40 results about "Ic production" patented technology

The invention relates to the field of integrated circuit production, in particular to a mask process correction method, device and equipment and a storage medium, and the method comprises the steps: receiving an original mask pattern and a target simulation pattern; converting the original mask pattern into a pattern enclosed by a plurality of edge sections; performing analogue simulation on the original mask pattern through a pre-trained correction intensive model to obtain a mask process deviation value corresponding to each edge section; determining an original design deviation value of each edge section according to the original mask pattern and the target simulation pattern; determining an edge placement error corresponding to each edge section according to the original design deviation value and the mask process deviation value; and adjusting the position of the corresponding edge section according to the edge placement error to obtain a corrected mask pattern. According to the method, only the edge section is simulated, so that the running speed is greatly increased, and relatively high calculation precision is also ensured.

The invention provides a layout design method and device, electronic equipment and a storage medium, and is applied to the technical field of computers. According to the method, after candidate risk graphic samples are obtained, sample parameters of the candidate risk graphic samples are adjusted according to production process parameters of an integrated circuit; a target risk graph sample matched with an integrated circuit production process is obtained, a layout and wiring constraint rule is customized based on the target risk graph sample, an initial layout of the integrated circuit is generated according to the layout and wiring constraint rule, the target risk graph is prevented from appearing in the initial layout, and therefore the success rate of layout design is increased. Layout wiring constraint rules are customized before layout wiring, the probability of iterative modification after layout wiring can be effectively reduced, layout design efficiency can be improved, manpower and material resource consumption is saved, the research and development cycle of an integrated circuit is shortened, and actual application requirements are met.

The invention discloses integrated circuit production equipment with a dust removal function, and belongs to the technical field of integrated circuit production, the integrated circuit production equipment comprises a bottom plate, the upper end of the bottom plate is connected with a vertical plate, the side wall of one side of the vertical plate is symmetrically and rotatably connected with two rotating shafts, and the two rotating shafts are jointly provided with a conveying belt; a rotating assembly used for driving the rotating shaft to rotate is installed on the vertical plate, an etching assembly used for circuit board processing is installed on the vertical plate, a mounting frame is connected to the side wall of one side of the vertical plate, a rotating pipe is rotationally installed on the mounting frame, and the rotating pipe is in transmission connection with the rotating shaft through a belt wheel. The circuit board etching device overcomes the defects in the prior art, through mutual cooperation of the conveying belt, the rotating pipe, the sponge sleeve, the fixed cylinder, the water conveying pipe, the spring, the piston, the pulley, the cam and other structures, etching liquid left on a circuit board can be automatically cleaned after the circuit board is etched, the etching liquid is prevented from being solidified and attached to the circuit board, and therefore the circuit board etching device is convenient to use. And the applicability of the device is improved.

The invention discloses a defect coupling low-noise amplifier. The low-noise amplifier solves the problem that the performance of a low-noise amplifier in the prior art is influenced by a grid source inductance coupling coefficient. Forward coupling of an input inductor and a grid inductor and reverse coupling of the input inductor and a source inductor are achieved through a unique defect coupling transformer matching network, meanwhile, reverse coupling of a grid inductor and the source inductor is achieved, and the coupling coefficient of the grid-source inductor is reduced through coupling counteracting inductance; by combining a differential common-source transconductance amplification stage, a four-order magnetic coupling resonance unit, a differential transconductance amplification stage with a neutralizing capacitor and an output transformer matching network, the characteristics of high gain bandwidth and low noise are realized; simulation and actual tests verify that the low-noise amplifier can effectively reduce the noise coefficient and broaden the input matching range, has good compatibility and wide application prospects based on a conventional integrated circuit production process, can be applied to a phased array system, and can also form a receiver system with other circuits.

The utility model discloses a glue dispensing device for integrated circuit packaging, and relates to the technical field of integrated circuit production. The utility model includes a supporting component, including a base, a reinforcing frame arranged on the top of the base, a bracket arranged inside the reinforcing frame, a glue dispensing barrel arranged inside the bracket, and a glue dispensing head arranged at the bottom of the glue dispensing barrel; a heating component, including a moving component arranged inside the bracket, and a heating component arranged inside the moving component. The utility model drives the threaded rod to rotate through the moving component, so that the threaded block moves, and drives the heating component to move, heats the liquid inside the glue dispensing barrel, and softens it quickly, and drives the stirring shaft through the connecting belt to rotate the stirring block, stirs the colloid inside the glue dispensing barrel, heats it evenly, and enables the colloid to soften more quickly.

