177 results about "Proximity effect correction" patented technology

The invention provides an optical proximity effect correction method of an ion implantation layer and a semiconductor device manufacturing method, and the method comprises the steps: firstly cutting off a convex corner in a corner-to-corner structure with a small interval in an original layout of the ion implantation layer, and then carrying out the OPC of the layout after the corner cutting, according to the method, the limitation of mask rule inspection on the corner-to-corner structures can be avoided, and the space for correcting the optical proximity effect is enlarged, so that the key size of a final layout obtained by OPC can meet a target value, the problem of process hot spots caused by easy distortion of a corner-to-corner structure pattern in an ion implantation layer in the prior art can be solved, and the quality of the ion implantation layer is improved. And the accuracy of OPC correction is improved, so that a more accurate final layout of the ion implantation layer is provided. According to the manufacturing method of the semiconductor device, the final layout of the required ion implantation layer is obtained by using the optical proximity effect correction method of the ion implantation layer, so that the yield and the performance of a product can be finally improved.

The invention provides an optical proximity correction method and system based on mask error model optimization, and a terminal, and the method comprises the steps: building a data sample set containing a plurality of process conditions through obtaining a large amount of mask manufacturing data under a specific photoetching process; and based on the sample set, constructing a physical optical sub-model and a machine learning sub-model to form a mask error model for outputting a final mask key size value. And then, according to a plurality of preset alternative weight coefficient combinations, reconstructing an objective function which introduces a mask error term, calculating corresponding objective function values, and correcting the photoetching pattern by using an OPC algorithm corresponding to each objective function value to obtain performance index data so as to determine an optimal weight coefficient combination. And finally, optimizing the OPC algorithm by using the target function of the optimal combination, thereby realizing the accurate correction of the photoetching pattern, and improving the precision and yield of semiconductor manufacturing. According to the method, the mask error model comprehensively considering physical optics and machine learning is established, and the OPC process is introduced, so that the influence of the mask error can be predicted and compensated more accurately, the critical dimension deviation and the like are reduced, and the device performance and the yield are improved. The method can adapt to different process conditions, and parameters and weight coefficients can be dynamically adjusted. And moreover, rework can be reduced, automatic adjustment is realized through closed-loop feedback control, the production stability and efficiency are improved, and the cost is reduced.

The invention relates to an optical proximity effect correction method, a mask and a readable storage medium. The method comprises the following steps: step A, acquiring a mask design pattern; step B, simulating the mask design pattern according to an OPC model to obtain a simulated exposure pattern; step C, calculating edge placement errors of the simulation exposure pattern and the mask design pattern at each target point; step D, adjusting the mask design pattern according to the edge placement error to obtain a corrected pattern; e, judging whether the shape of the corrected pattern after exposure meets the requirement or not, and if yes, obtaining a mask plate making pattern according to the corrected pattern; and if not, adjusting the target point on the edge of the transition part of the design pattern of the mask plate, then returning to the step C, and repeatedly executing the step C, the step D and the step E until the plate making pattern of the mask plate is obtained. According to the invention, the OPC correction effect can be improved, and the OPC correction precision can be improved.

The invention provides an optical proximity effect correction method and system, a terminal and a medium, and the method comprises the steps: obtaining a plurality of initial parameter combinations of a photoetching mask design pattern, so as to form an initial population; wherein each initial individual in the initial population corresponds to a group of initial parameter combinations; determining a plurality of optimization indexes of the photoetching mask design graph, and determining an optical proximity effect correction function based on the plurality of optimization indexes and constraint conditions; and based on the optical proximity effect correction function, obtaining an optimal parameter combination of the photoetching mask design pattern in the iteration process of the initial population. According to the invention, the optimization algorithm is innovatively introduced into the field of optical proximity effect correction, comprehensive optical proximity effect correction is realized by introducing a plurality of optimization indexes, the manufacturing requirement of a high-precision silicon optical chip is effectively met, and the performance of the silicon optical chip is effectively improved.

