause analysis, and system decision is not intelligent enough are solved.

The utility model relates to a semiconductor wafer box transfer device which has high precision, high stability and high automation level and is suitable for wafer box transfer in the semiconductor production process. The device comprises a connection table arranged in a bottom area, the connection table is provided with a power assembly and a groove transmission structure which are used for lifting and transmitting a wafer box, and the periphery of the connection table is provided with an anti-vibration device made of a flexible material. And the crown block is positioned at the upper part of the device and moves along the guide system track so as to ensure smooth transfer of the wafer box among different areas. A manipulator is arranged on one side of the connection table, the tail end of the manipulator is provided with a grabbing device of an open type U-shaped structure, and a positioning column is arranged to be matched with a positioning hole in the bottom of the wafer box, so that the positioning accuracy of the wafer box is guaranteed. An automatic induction device is installed above the grabbing device and cooperates with an inductor to monitor the position of the wafer box in real time. The power assembly adopts a belt transmission system to ensure stable transmission of the wafer box.

The invention discloses a construction method and device for a secondary piping assembly process of a semiconductor production line, and the method comprises the steps: calling secondary piping assembly data in a pre-constructed database according to the primary input of a user; based on a preset secondary piping assembly assembling logic, giving a two-dimensional pipeline logic relation graph of two-dimensional graph connection of each secondary piping assembly, and forming an initial assembling process of the secondary piping of the semiconductor production line by combining a legend of a corresponding two-dimensional graph; based on the secondary input of the user, the initial assembly process of the secondary piping of the semiconductor production line is optimized, and the assembly process of the secondary piping of the semiconductor production line is constructed. According to the semiconductor production line secondary piping assembly process construction scheme provided by the invention, the standardization and automation degree of assembly process design are improved, the design efficiency is improved, the consistency and expandability of secondary piping assembly are enhanced, the accuracy and readability of the secondary piping assembly process are improved, and the pipeline construction cost of secondary piping is reduced.

A lead frame transferring and stacking device relates to the field of semiconductor production, and comprises a support frame, two ends of which are provided with support rings in the length direction; the turnover mechanism comprises two gear rings which are rotatably mounted on the inner sides of the supporting rings respectively, two bearing plates which are symmetrically arranged and are parallel to the supporting frame in the length direction are arranged between the gear rings, the turnover mechanism is used for placing a transfer frame, and a plurality of lead frames are arranged on the transfer frame in a rectangular array mode; two stop levers which are symmetrically arranged and reciprocate in the width direction of the bearing plate are arranged on the bearing plate, the length direction of the stop levers is parallel to the axis of the gear ring, and the stop levers are used for limiting the lead frame; the bearing mechanism comprises two supporting plates which are arranged on the two sides of the supporting frame in the length direction respectively and move in the width direction and the vertical direction of the supporting frame, a plurality of material frames arranged at intervals are arranged on the top faces of the supporting plates in the length direction of the supporting plates, and during application, the upper ends of the material frames abut against the transfer frame and are used for collecting the lead frames. According to the device, the lead frames can be automatically stacked in the material frame, and the efficiency is improved.

The utility model relates to the technical field of semiconductor production, and particularly discloses a reagent placing assembly, a wet process machine table and an automatic liquid changing system. The reagent placing assembly comprises a supporting piece and a liquid receiving piece, a placing area is arranged on the supporting piece and is used for placing a reagent bottle; and the liquid receiving piece is arranged beside the placing area and is used for receiving drippings of the liquid taking pipe. And a liquid receiving piece of the reagent placing assembly can receive drippings of the liquid taking pipe. According to the scheme, dripping objects can be received through the liquid receiving piece, so that in the process of replacing the reagent bottle, after a bottle cap of the reagent bottle is taken down, the bottle cap can be moved to the position above the liquid receiving piece, the dripping objects of a liquid taking pipe on the bottle cap are received, pollution of reagents to a machine table and the working environment is effectively prevented, and the cleaning burden of workers is reduced.