The present invention relates to the field of integrated circuit production, and in particular to a mask process correction method, device, equipment and storage medium, which receives an original mask pattern and a target simulation pattern; converts the original mask pattern into a figure surrounded by multiple edge segments; simulates the original mask pattern through a pre-trained correction intensive model to obtain mask process deviation values ​​corresponding to each edge segment; determines the original design deviation value of each edge segment according to the original mask pattern and the target simulation pattern; determines the edge placement error corresponding to each edge segment according to the original design deviation value and the mask process deviation value; adjusts the position of the corresponding edge segment according to the edge placement error to obtain a corrected mask pattern. The present invention only simulates the edge segment, which greatly improves the running speed and ensures a high calculation accuracy.

The invention belongs to the technical field of gas treatment, and particularly discloses an advanced treatment process of low-concentration gas in an integrated circuit production process, which comprises the following steps: efficiently and deeply purifying ppm-level propylene glycol methyl ether acetate, isopropanol, methylbenzene, butanone and other organic gases to ppb level through a catalytic oxidation treatment system; the technical problems of high cost, low mineralization rate, long time consumption, low purification degree and easy generation of secondary pollution when the traditional treatment process is used for treating low-concentration gas are effectively solved. The process aims at treatment of low-concentration industrial gas in the integrated circuit production process, high-energy-consumption processes such as concentration are not needed, the degradation rate of direct gas treatment is increased to 99% or above, and the mineralization rate is increased to 95% or above.

The chopper comprises a cylinder component, a cone component and an anti-loosening assembly, and the cone component and the cylinder component are connected through a stud; the anti-loosening assembly is located between the cylinder component and the cone component and comprises two gaskets arranged on the stud in a sleeving mode, the end faces, close to each other, of the two gaskets are clamped through a plurality of first tooth-shaped structures, and the other end faces of the gaskets abut against the cone component or the cylinder component through a plurality of second tooth-shaped structures. When the cone component and the cylinder component are locked and connected through the stud, the cone component and the cylinder component press the two gaskets of the anti-loosening assembly, the gaskets clamp the end face of the cone component or the end face of the cylinder component through the second tooth-shaped structures, the two gaskets are clamped in an engaged mode through the first tooth-shaped structures, and the first tooth-shaped structures can prevent the two gaskets from rotating relatively. The second tooth-shaped structure can prevent the cone component or the cylinder component from rotating, and therefore looseness prevention is achieved. The method can be widely applied to the technical field of integrated circuit production.

This invention relates to the field of semiconductor manufacturing technology, specifically to a low-damage, rapid curing equipment for photoresist in driver IC production, used in semiconductor integrated circuit manufacturing. It includes a main body, a wafer processing chamber, a conveyor belt, and semiconductor wafers. It also includes an ultraviolet (UV) adjustment mechanism, an infrared (IR) adjustment mechanism, an infrared radiation source, a UV radiation source, a linkage mechanism, a zoned curing mechanism, and a reinforcement mechanism. The UV and IR adjustment mechanisms are connected within the wafer processing chamber. The UV and IR radiation sources are respectively connected to the UV and IR adjustment mechanisms. The linkage mechanism is connected to the UV adjustment mechanism. This invention adjusts the power density of the irradiation received by the semiconductor wafer through variations in the infrared ultraviolet radiation intensity. Simultaneously, by using zoned irradiation to cure the photoresist on the semiconductor wafer in zones, it can improve the curing quality of the semiconductor wafer and further enhance its curing efficiency.