The invention discloses a mask optimization method, electronic equipment and a computer readable storage medium, belongs to the field of semiconductors, and aims to solve the problems of nonlinearity and tradeoff between local and global performance. The sampled metal layer fragments are processed through an ILT engine, and a quasi-optimized continuous transmission mask (CTM) is generated and used for initializing regular distribution values; optimizing the rule distribution value by using an index natural evolution strategy of photoetching perception; the optimized rule distribution value is used for testing the generation sub-resolution auxiliary features (SRAF) of the pattern segment and the model-based optical proximity effect correction (OPC), and the effect is that the photoetching performance and the calculation efficiency can be improved.

The invention discloses a layout correction method, a storage medium and a storage terminal.The layout correction method comprises the steps that a to-be-corrected layout is provided, and the to-be-corrected layout comprises a plurality of to-be-corrected graphs; obtaining a target to-be-corrected graph based on the plurality of to-be-corrected graphs; obtaining a plurality of environment areas corresponding to the target to-be-corrected graphs, wherein one target to-be-corrected graph is located in one environment area; classifying the plurality of environment areas, wherein the to-be-corrected graphs in the same type of environment areas are the same; and sequentially performing optical proximity effect correction on the target to-be-corrected graphs in the plurality of types of environmental areas. According to the layout correction method, the correction time is shortened.

The invention relates to the technical field of semiconductor manufacturing, and particularly provides a mask pattern edge compensation and correction method, which comprises the following steps of: constructing a training data set; training the deep learning model based on the training data set; obtaining a target mask plate design graph, and determining an open circuit position coordinate set of the target mask plate design graph based on optical proximity effect correction simulation of a historical defect database and / or a photoetching imaging model; respectively inputting the target mask design graph, the open circuit position coordinate set of the target mask design graph, photoetching machine model parameters and optical model physical constraint parameters into an open circuit analysis model, and outputting an open circuit probability distribution graph and a graph edge correction rule of the target mask design graph; and inputting the target mask design graph, the open circuit probability distribution graph and the graph edge correction rule into a photoetching imaging model to generate a corrected mask design graph. According to the method, the limitation of traditional correction is broken through, the mask correction precision is remarkably improved, and the circuit breaking risk in chip production is reduced.

The invention provides an optical proximity correction method and device based on a plurality of photoetching models, a medium and a program product. The method comprises the following steps: judging whether a previous thin film lamination has differences in different areas according to an analysis result of a current photoetching condition; evaluating the influence of the difference on the current layer of photoetching pattern imaging, configuring one or more wafers according to an evaluation result, and respectively exposing to sample modeling data; respectively carrying out photoetching model calibration by utilizing modeling data; before optical proximity correction is carried out, patterns of an input layout are classified and marked according to different thin film lamination area patterns of a front layer and different types of patterns; and in the optical proximity correction process, respectively calling the corresponding photoetching models or sub-photoetching models to simulate and correct different types of graphs. According to the invention, the photoetching precision of each part of pattern is greatly improved, and the optical proximity correction effect is greatly improved.

The invention discloses an optical proximity effect correction method and device, a storage medium and electronic equipment, and the method comprises the steps: placing an SRAF around a target pattern of a through hole layer according to a preset rule; performing OPC correction on the target graph to generate an initial correction graph; obtaining a first distance between each target graph and the corresponding initial correction graph, and a second distance between each target graph and the corresponding SRAF; taking the first distance and the second distance as optimization variables, and constructing a target function based on the first distance; on the basis of the target function, a genetic algorithm is adopted to carry out iterative solution on the optimization variables, and a target parameter combination is obtained; and generating a correction layout according to the target parameter combination. According to the embodiment of the invention, the efficiency of SRAF placement and OPC correction can be improved.

A water body suspended sediment concentration monitoring method based on FUI water body classification comprises the steps that firstly, a target watershed Sentinel-2 L1C image from a certain year to a certain year is obtained from GEE, and after resampling is conducted till the resolution is 10 m, preprocessing such as 6S model atmospheric correction, proximity effect correction and quality control is conducted; 5 wave bands are used for calculating spectral angles to obtain FUI, and 14 is used as a threshold value to divide the water body into clear water and muddy water. And then selecting an optimal wave band combination according to the FUI classification to construct a semi-empirical inversion model, and finally calculating the suspended sediment concentration distribution by using the model and verifying the suspended sediment concentration distribution. The method solves the problem that the model generalization ability is low in the monitoring of the suspended sediment concentration of the target drainage basin, and the inversion precision is high.