The invention discloses a silicon wafer column machining and grinding device for semiconductor production, and relates to the technical field of semiconductor production, the silicon wafer column machining and grinding device comprises a machining plate, a placing plate is fixedly mounted at the top of the machining plate, a linear driving mechanism fixedly penetrates through the top of the machining plate, and a driving motor is fixedly mounted at the top of the moving end of the linear driving mechanism; a loading plate is fixedly mounted at the output end of the driving motor, and a grinding mechanism fixedly penetrates through the end, away from the driving motor, of the loading plate. Wherein the clamping device comprises an electric push rod, a carrying plate, a T-shaped rod, a first spring, a rubber plate, a lifting plate, a first elastic piece, two connecting rods, an arc-shaped strip and a supporting rod, the polishing stability is improved through supporting force applied by the machining plate, then the arc-shaped strip is used for applying pressure to the silicon wafer column, and it is ensured that the silicon wafer column does not deflect in the polishing process, and the polishing effect is not affected.

The invention belongs to the technical field of detection, particularly relates to a high-resolution visual detection device for the surface quality of an inner hole of a pipe for semiconductor production, and aims to overcome the following defects in the prior art: a probe is inconvenient to place at a middle line of a pipeline to influence a peeping effect; meanwhile, the system depends on the technical level and the operation proficiency of an operator; in addition, the possibility of missing detection also exists. In order to solve the problems, the following scheme is provided: the device comprises a fixed cylinder, a rotating plate is rotationally arranged at one end of the fixed cylinder, a brush plate for cleaning the pipe wall is arranged on the rotating plate in a self-adjusting manner, a fan for cleaning impurities is arranged at one end of the rotating plate, and a double-shaft motor is fixedly arranged in the fixed cylinder; by integrating the functions of pipe wall cleaning, high-resolution visual detection and inner wall roughness detection, comprehensive quality detection of the inner hole surface of the pipe for semiconductor production can be completed at a time, and the detection efficiency and accuracy are greatly improved.

The invention discloses a layout device and method for a semiconductor secondary piping installation project, and the device comprises a file uploading module which receives a layout file of a semiconductor production line; the data analysis module is used for analyzing the layout file, acquiring attribute information and position information of the equipment and transmitting the attribute information and the position information to a secondary piping database; the data analysis layout module is used for giving a secondary piping installation pipeline diagram, and obtaining a corresponding pipeline instrument assembly in a secondary piping database by combining an assembly matching algorithm to form a pipeline instrument flow chart; and the three-dimensional space management module is combined with a three-dimensional model generation algorithm to generate a layout model of the semiconductor secondary piping installation project. Through linkage of semiconductor layout information and a secondary piping database, in combination with a component matching algorithm, information of a secondary piping component is obtained, and according to a three-dimensional model generation algorithm, automatic output of semiconductor secondary piping layout is realized and visual display is performed in a three-dimensional scene.

The invention discloses wafer defect detection equipment for semiconductor production, relates to the field of wafer detection, and solves the problem that the wafer clamping force is too large when an existing detection device turns over a wafer, the wafer defect detection equipment comprises a detection platform and a supporting plate, a mounting disc is arranged on the outer side of the supporting plate, an L-shaped support is arranged on the outer side of the mounting disc, and the L-shaped support is arranged on the outer side of the mounting disc. An infrared detector is mounted at one end of the L-shaped bracket, a mounting frame is mounted at the top of the detection platform, a detection box is mounted at the top of the mounting frame, and a transparent placement plate is arranged on the inner side of the detection box; the detection mechanism is used for carrying out double-sided detection on the wafer on the transparent placing plate, and the detection mechanism is mounted on the inner side of the detection box; through the detection mechanism, the top and the bottom of the wafer can be detected without overturning the wafer, contact with the wafer during detection is reduced, the problem that the clamping force of a traditional detection device on the wafer is too large is solved, wafer damage is prevented, and therefore the safe and multi-face detection effect is achieved.

The utility model relates to the technical field of semiconductor production, in particular to a pre-passing device and a vapor deposition system.The pre-passing device comprises a packaging container, a carrier gas inlet pipe, a mixed flow pipe, a buffer assembly and a tail gas treatment system, and the packaging container is provided with a packaging inlet and a packaging outlet which are communicated with an inner containing cavity; the gas outlet end of the carrier gas inlet pipe is communicated with the packaging inlet; the gas inlet end of the mixed flow pipe is communicated with the packaging outlet, and carrier gas carrying a precursor flows in the mixed flow pipe; the buffer assembly is used for collecting the precursor carried in the carrier gas, the gas inlet end of the buffer assembly is communicated with the gas outlet end of the mixed flow pipe, and the gas outlet end of the buffer assembly is communicated with the tail gas treatment system. On the premise that the flow of the precursor is stable, waste of the precursor in the pre-passing process is reduced, the utilization rate of the precursor is increased, and the production cost is reduced.