The invention discloses an anti-slip surface mounting device for integrated circuit manufacturing, and relates to the technical field of integrated circuit production and processing, the anti-slip surface mounting device comprises a device base, the top of the device base is fixedly provided with an element migration device and an element box, and the top edge of the device base is provided with an operation groove; an operation groove is formed in the device base, anti-sliding devices are fixedly installed on the two sides of the inner wall of the operation groove, a first motor is fixedly installed on the outer surface of the device base through a support, an integrated circuit adsorption device is fixedly installed at the bottom of the device base, and the integrated circuit adsorption device penetrates through the device base and extends into the operation groove. According to the anti-slip chip mounting device for manufacturing the integrated circuit, by arranging the anti-slip device, after chip mounting is completed and the integrated circuit adsorption device is closed, the integrated circuit continues to be kept in the top groove of the anti-slip device, and the purpose of preventing the integrated circuit from falling off is achieved.

The invention provides a circuit board detection device with a combined positioning structure and a use method thereof, and belongs to integrated circuit production equipment.The device comprises a supporting and assembling frame and further comprises a transfer guiding assembly, a board bearing assembly, a transfer driving assembly, an end pin trimming assembly, an end pin guiding and connecting assembly and a board taking and placing assembly; according to the device, a combined positioning structure is adopted, the whole process of transferring, trimming, detecting and sorting can be completed after the circuit board is clamped at a time, accumulative errors caused by multiple times of positioning are avoided, the consistency of end pin trimming and the reliability of electrical testing are ensured, full-automatic line production is achieved, and the production efficiency is improved. High-speed precise transfer is achieved through servo driving and precise guiding, the production efficiency is greatly improved, meanwhile, secondary damage caused by manual operation is avoided, through the modular bearing design and the parameterized control system, the circuit board transfer device can be rapidly matched with circuit boards of different models, the flexible production requirement is met, the overall structure rigidity is good, and operation is stable.

The invention relates to the technical field of integrated circuit production, in particular to rotating disc type pre-stacking equipment which comprises a first feeding mechanism, a second feeding mechanism, a third feeding mechanism, a material moving mechanism and a rotating disc mechanism. The first feeding mechanism, the second feeding mechanism, the third feeding mechanism and the material moving mechanism are sequentially arranged in the rotating direction of the rotating disc mechanism. A traditional combination table for pre-stacking is replaced with the rotary disc mechanism, the rotary disc mechanism is used for enabling the fixing modules to pass through the first feeding mechanism, the second feeding mechanism, the third feeding mechanism and the material moving mechanism one by one, and therefore the effect of synchronous movement of the multiple mechanisms is achieved, and the pre-stacking efficiency is further improved.

The present invention relates to the technical field of integrated circuit production, and specifically discloses a device for dotting the surface of integrated circuits after screening, comprising a motor, the motor being arranged at the upper end of a slide rail slider fixed vertical plate, the lower end of the slide rail slider fixed vertical plate being provided with a lower synchronous wheel adjustment block, the lower synchronous wheel adjustment block being provided with a lower synchronous wheel, the motor being connected to an upper synchronous wheel, a synchronous belt being installed between the upper synchronous wheel and the lower synchronous wheel, a slide rail slider being installed on the slide rail slider fixed vertical plate, a component fixing plate being slidably installed on the slide rail slider, the component fixing plate being fixed to one side of the synchronous belt by a synchronous belt buckle, a dotting pen mechanism being installed on the outer side of the component fixing plate, the dotting pen mechanism including a dotting pen, and the synchronous belt being able to drive the component fixing plate to move along the slide rail slider when the synchronous belt moves, thereby driving the dotting pen to move to dot the surface of the integrated circuit. The present invention also discloses a method for using the device for dotting the surface of integrated circuits after screening. The present invention can significantly improve dotting efficiency and quality.

The invention relates to the technical field of production and manufacturing data acquisition, analysis and processing of integrated circuits, and particularly discloses a data acquisition and processing method and system based on the Internet of Things. According to the method, the links of wafer base material production, photoetching, etching, ion implantation, thin film deposition, packaging and testing in the integrated circuit production and preparation process are monitored and analyzed, and unqualified products in all the preparation procedures are screened in a classified mode and subjected to closed-loop treatment through geometric modeling, a similarity algorithm, a Logistic regression model and other algorithms; according to the invention, real-time monitoring of the whole process of integrated circuit production and manufacturing is realized, the quality of each process is accurately managed and controlled, invalid loss is reduced, the yield, performance consistency and reliability of the integrated circuit are improved, large-scale production is supported, and problems existing in each process in the process of integrated circuit production and preparation are effectively avoided.

