13 results about "Ic production" patented technology

This invention relates to the field of semiconductor manufacturing technology, specifically to a low-damage, rapid curing equipment for photoresist in driver IC production, used in semiconductor integrated circuit manufacturing. It includes a main body, a wafer processing chamber, a conveyor belt, and semiconductor wafers. It also includes an ultraviolet (UV) adjustment mechanism, an infrared (IR) adjustment mechanism, an infrared radiation source, a UV radiation source, a linkage mechanism, a zoned curing mechanism, and a reinforcement mechanism. The UV and IR adjustment mechanisms are connected within the wafer processing chamber. The UV and IR radiation sources are respectively connected to the UV and IR adjustment mechanisms. The linkage mechanism is connected to the UV adjustment mechanism. This invention adjusts the power density of the irradiation received by the semiconductor wafer through variations in the infrared ultraviolet radiation intensity. Simultaneously, by using zoned irradiation to cure the photoresist on the semiconductor wafer in zones, it can improve the curing quality of the semiconductor wafer and further enhance its curing efficiency.

The invention discloses an anti-slip surface mounting device for integrated circuit manufacturing, and relates to the technical field of integrated circuit production and processing, the anti-slip surface mounting device comprises a device base, the top of the device base is fixedly provided with an element migration device and an element box, and the top edge of the device base is provided with an operation groove; an operation groove is formed in the device base, anti-sliding devices are fixedly installed on the two sides of the inner wall of the operation groove, a first motor is fixedly installed on the outer surface of the device base through a support, an integrated circuit adsorption device is fixedly installed at the bottom of the device base, and the integrated circuit adsorption device penetrates through the device base and extends into the operation groove. According to the anti-slip chip mounting device for manufacturing the integrated circuit, by arranging the anti-slip device, after chip mounting is completed and the integrated circuit adsorption device is closed, the integrated circuit continues to be kept in the top groove of the anti-slip device, and the purpose of preventing the integrated circuit from falling off is achieved.

The invention provides a circuit board detection device with a combined positioning structure and a use method thereof, and belongs to integrated circuit production equipment.The device comprises a supporting and assembling frame and further comprises a transfer guiding assembly, a board bearing assembly, a transfer driving assembly, an end pin trimming assembly, an end pin guiding and connecting assembly and a board taking and placing assembly; according to the device, a combined positioning structure is adopted, the whole process of transferring, trimming, detecting and sorting can be completed after the circuit board is clamped at a time, accumulative errors caused by multiple times of positioning are avoided, the consistency of end pin trimming and the reliability of electrical testing are ensured, full-automatic line production is achieved, and the production efficiency is improved. High-speed precise transfer is achieved through servo driving and precise guiding, the production efficiency is greatly improved, meanwhile, secondary damage caused by manual operation is avoided, through the modular bearing design and the parameterized control system, the circuit board transfer device can be rapidly matched with circuit boards of different models, the flexible production requirement is met, the overall structure rigidity is good, and operation is stable.

The invention relates to the technical field of micro-nano electronic integrated circuits, and provides an integrated balanced three-valued phase inverter and a circuit of a hybrid memristor CMOS (Complementary Metal Oxide Semiconductor), which realize higher integration density and area efficiency, remarkably reduce static power consumption, inhibit signal attenuation during cascading and ensure reliable transmission of a multi-stage logic chain by adopting back-end integration of the memristor and the CMOS, so that the reliability of the integrated balanced three-valued phase inverter of the hybrid memristor CMOS is improved, and the service life of the integrated balanced three-valued phase inverter of the hybrid memristor CMOS is prolonged. And compared with the traditional design, the number of devices is reduced, the power consumption is lower, the integration level is high, and the practical logic unit with high performance and low power consumption is realized. A standard CMOS process and the memristor integrated in the later stage are adopted, an additional mask layer is not needed for memristor preparation, the memristor can be directly introduced into an existing integrated circuit production line, and the industrialization cost is reduced; the three-valued phase inverter is compatible with an existing EDA tool, can be used for directly replacing a three-valued phase inverter in a traditional integrated circuit, has nonvolatile storage and logical operation capacity, and is adaptive to various application scenes such as storage and calculation integration and neuromorphic calculation.