The invention provides a method for measuring the thickness of an epitaxial layer. The method comprises the following steps: providing a substrate; forming a doped test region in the substrate through an ion implantation process; forming an epitaxial layer on the substrate, wherein a doping concentration difference exists between the epitaxial layer and the doping test region; and based on the doping concentration difference between the epitaxial layer and the doping test region, performing thickness detection on the epitaxial layer on the doping test region through a Fourier transform infrared spectrometer to obtain the thickness of the epitaxial layer. According to the method, the thickness of the epitaxial layer can be directly measured on the production line of the semiconductor manufacturing process, the doping testing area is formed by conducting ion implantation on the substrate, the doping concentration difference exists between the doping testing area and the epitaxial layer, and therefore the testing principle of a Fourier transform infrared spectrometer (FTIR) is met. According to the method, the thickness of the epitaxial layer can be accurately monitored in real time without damaging the wafer, and the stability of semiconductor production and manufacturing is greatly improved.

The invention provides a graphite piece performance detection method and system and electronic equipment, and relates to the technical field of semiconductor production equipment quality control, and the method comprises the steps: carrying out the multi-dimensional detection of a target graphite piece through a sensor array, so as to obtain the multi-dimensional detection data of the target graphite piece; acquiring a surface image of the target graphite piece by using a visual detection unit, and analyzing the surface image by using the intelligent image analysis model to extract graphite surface damage features; and fusing the graphite surface damage features with the multi-dimensional detection data to obtain a comprehensive feature set, and evaluating the comprehensive feature set by using the graphite piece performance detection model to obtain a performance detection result of the target graphite piece. By adopting the graphite piece performance detection method, the graphite piece performance detection system and the electronic equipment, the problems of low detection efficiency and low detection accuracy in the existing graphite piece performance detection process are solved.

The invention is suitable for the technical field of semiconductor production, and provides heat dissipation cover mounting equipment which comprises a product feeding device, a dispensing device, a mounting device, a pressure maintaining and curing device and a product discharging device. A product is conveyed to the glue dispensing device through the product feeding device, glue dispensing is conducted on the product through the glue dispensing device, after glue dispensing is completed, the product obtained after glue dispensing is conducted is conveyed to the surface mounting device through the glue dispensing device, cooling fins are mounted on the product through the surface mounting device, and the surface-mounted product is conveyed to the pressure maintaining and curing device. The pressure maintaining and curing device applies preset pressure to the product in the glue solution curing process and conveys the product to the product discharging device. And the product discharging device is used for storing the products provided with the heat dissipation covers. Compared with heat dissipation cover mounting equipment in the prior art, the heat dissipation cover mounting equipment has the advantages that automatic feeding and discharging of products can be achieved, the operation requirement of continuous production of the products can be met, and the working efficiency of heat dissipation sheet mounting is improved.

The invention relates to the technical field of industrial waste gas treatment, in particular to a waste gas treatment method and system based on model optimization. The method comprises the following steps: carrying out multi-dimensional spectrum acquisition on the semiconductor production line waste gas to obtain VOCs molecular spectrum data; performing target VOCs molecule selection based on the VOCs molecule spectrum data to obtain target VOCs molecule positioning data; performing plasma energy field activation on the target VOCs molecules according to the target VOCs molecule positioning data to obtain VOCs molecule energy conversion data; and according to the VOCs molecule energy conversion data, carrying out selective molecular bond cleavage on the target VOCs molecule to obtain VOCs molecule degradable structure data. The VOCs in semiconductor production can be accurately identified and treated, and the pertinence and efficiency of waste gas treatment are improved.

The invention discloses a virtual environment modeling method for an OHT system of a semiconductor factory, and belongs to the technical field of semiconductor production, and the method comprises the following steps: data collection and preprocessing: collecting field facility data of a semiconductor factory production line, operation related data of an OHT vehicle, and product information data, and carrying out the preprocessing of the data, so as to obtain basic data; virtual environment modeling: constructing a virtual environment model according to the basic data; simulation and optimization: carrying out simulation operation based on the constructed virtual environment model, and carrying out performance evaluation; then, optimization is carried out according to a simulation result and a performance evaluation condition; and verifying and applying a result. According to the method, accurate modeling and simulation are carried out on the OHT system, the configuration and scheduling strategy of the OHT system is optimized, resource utilization can be optimized, the cost can be reduced, and the stability, reliability and flexibility of the system can be enhanced.