The invention relates to the field of integrated circuit production and manufacturing, in particular to integrated circuit PCB machining equipment and a working method thereof.The integrated circuit PCB machining equipment comprises a copper-clad tank, the copper-clad tank is filled with an electrolyte solution used for connecting through hole copper cladding of all layers of circuits in a multi-layer PCB, and the electrolyte solution is filled with an electrolyte solution used for connecting through hole copper cladding of all layers of circuits in the multi-layer PCB. A circuit board loading device is fixedly erected at the upper end of the copper-clad groove, a copper-clad moving plate is slidably connected to the bottom face of the copper-clad groove, a plurality of copper-clad mounting rods are mounted on the copper-clad moving plate, copper-clad mounting parts are fixedly mounted at the ends, facing the middle position of the copper-clad groove, of the copper-clad mounting rods, and copper-clad sheets are filled on the copper-clad mounting parts. The problems that in the prior art, in the hole filling process, procedures are complex, and cost is high can be solved.

The invention provides an enclosure-frame-free potting method for an integrated circuit. The method comprises the following steps: step 1, putting the integrated circuit into an upper enclosure frame in a potting tool; step 2, connecting the pins of the integrated circuit with the pin fixing strips; step 3, after the integrated circuit is turned over, the integrated circuit is placed in a lower enclosure frame of the potting tool; and step 4, instilling the prepared pouring sealant into the lower enclosure frame, and taking out the lower enclosure frame after the pouring sealant is cured, thereby completing enclosure-frame-free encapsulation of the integrated circuit. The method has the advantages of simple steps, convenient operation, light structure of the encapsulation tool, low preparation cost, effective reduction of the production cost of the integrated circuit, and effective suitability for small-batch product processing.

The invention relates to the technical field of micro-nano electronic integrated circuits, and provides an integrated balanced three-valued phase inverter and a circuit of a hybrid memristor CMOS (Complementary Metal Oxide Semiconductor), which realize higher integration density and area efficiency, remarkably reduce static power consumption, inhibit signal attenuation during cascading and ensure reliable transmission of a multi-stage logic chain by adopting back-end integration of the memristor and the CMOS, so that the reliability of the integrated balanced three-valued phase inverter of the hybrid memristor CMOS is improved, and the service life of the integrated balanced three-valued phase inverter of the hybrid memristor CMOS is prolonged. And compared with the traditional design, the number of devices is reduced, the power consumption is lower, the integration level is high, and the practical logic unit with high performance and low power consumption is realized. A standard CMOS process and the memristor integrated in the later stage are adopted, an additional mask layer is not needed for memristor preparation, the memristor can be directly introduced into an existing integrated circuit production line, and the industrialization cost is reduced; the three-valued phase inverter is compatible with an existing EDA tool, can be used for directly replacing a three-valued phase inverter in a traditional integrated circuit, has nonvolatile storage and logical operation capacity, and is adaptive to various application scenes such as storage and calculation integration and neuromorphic calculation.

An embodiment of the present application provides a data analysis method and related device, including: determining a current site among each site of the WIP data; obtaining a current wafer production cycle of the current site and a current site anomaly judgment model, where the current wafer production cycle is each wafer production cycle of the current site in the WIP data, and the current site anomaly judgment model is a site anomaly judgment model of the current site that has been pre-trained; using the current site anomaly judgment model, when it is determined that the current wafer production cycle includes an abnormal wafer production cycle, obtaining the abnormal wafer production cycle and determining that the predicted status information of the current site is abnormal. The data analysis method and related device provided by the embodiments of the present application can improve the accuracy and real-time performance of integrated circuit production data analysis.