The invention discloses an optical proximity effect correction method and device, a storage medium and electronic equipment, and the method comprises the steps: obtaining a to-be-corrected mask layout; discretizing the mask boundary of the mask layout to be corrected to obtain a plurality of first boundary sections; calculating a Jacobian matrix of each first boundary section based on a Hopkinson optical transfer matrix; inputting the jacobian matrix into an offset prediction model, and predicting the offset of each first boundary section; and adjusting the position corresponding to the first boundary section according to the offset, and generating a corrected mask layout. According to the scheme, the calculation complexity of OPC can be reduced.

The invention provides an optical proximity effect correction method and system, electronic equipment and a storage medium. The optical proximity effect correction method comprises the steps of providing a reference structure, performing optical proximity effect correction processing on the reference structure, and obtaining rounded collection data of a plurality of line end graphs with different feature sizes; constructing a rounded corner prediction model according to the plurality of feature sizes and the rounded corner acquisition data; and inputting the feature size of the target layout into the rounded prediction model, and generating rounded prediction data of the target layout by using the rounded prediction model. According to the optical proximity effect correction method, the rounded corner degree of the target layouts with different feature sizes after optical proximity effect correction can be accurately predicted, and a reference is provided for OPC verification.

Grouping image patterns using a trained machine learning model to determine wafer behavior in a patterning process is described. The described operations include converting one or more patterned process images including the image patterns into feature vectors based on a trained machine learning model. The feature vector corresponds to the image pattern. The described operations include grouping feature vectors having features indicative of image patterns that cause matched wafer and / or wafer defect behavior during the patterning process based on a trained machine learning model. The one or more patterned process images include a spatial image, a resist image, and / or other images. The grouped feature vectors may be used to: detect potential patterning defects on a wafer during a lithographic manufacturability test as part of optical proximity correction; adjusting the layout design of the mask; and / or generating a track gauge line / defect candidate list; and other uses.

The invention discloses an optical proximity effect correction method, a semiconductor structure and a preparation method, and the method comprises the steps: segmenting the edge of an initial mask pattern into a plurality of segments, and obtaining an initial cutting line corresponding to each segment; determining an initial edge placement error corresponding to the current position of the initial cutting line; adjusting the position of each segment according to the first initial edge placement error to obtain an intermediate mask pattern; and under the condition that a second edge placement error exists at the line end of the middle mask pattern, adjusting the position of the initial cutting line on the segment based on the cutting line movement ratio until the simulation wafer pattern is matched with the reference mask pattern, and obtaining a target mask pattern. According to the method, the cutting line is moved according to the cutting line movement ratio so as to gradually adjust the line end of the intermediate mask pattern, the edge placement error of the line end is reduced, the curvature and the inclusion degree of the line end are also improved, and the accuracy and the quality of the corrected target mask pattern are improved.

The invention discloses an optical proximity correction method based on a U-Net neural network. The method comprises the following steps of: 1, generating a data set for training and testing by utilizing photoetching analogue simulation software; 2, preprocessing the data set image, wherein the preprocessing comprises cutting of a mask and a light intensity distribution diagram and edge extraction of the light intensity distribution diagram; 3, constructing a U-Net convolutional neural network, and training an existing data set; 4, carrying out the same preprocessing process on the light intensity distribution image under the ideal condition, taking the light intensity distribution image as input, and obtaining a target mask pattern by utilizing the network model obtained through training; and 5, simulating the target mask pattern by utilizing photoetching simulation software existing in a laboratory to obtain a light intensity distribution diagram, and comparing and observing the light intensity distribution diagram obtained by the target mask pattern and an unmodified mask. The optimized mask pattern is simulated, so that the edge placement error can be obviously reduced, and the precision and manufacturability of a photoetching pattern are improved.