The invention discloses a frequency adjustment control method and device for an ultrahigh frequency wafer, and relates to the technical field of semiconductor production. Determining a target area of the coated wafer, dividing the target area to obtain a plurality of to-be-detected areas, and obtaining the area vibration frequency of the to-be-detected areas; if the area vibration frequency is larger than a preset frequency threshold value, the area to be detected is judged to be an abnormal area, a feature code is added, and the area vibration frequency and the feature code are uploaded to a feature database; working parameters of the laser etching equipment are determined according to the feature database, and the abnormal area is etched according to the working parameters; the vibration frequency of each to-be-detected area is detected, the area with the abnormal vibration frequency is identified, a feature code is added to the area, the area vibration frequency and the feature code are uploaded to a feature database, rapid identification and intelligent marking of the abnormal area are achieved, and data support is provided for subsequent laser etching equipment working parameter optimization. And the accuracy and the high efficiency of the etching operation are ensured.

The utility model provides a heat treatment furnace temperature control device used for semiconductor production. The heat treatment furnace temperature control device comprises a first temperature acquisition module, a first PI D adjusting module, a first heating device, a controller module, a second temperature acquisition module, a second PI D adjusting module, a furnace door detection module, a contactor and a second heating device. According to the utility model, the first temperature acquisition module acquires internal temperature data of the heat treatment furnace in real time and sends the internal temperature data to the first PI D adjusting module, the first PI D adjusting module controls the first heating device to adjust the temperature in the heat treatment furnace, and the second temperature acquisition module acquires temperature data of the furnace door and sends the temperature data to the second PI D adjusting module. And the second heating equipment is controlled to adjust the temperature at the furnace door according to the furnace door opening and closing state detected by the furnace door detection module so as to supplement the temperature lost by frequent door opening and closing in the heat treatment furnace.

The invention discloses an equipment end wafer caching system for semiconductor production, and particularly relates to the field of semiconductor manufacturing equipment, which comprises a task initialization module, an intelligent scheduling module, a round box transportation module, a caching scheduling module, an exception handling module and a task feedback module, according to the task initialization module, a production management system MES generates a wafer box carrying task according to the production plan; according to the intelligent scheduling module, the core scheduling control unit generates an optimal carrying strategy based on the carrying task; the intelligent scheduling system MCS monitors the state and position of the wafer box and the requirements of a production line in real time, the optimal wafer box carrying path and storage strategy can be selected, the carrying task is issued, it is ensured that the wafer box efficiently flows among the cache groove, the STK storage area, the SMIF equipment and the OHS air shuttle vehicle, the waiting time and invalid carrying are reduced, and the production efficiency is improved. And the overall production efficiency is improved.

The invention discloses a semiconductor production material carrying scheduling method, device and equipment and a readable storage medium, and relates to the field of production scheduling. According to the method, all the sub-tasks of the material carrying task are used as the minimum task sorting units to be sorted, all possible task execution sequences are obtained, and the optimal execution sequence is screened out from all the possible task execution sequences with the purpose of finding the shortest path. According to the method, the material carrying task is more flexible to execute, the proportion of the no-load stroke of the AGV can be reduced, and the transportation efficiency of the AGV is improved.

The utility model discloses coating equipment for improving the uniformity of a magnetron sputtering film, and belongs to the technical field of semiconductor production equipment.The coating equipment comprises a substrate table, the substrate table is provided with a cooling channel and a cooling air hole, and a supporting part is arranged at the upper end of the substrate table in a protruding mode; the air hole plug is arranged on the substrate table in a lifting adjusting manner; and the base plate is placed on the supporting part. Opening and closing of the cooling air holes in the corresponding positions can be adjusted according to the temperature distribution condition of the substrate in the debugging stage, the cooling air holes are opened in the high-temperature area to be communicated with the cooling channel, cooling air is used for cooling, and when the cooling air is sent out from the cooling air holes, the air uniformizing space can be used for uniformizing the cooling air in a small range, so that the cooling efficiency is improved. Regional cooling is achieved, the purpose of temperature regulation and control is achieved, the temperature of the surface of the substrate is uniform and consistent, and then the uniformity of coating is improved.