The invention relates to the technical field of integrated circuit production, in particular to integrated circuit defect detecting and sorting equipment and method.The integrated circuit defect detecting and sorting equipment comprises an equipment support, a feeding mechanism is arranged at one corner of the top of the equipment support, a center rotating mechanism is arranged at the center of the top of the equipment support, and a supporting frame is arranged on the equipment support; a detection pressing mechanism is arranged in the supporting frame, the detection pressing mechanism is located above the center rotating mechanism, and a rotating limiting mechanism is arranged at the bottom of the detection pressing mechanism; according to the invention, automatic alignment is carried out on the rotating disc through the rotating limiting mechanism before downward pressing detection, so that an integrated circuit at the bottom of the negative pressure suction head is ensured to be accurately located at a corresponding detection position, detection alignment is more accurate, and the situation of invalid detection is avoided; the one-way heat dissipation mechanism seals the hot-pressing part, dust is prevented from entering the hot-pressing part, and meanwhile, accumulated heat is dissipated through heat exchange, so that material deformation caused by overheating of the hot-pressing area is avoided.

The utility model relates to the technical field of integrated circuit production, and discloses a feeding device for integrated circuit production, which comprises a bearing table, belt type conveying equipment main bodies are embedded in the bearing table, a placement groove is arranged between the two belt type conveying equipment main bodies in the bearing table, a protective shell is fixedly arranged at the top end of the bearing table, and the protective shell is arranged in the placement groove. A cleaning mechanism is arranged in the protective shell; and the cleaning mechanism comprises an ion wind bar. According to the feeding device based on integrated circuit production, through the design of the cleaning mechanism and the abutting mechanism, static electricity elimination and cleaning can be conducted on a substrate in the conveying process at the same time, cleaning can be efficiently conducted under the condition that static electricity is lost, dust is prevented from adsorbing the substrate, and cleaning needs to be conducted again when electronic elements are welded or installed in the later period; and meanwhile, the phenomenon that the electrostatic elimination effect and the dust cleaning effect are affected due to the fact that the substrates are stacked and stacked in the conveying process can be avoided.

The utility model relates to the technical field of integrated circuits, and discloses an operating platform for integrated circuit production, which comprises a base, an electric push rod is fixedly arranged at the upper end of the top wall of the base, a workbench is fixedly arranged at the upper end of the top wall of the electric push rod, and a fixing groove is formed in the top wall of the workbench. A moving assembly is arranged in the fixing groove. The moving assembly comprises a lead screw, a moving block, a positive and negative rotation motor and a fixing plate, and a motor box is fixedly arranged on the right side wall of the top end of the workbench. The forward and reverse rotation motor drives the lead screw to rotate, so that the moving block is driven to move left and right, the effect of driving the dust suction port to move left and right is finally achieved, the better cleaning effect and the better cleaning coverage area are achieved, the situation that a plurality of dust suction ports are formed is avoided, and the problem that due to the fact that a single dust suction port cannot move, the dust suction port cannot move is solved. And meanwhile, an electric push rod is arranged, so that the device can adapt to users with different heights.

The invention relates to the technical field of integrated circuit production equipment, in particular to integrated circuit manufacturing equipment and a method thereof.The integrated circuit manufacturing equipment comprises an operation platform and a storage base table, the manufacturing equipment further comprises a cutting assembly capable of reducing burrs generated by cutting, and the cutting assembly comprises a mounting frame capable of adjusting the height; a mounting table capable of moving up and down is mounted at the bottom end of the mounting frame, an extending plate is mounted on the mounting table, and a position adjusting assembly is arranged at the top end of the extending plate. The situation that many burrs appear on the cut surface of the base plate in the long-time cutting process due to the fact that the base plate is cut only through one cutter head is avoided.

The invention relates to integrated circuit production, in particular to integrated circuit production equipment with a corner protection structure, which comprises a device main body, a rectangular groove is formed in the surface of the device main body, a placement panel is located at the upper end of the rectangular groove, a servo motor is started at the moment, and the servo motor drives a first connecting column and a bidirectional screw rod to rotate; the two four-corner protection frames can protect the corners of the circuit board, the problem of uneven stress caused by installation deviation of a traditional clamp is avoided, the corner extrusion risk caused by asymmetry of left and right clamping force is solved, when the long block is moved to drive the four-corner protection frames to be close synchronously, the four-corner protection frames on the two sides can cover the corners of the circuit board, and therefore the circuit board is protected. The inner sides of the four-corner protection frames are made of elastic materials, when the four-corner protection frames make contact with a circuit board, concentrated pressure directly applied by a clamp originally can be converted into evenly-distributed surface contact force, stress is dispersed to larger areas of corners through the design, local pressure is prevented from exceeding a material strength threshold value, and therefore cracks or corner chipping is prevented.