The invention relates to a photoetching process window optimization method, a mask and a readable storage medium. The method comprises the following steps: acquiring an area with the problem of insufficient photoetching process windows in a mask design pattern; obtaining a graph size adjustment parameter according to the size of the photoetching process window of the region; selecting a first pattern and a second pattern to be adjusted according to the morphology parameters and the adjacent edge included angles of the patterns to be adjusted; adjusting the position of the mask design graph according to the graph size adjusting parameters, and adjusting the position of the mask design graph to form a reconstructed graph; and performing optical proximity effect correction on the reconstructed pattern to obtain a mask plate making pattern. According to the invention, the pattern to be adjusted is selected for size adjustment according to the morphology parameters and the adjacent edge included angle of the pattern to be adjusted, so that the defect of a photoetching process window is overcome, and the circuit performance and the product yield are improved. Since no barrier layer is used to distinguish adjusted / unadjusted patterns, the cost is low.

The invention provides a method for reducing optical proximity correction time, which comprises the following steps of: providing an initial target graph, performing OPC (Optical Proximity Correction) on the initial target graph to obtain a correction mask plate of the initial target graph, and comparing the correction mask plate of the initial target graph with the initial target graph to obtain a deviation table; a to-be-corrected target pattern is provided, the to-be-corrected target pattern is the same as the initial target pattern, the deviation table is imported into the OPC formula, OPC correction is conducted on the to-be-corrected target pattern, and the corrected mask plate of the to-be-corrected target pattern is obtained. According to the method for reducing the correction time of the optical proximity effect, after OPC is carried out on the initial target graph, a deviation table between a correction mask plate of the initial target graph and the initial target graph is obtained, and when to-be-corrected target graphs of the same graph are corrected subsequently, the deviation table is imported into an OPC formula to be corrected, so that the correction time of the optical proximity effect is shortened. The correction time is greatly reduced, and the OPC correction efficiency is improved.

The embodiment of the invention provides a method and equipment for determining an edge position error and a storage medium. The method includes determining a degree of signal variation of a lithographic simulation signal for a control point in a mask pattern at a current position of the lithographic simulation pattern; updating the position of the control point in the photoetching simulation pattern according to the signal change degree of the photoetching simulation signal of the control point at the current position so as to determine the target position of the control point; and determining an edge position error of the control point based on the difference between the initial position and the target position of the control point. In this way, the efficiency of determining the edge position error can be improved, and then the efficiency of optical proximity effect correction is improved.

The invention discloses an optical proximity effect correction method and system for an ion implantation layer layout, and belongs to the technical field of semiconductors, the optical proximity effect correction method for the ion implantation layer layout comprises the following steps: providing a layout ion implantation region to be corrected, correcting a local position of which the key size of the layout ion implantation region is smaller than a required size; respectively growing correction patterns at boundaries on two sides of the local position so as to increase the width of the local position; and step-by-step outward expansion is carried out on each correction graph, the correction graphs are gradually expanded outwards by a preset distance in the preset direction, the distance between the correction graphs and the active area is detected after each step of expansion, and if the distance between the correction graphs and the active area is larger than the safe distance, the correction graphs continue to be expanded. In the OPC correction process, step-by-step expansion is independently carried out on each corrected graph, the size safety of the two-dimensional CD of a layout ion implantation region is ensured, meanwhile, the safe distance between the two-dimensional CD and an active region is kept, the operand is reduced, and the publishing efficiency is improved.

The invention belongs to the technical field of photoetching, and particularly relates to an optical proximity effect correction method and system considering grid dependence. Through the first correction rule base in the OPC standard configuration base, position iteration correction is carried out on the first to-be-corrected mask pattern in the to-be-corrected layout file, preliminary OPC of the first to-be-corrected mask pattern is achieved, and the OPC efficiency of the to-be-corrected mask pattern is improved under the condition that the GD error influence is considered subsequently; through a second correction rule base obtained through optimization of the first correction mask pattern, moving a second to-be-corrected mask pattern for multiple times according to the target mask pattern moving mode, and calculating light intensity distribution of the second to-be-corrected mask pattern after each time of movement, therefore, the mask movement amount of the second to-be-corrected mask pattern can be obtained by using the average light intensity distribution of the second to-be-corrected mask pattern, and the influence of GD on the OPC process of the second to-be-corrected mask pattern can be effectively reduced.