According to the overlay alignment mark and the overlay offset measuring method provided by the invention, the offset of the central point of the first overlay pattern and the offset of the central point of the second overlay pattern in the X direction and the Y direction are measured, so that the overlay error value of the current layer of the wafer relative to the front layer of the wafer can be obtained; according to the overlay error value, whether the current layer of the wafer deviates relative to the front layer of the wafer is judged, in addition, an overlay alignment mark of a novel structure is provided, and the overlay alignment mark of the novel structure forms an overlay pattern arranged in a regular triangle shape. The overlay alignment mark is small in size and does not occupy a large chip space, so that the overlay alignment mark not only can be placed in a scribing groove to measure the Overlay error value between exposure areas, but also can be placed in a passive area on a wafer substrate to measure the Overlay error value of the exposure areas; therefore, the alignment precision in the semiconductor manufacturing process can be improved, and wider manufacturing process requirements can be met.

The invention is applicable to the technical field of semiconductor production equipment, and provides polishing equipment for semiconductor glass substrate processing, which comprises a polishing assembly, and the polishing assembly is rotatably matched with a positioning assembly; the polishing assembly comprises a polishing piece and a supporting piece arranged on the polishing piece in a sliding fit mode, and the positioning assembly comprises a clamping piece arranged on the polishing piece in a rotating fit mode, a rotating piece arranged on the clamping piece in a rotating fit mode and a cam piece located on the rotating piece in an inserted connection mode. The equipment solves the problems that when an existing semiconductor glass substrate is subjected to polishing operation on the upper surface and the lower surface, generally when polishing operation on one end face is completed, the clamping and positioning process of the clamped and positioned semiconductor glass substrate needs to be relieved, then the semiconductor glass substrate is turned over, and finally the semiconductor glass substrate is subjected to clamping and positioning operation after being turned over; the whole polishing process is too tedious, and the polishing efficiency of the upper surface and the lower surface of the same semiconductor glass substrate is reduced.

The invention provides a semiconductor SPC system data multi-thread rendering display device and method, and belongs to the field of semiconductor manufacturing, and the method specifically comprises the steps: obtaining sampling point data; displaying an interactive interface of the interactive operation to enable a user to select to-be-displayed interface content, and determining a rendering task according to the business operation corresponding to the selected interface content; performing service calculation on the sampling point data by adopting a multi-task concurrent mode, and outputting a task processing result; based on the data volume of the sampling point data and the business operation corresponding to the selected interface content, determining a rendering mode of the task processing result, and generating a to-be-rendered result; decomposing the rendering task into a plurality of stage tasks of framing rendering based on the to-be-rendered result; and performing framing rendering on a task processing result according to the stage task, and displaying a rendered page. By means of the processing scheme, the mass semiconductor production data can be dynamically rendered, and efficient self-adaptive display of the mass semiconductor monitoring data is achieved.

The utility model provides a plasma cleaning device, and belongs to the technical field of semiconductor production equipment, the plasma cleaning device comprises a cavity, and a chamber is arranged in the cavity; the cover plate covers the upper end of the cavity; the remote plasma source is connected to the central position of the protruding part; the gas blocking part is arranged in the conical cavity; the first gas homogenizing plate is arranged below the gas blocking part; the second gas uniformizing plate is arranged below the first gas uniformizing plate; and a substrate table. The cover plate and the gas blocking part can uniformly disperse plasma gas fed by a remote plasma source into the cavity, then the plasma gas is further homogenized through the first gas homogenizing plate to ensure the gas uniformity of a substrate area, and meanwhile, the vacuum mechanism is generally connected to the bottom of the cavity, so that the gas is downwards pumped through the second gas homogenizing plate during gas pumping, and the gas uniformity of the substrate area is ensured. The gas uniformity in the chamber can be effectively ensured, so that the etching uniformity and the etching rate are improved.

The invention relates to a semiconductor production scheduling method considering opportunistic maintenance and a medium, and the method comprises the following steps: obtaining the production state of a semiconductor production workshop, building an opportunistic maintenance and scheduling collaborative optimization model, the semiconductor production workshop comprising a plurality of equipment groups, and each equipment group comprising a plurality of equipment; establishing an equipment state model, and carrying out modeling representation on an equipment fault; modeling each device group into an intelligent agent according to the opportunity maintenance and scheduling collaborative optimization model and the device state model, and designing an action space and a structured reward function based on a combined scheduling rule; a QMIX algorithm is utilized to train each agent under a CTDE framework, an independent strategy allocated to each equipment group is utilized in a coordinated manner, and output synchronization is performed according to a real-time workshop state, so that production and maintenance scheduling are optimized. Compared with the prior art, the method can reduce the maintenance cost while improving the production efficiency, and improves the overall performance of a semiconductor manufacturing system.