Method for fabricating an integrated circuit (IC) with a multilayer interconnect structure, the method comprising: providing a substructure (28) with an N-th dielectric (27, 50) formed thereon, in or on which a two-plane interconnect structure is to be formed with first (22) and second (23) lower conductors MN(22, 23), a first upper conductor Mn+1(34) and a connecting contact feedthrough VN+1 / N(36), wherein the N-th dielectric (27, 50) comprises a dielectric layer (27) and a cover layer (50) formed on an upper surface (271) of the dielectric layer (27); forming the first and second lower conductors MN(22, 23) in the N-th dielectric (27, 50) on the substructure (28), wherein a recessed upper surface (61) of each of the first and second lower conductors MN(22, 23) is lowered to below an upper surface (56) of the cover layer (50), the formation of which is an etching of recesses (105, 106),extending through the cover layer (50) into the dielectric layer (27), comprising filling the recesses (105, 106) with a conductor material (60) and recessing an upper surface of the conductor material (60) filled into the recesses (106, 106) to provide the recessed upper surface (61) in each of the recesses (105, 106); forming an (N+1)-th dielectric (58, 25, 70) over the N-th dielectric (27, 50) and the recessed upper surfaces (61) of the first and second lower conductors MN(22, 23); etching an (N+1)-th recess (1263) through the (N+1)-th dielectric (58, 25, 70) from a desired position of the first upper conductor MN+1(34) from and exposing the lowered upper surface (61) of the first lower conductor MN(22); and filling the (N+1)th recess (1263) with an electrical conductor material (80) suitable,to form the first upper conductor Mn+1(34) and the contact bushing VN+1 / N(36) and to establish an electrical contact with the recessed upper surface (61) of the first lower conductor MN(22), wherein an upper region of the contact bushing VN+1 / N(36) is self-aligned to the first upper conductor MN+1(34) and a lower region (362) of the contact bushing VN+1 / N(36) is self-aligned to the lower conductor MN(22), wherein the integrated circuit (IC) further comprises a lateral step in the contact bushing VN+1 / N(36) at which the upper region and the lower region of the contact bushing VN+1 / N(36) meet, and wherein the first lower conductor MN(22) is connected to the contact bushing VN+1 / N(36) and the lateral step in the contact bushing VN+1 / N(36) is separated from the second lower conductor MN(22). conductor MN(23) is separated by a first distance (37) which is larger than a second distance (31),under which the second lower conductor MN(23) would be arranged in the same plane as the upper area of ​​the contact bushing VN+1 / N(36).

The invention relates to the technical field of integrated circuit production and processing, and discloses packaging equipment for integrated circuit production and processing and a production process thereof, and the equipment comprises a supporting part, a lower packaging part is arranged at the center of the upper surface of the supporting part, an upper packaging part is arranged on the upper surface of the lower packaging part, and a fixing part is arranged right above the upper packaging part. Limiting pieces are installed around the center of the upper surface of the supporting piece, stripping pieces are connected to the center and the periphery of the bottom of an inner cavity of the lower packaging piece in an inserted mode, and the bottom ends of the stripping pieces penetrate through the supporting piece and extend downwards. A telescopic part is arranged in the center of the upper surface of the fixing part, the telescopic end of the telescopic part penetrates through the fixing part to be connected with the upper packaging part, and the periphery of the lower surface of the fixing part is attached to the top end of the limiting part; the lower portion of the outer surface of the stripping piece is sleeved with a reset piece, and the top end and the bottom end of the reset piece are attached to the lower surface of the supporting piece and the upper surface of the connecting piece respectively. The back center of the supporting member is rotatably connected with a rotating member.