The invention provides a processing method of a metal layer layout, and belongs to the technical field of semiconductor manufacturing, and the method comprises the steps: obtaining the metal layer layout and a through hole layer layout corresponding to the metal layer layout; extracting a first process hot spot pattern in the metal layer layout and a background pattern within a preset range around the first process hot spot pattern according to a first preset rule; carrying out edge shrinkage processing on a convex angle edge on the convex angle pattern at a first preset displacement to obtain a pre-processing layout; performing optical proximity effect correction processing on the preprocessed layout to obtain a corrected layout of the metal layer layout; and performing simulation processing on the corrected layout according to a second preset rule to obtain a simulation image. According to the optical proximity correction method, the process hot spot of the convex angle pattern during exposure can be eliminated under a small-size process window, and the defect that the OPC technology is difficult to fully correct the small-feature-size pattern is overcome.

The invention provides a correction method of an optical proximity correction model and a data acquisition method, which are applied to the technical field of semiconductors. The correction method and the data acquisition method both comprise the following steps: determining a first simulation value of a critical dimension of a test pattern set under initial information of a photoetching condition and a second simulation value of the critical dimension of the test pattern set under adjustment information of the photoetching condition; classifying the plurality of test patterns; different data acquisition modes are adopted for the classified test patterns, and the actual measurement values of the critical dimensions are recollected; through a mode of combining formula calculation and actual exposure, while the accuracy of data acquisition in the modeling process of the optical proximity effect correction model is ensured, the calculation amount of partial actual data acquisition is simplified by utilizing formula calculation, so that the purposes of reducing the labor cost and improving the modeling efficiency are achieved.

The invention relates to an optical proximity effect correction method and device, electronic equipment and a storage medium. The correction method comprises the following steps: acquiring an original mask plate, wherein the original mask plate is a mask plate pattern designed based on a target wafer image; inputting the original mask plate into a preset probability diffusion model to obtain a corrected target mask plate; wherein the preset probability diffusion model is obtained by training original mask plates of different wafer images and corrected mask plates corresponding to the original mask plates; and outputting the target mask so as to obtain a target wafer image based on the target mask. According to the method, the probabilistic diffusion model is introduced into the correction method, end-to-end learning of the complex mapping relation between the original mask and the corrected mask is realized, the correction processing time is shortened, the correction efficiency and accuracy are improved, the throughput of semiconductor manufacturing is improved, and the calculation cost is reduced.

The invention provides an optical proximity effect correction method, which comprises the following steps of: selecting an original layout layer comprising a target pattern layer and a hole layer, and searching an abnormal edge in the target pattern layer according to a position relationship between the target pattern layer and the hole layer; moving the abnormal edge by a first set distance in a direction perpendicular to the abnormal edge and away from the target pattern layer; moving each edge in the target pattern layer by a second set distance in a direction perpendicular to the edge and close to the target pattern layer to obtain an OPC (Optical Proximity Correction) target pattern layer; and carrying out iteration on the OPC correction target graph layer. According to the method, welt holes can be reduced, the problem of incomplete hole wrapping caused by global movement of the target pattern layer during process deviation is solved, meanwhile, the problem of incomplete hole wrapping caused when the holes are located at corners or line ends is also solved, and therefore the stability and the electrical property of products are improved.

The application relates to a metal line and via layout optical proximity effect correction method and related equipment, which comprises the following steps: obtaining an original metal line and via layout, wherein the direction perpendicular to the extension direction of the interconnection metal line in the plane of the interconnection metal line layer is the width direction, the metal line adjacent to the interconnection metal line in the width direction in the metal line layer is an influence metal line, the influence metal line comprises an influence metal line segment, and the influence metal line segment is a projection area line segment of a connecting via on the influence metal line in the width direction; performing hole expansion processing on each connecting via in the width direction to form an expanded connecting via; translating each influence metal line segment in the width direction in a direction away from the interconnection metal line by a certain distance to form a pretreated metal line and via layout; performing optical proximity correction on the pretreated metal line and via layout to obtain a corrected metal line and via layout, so that the photolithography process window can be increased, and the metal line is not prone to defects such as bridging.