The invention relates to the technical field of semiconductor device testing, in particular to an intelligent management and control system and method for semiconductor production process quality, and the method comprises the steps: obtaining target application scene information of a to-be-tested semiconductor device; a first intelligent test model is utilized to generate baseline test severity configuration matched with the target application scene according to the target application scene information, and the baseline test severity configuration comprises test limit values of a plurality of test parameters, test item selection and test conditions; in the testing process, quality feedback data and upstream process data related to the semiconductor device to be tested are obtained and analyzed in real time, and semiconductor real-time data are obtained; performing comprehensive analysis on the semiconductor real-time data and the baseline test severity configuration by using a semiconductor quality adjustment model, dynamically adjusting the baseline test severity configuration, and generating a final test severity configuration; and generating a control instruction based on the final test severity configuration, and testing the semiconductor device.

The invention discloses a BUB bubble conveying system for a semiconductor production process and a control method, and belongs to the technical field of bubble conveying control, and the method specifically comprises the steps: in a fluid conveying pipeline of the semiconductor production process, generating a bubble group through a bubble generator, and adjusting the bubble generation frequency and volume distribution based on a liquid impedance feedback signal, the flow velocity, pressure and bubble distribution parameters of process liquid are collected, a pre-trained flow field prediction model is used for analyzing the bubble gathering trend, when the transmission retardation risk is detected, the opening degree of a micro valve is automatically adjusted, a bubble path is shunted, and a micro-pulse air pressure signal is applied to the throttling section of the semiconductor production process fluid conveying pipeline. Dynamically matching the bubble rupture phase with the fluid viscosity, and switching to a reverse bubbling mode to perform self-cleaning on the pipeline when detecting that the bubble residue exceeds a threshold value; linkage regulation and control of the multi-node micro valve are achieved, and the uniformity, repeatability and safety of fluid conveying can be kept in long-term operation.

The invention discloses a water-fluorine heat exchanger for semiconductor production and a heat exchange method, and relates to the technical field of semiconductor processing heat exchange. The water-fluorine heat exchanger comprises a machine body, a water tank is arranged at the upper end of the machine body, and the water tank, a cooling liquid extraction pipe and a cooling liquid guide pipe form a cooling liquid conveying loop; the cooling liquid guiding and conveying pipe, the heat exchange pipe, the cooling liquid guiding-out pipe and the cooling liquid inlet pipe form a cooling circulation loop, the normal-temperature water input pipe, the water cavity and the normal-temperature water output pipe form a normal-temperature water loop, a PLC used for controlling the PID electric proportional valve is fixedly installed on the inner wall of the side control cavity, and a COM port of the touch screen is connected with a communication port of the PLC. Normal-temperature water is used for carrying out heat exchange on fluorinated liquid, then the fluorinated liquid flows through production equipment to be efficiently cooled, a PLC is used for executing a temperature signal needed by normal operation, the opening angle of a PID electric proportional valve is controlled, the inlet flow of the normal-temperature water is controlled, heat exchange between the water and the fluorinated liquid is accurately achieved, and the production efficiency is improved. And the operation temperature of the production equipment is kept in an optimal state.

The invention belongs to the technical field of semiconductor wafer processing, and particularly relates to a grinding device for semiconductor production and processing, which comprises a workbench, a protective cover, a moving assembly and a liquid spraying assembly, and the moving assembly drives a grinding adjusting assembly to move; the polishing adjusting assembly comprises a box cover and a polishing box, an adjusting motor is installed on the box cover and connected with a transmission shaft and a reciprocating lead screw, and the transmission shaft drives the polishing box to rotate intermittently through the liquid spraying assembly. The polishing blocks are driven by the polishing adjusting assembly to press and fit the wafer disc, the polishing box is driven by the adjusting driving assembly to rotate intermittently, then the next group of polishing blocks is switched to be matched with the inserting block to move downwards again to press the pressing plate, and the effect that each group of polishing blocks fit the wafer disc is achieved. The polishing blocks are adjusted one by one through the polishing adjusting assembly, so that all the sets of polishing blocks can be attached to the uneven surface of the wafer disc, the polishing efficiency of the polishing blocks is improved, it is ensured that the thickness of the wafer disc is uniform, and uneven stress distribution of the wafer disc is avoided.