The utility model relates to the technical field of integrated circuit production, and discloses a movable material distributing device for integrated circuit production, which comprises a conveying belt, the front side of the conveying belt is fixedly connected with a mounting plate, the top of the mounting plate is rotatably connected with a rotating disc, and a plurality of clamping grooves are formed outside the rotating disc. A limiting rod is fixedly connected to the interior of the rotating disc, a connecting disc is fixedly connected to the top of the limiting rod, a plurality of stop rods are fixedly connected to the exterior of the connecting disc, a fixing plate is fixedly connected to the front side of the conveying belt, and a driving assembly for generating power is fixedly connected to the top of the fixing plate; the bottom of the driving assembly is fixedly connected with a connecting piece. According to the utility model, when the connecting sheet and the top block are not in contact with the clamping rod, the torsion spring drives the clamping rod to be clamped with the clamping groove again to limit a single material. Gaps between integrated circuit materials are adjusted, accumulation of the materials during processing is prevented, and processing efficiency and quality are improved.

The invention relates to the technical field of micro-nano electronic complex logic circuits, and provides a logic gate circuit of a hybrid memristor CMOS (Complementary Metal Oxide Semiconductor) and a complex logic circuit, the memristor is integrated with the rear end of the CMOS, the additional substrate area is not occupied, and the data density is improved by 1.58 times compared with that of a traditional CMOS binary circuit. A CMOS complementary circuit structure is adopted, static power consumption is remarkably reduced, signal attenuation during cascading is restrained, reliable transmission of a multi-stage logic chain is ensured, compared with a traditional design, the number of devices is reduced, power consumption is lower, the integration degree is high, and a practical logic unit with high performance and low power consumption is achieved. According to the memristor adopting the standard CMOS process and post-integration, an additional mask layer is not needed in preparation of the memristor, the memristor can be directly imported into an existing integrated circuit production line, the industrialization cost is reduced, and the memristor is compatible with an existing EDA tool and has the practical tape-out potential.

The present application relates to the field of integrated circuit production, in particular to a layout difference processing method, device, equipment and storage medium, by receiving Mebes original layout and Mebes modified layout, difference analysis is carried out on the Mebes modified layout and the Mebes original layout, and Mebes difference is obtained, the difference value of each Mebes difference is determined, the Mebes difference is clustered, a plurality of difference clusters are obtained, and the Mebes difference with the largest difference value is taken as the class representative Mebes difference of the corresponding difference cluster, and the class representative Mebes difference is checked to complete the layout difference processing. The Mebes difference of the same inducement is combined, the number of Mebes differences needing to be checked is greatly reduced, the time required for difference processing is shortened, the checking efficiency is improved, and accurate difference value is provided, and the accuracy of subsequent correction is guaranteed.

The present invention relates to the technical field of integrated circuit production, and discloses a packaging device for integrated circuit production, including an integrated circuit cleaning box, wherein the interior of the integrated circuit cleaning box 1 is provided with a cleaning mesh tray, and the exterior of the cleaning mesh tray is provided with a tray connecting block fixedly connected to the exterior of the cleaning mesh tray, the bottom of the tray connecting block is fixedly connected to a trigger column, the bottom of the tray connecting block is fixedly connected to a spring, and the bottom of the spring is provided with a sensor; the present invention is advantageous in that the gravity of the cleaning mesh tray inside the integrated circuit cleaning box when the integrated circuit board is placed is controlled to blow out strong wind from a blower for cleaning, and after a cleaning procedure predetermined by the program, the integrated circuit board is automatically sent for packaging, thereby facilitating automatic cleaning of the integrated circuit before packaging, thereby improving the packaging quality of the equipment and optimizing the operator's use experience.

The invention provides an integrated circuit production system based on intelligent manufacturing. The integrated circuit production system comprises a clamping mechanism, a cutting module and a transferring module, wherein the clamping mechanism is used for adaptively clamping and fixing a circuit board of an integrated circuit; the cutting module is used for cutting the circuit board clamped and fixed by the clamping mechanism to obtain a target circuit board with a preset specification; and the transferring module is used for orderly transferring the target circuit board obtained by cutting. According to the invention, automatic transfer and transportation of the target circuit board are realized, manual intervention is reduced, and production efficiency and consistency are improved.