The invention provides an optical proximity effect correction optimization method comprising the following steps: providing an initial layout, dividing the initial layout into a plurality of small blocks, each small block comprising a main pattern area and an expansion area surrounding the main pattern area, each small cell block is overlapped with the expansion area of the adjacent small cell block; oPC correction and simulation verification are carried out on each small block, and a problem graph and a plurality of suspected weapon graphs appear in an overlapping area between two adjacent small blocks in a simulation verification graph; finding out a target lethal graph causing the problem graph from all the suspected lethal graphs; optimizing the target lethal graphs in all the small blocks to obtain an intermediate layout; and performing OPC correction on the intermediate layout so as to greatly reduce the EPE at the edge of the small area and solve the problem that the verification result of the OPC correction is not convergent.

Disclosed herein is a proximity effect correction method based on shape adjustment for fabricating an imaging structure. The imaging structure comprises a bottom layer arranged on a substrate, and a top layer arranged on the upper surface of the bottom layer. The position of a surrounding frame of the top layer is closed to an edge of the bottom layer, which has a width value and a space value between the top and bottom layers. Additionally, the method combines with the use of increased particle beam sizes to improve the throughput, imaging fidelity and contrast of a particle beam lithography system. The method is applicable to any particle beam lithography machine or system, and does not require any internal hardware and software modifications to the machine or system.

Embodiments of this disclosure provide a method, apparatus, and storage medium for electron beam exposure correction. The method includes: determining a first dose distribution for electron beam exposure by performing electron beam proximity effect correction on a target pattern based on a predetermined dose distribution, the first dose distribution indicating a set of dose adjustment values ​​for compensating for scattering effects during electron beam exposure on the target pattern; determining a second dose distribution for electron beam exposure by performing electron beam haze effect correction on the target pattern based on the first dose distribution, the second dose distribution indicating a set of dose adjustment values ​​for compensating for haze effects during electron beam exposure on the target pattern; and determining a target dose distribution for electron beam exposure by performing electron beam proximity effect correction on the target pattern based on the first and second dose distributions.

The invention provides a semiconductor layout processing method and a related product. The method comprises the following steps: acquiring a correction target edge on a semiconductor layout; breaking the corrected target edge for the first time according to a preset length, and performing optical proximity effect correction on the corrected target edge for the first time to obtain a preliminary optimized edge corresponding to the corrected target edge; obtaining a target line segment from the preliminary optimization edge according to the distance between the preliminary optimization edge and the corrected target edge; determining a breaking position on the corrected target edge according to the target line segment and the process limit length; the process limited length is greater than the preset length; and carrying out secondary breaking on the correction target edge according to the breaking position, and carrying out secondary optical proximity effect correction on the correction target edge. According to the scheme, the result difference caused by operation of different engineers is eliminated, any graphic scenes such as corners, ends and straight line segments can be covered in a self-adaptive mode, and the optimization result meeting mask rule inspection is rapidly output.

The present application discloses a method and device for correcting optical proximity effects based on modulation of evanescent wave field intensity attenuation characteristics, relating to the field of photolithography resolution enhancement technology. The method comprises: determining the effective range of action of the near-field optical proximity effect on a target pattern by modeling and analyzing the field intensity attenuation characteristics of the evanescent wave within a photoresist; using the target pattern as an input image for surface plasmon lithography, and determining the accuracy and target compensation exposure dose of a target exposure pattern within the photoresist corresponding to the target pattern under preset exposure conditions; determining an area on the target pattern requiring compensation modulation, and compensating and correcting the near-field optical proximity effect within the effective range based on the target compensation exposure dose to obtain a corrected pattern; using the corrected pattern as an input image, and comparing the contour of the corrected exposure pattern within the photoresist extracted under the preset exposure conditions to determine the accuracy and cost function curve data of the corrected exposure pattern.