The utility model relates to the technical field of integrated circuit production, and discloses a feeding device for integrated circuit production, which comprises a bearing table, belt type conveying equipment main bodies are embedded in the bearing table, a placement groove is arranged between the two belt type conveying equipment main bodies in the bearing table, a protective shell is fixedly arranged at the top end of the bearing table, and the protective shell is arranged in the placement groove. A cleaning mechanism is arranged in the protective shell; and the cleaning mechanism comprises an ion wind bar. According to the feeding device based on integrated circuit production, through the design of the cleaning mechanism and the abutting mechanism, static electricity elimination and cleaning can be conducted on a substrate in the conveying process at the same time, cleaning can be efficiently conducted under the condition that static electricity is lost, dust is prevented from adsorbing the substrate, and cleaning needs to be conducted again when electronic elements are welded or installed in the later period; and meanwhile, the phenomenon that the electrostatic elimination effect and the dust cleaning effect are affected due to the fact that the substrates are stacked and stacked in the conveying process can be avoided.

The invention relates to the technical field of integrated circuit production equipment, in particular to integrated circuit manufacturing equipment and a method thereof.The integrated circuit manufacturing equipment comprises an operation platform and a storage base table, the manufacturing equipment further comprises a cutting assembly capable of reducing burrs generated by cutting, and the cutting assembly comprises a mounting frame capable of adjusting the height; a mounting table capable of moving up and down is mounted at the bottom end of the mounting frame, an extending plate is mounted on the mounting table, and a position adjusting assembly is arranged at the top end of the extending plate. The situation that many burrs appear on the cut surface of the base plate in the long-time cutting process due to the fact that the base plate is cut only through one cutter head is avoided.

The invention relates to the technical field of integrated circuit production and processing, and discloses packaging equipment for integrated circuit production and processing and a production process thereof, and the equipment comprises a supporting part, a lower packaging part is arranged at the center of the upper surface of the supporting part, an upper packaging part is arranged on the upper surface of the lower packaging part, and a fixing part is arranged right above the upper packaging part. Limiting pieces are installed around the center of the upper surface of the supporting piece, stripping pieces are connected to the center and the periphery of the bottom of an inner cavity of the lower packaging piece in an inserted mode, and the bottom ends of the stripping pieces penetrate through the supporting piece and extend downwards. A telescopic part is arranged in the center of the upper surface of the fixing part, the telescopic end of the telescopic part penetrates through the fixing part to be connected with the upper packaging part, and the periphery of the lower surface of the fixing part is attached to the top end of the limiting part; the lower portion of the outer surface of the stripping piece is sleeved with a reset piece, and the top end and the bottom end of the reset piece are attached to the lower surface of the supporting piece and the upper surface of the connecting piece respectively. The back center of the supporting member is rotatably connected with a rotating member.

The invention relates to the technical field of micro-nano electronic complex logic circuits, and provides a logic gate circuit of a hybrid memristor CMOS (Complementary Metal Oxide Semiconductor) and a complex logic circuit, the memristor is integrated with the rear end of the CMOS, the additional substrate area is not occupied, and the data density is improved by 1.58 times compared with that of a traditional CMOS binary circuit. A CMOS complementary circuit structure is adopted, static power consumption is remarkably reduced, signal attenuation during cascading is restrained, reliable transmission of a multi-stage logic chain is ensured, compared with a traditional design, the number of devices is reduced, power consumption is lower, the integration degree is high, and a practical logic unit with high performance and low power consumption is achieved. According to the memristor adopting the standard CMOS process and post-integration, an additional mask layer is not needed in preparation of the memristor, the memristor can be directly imported into an existing integrated circuit production line, the industrialization cost is reduced, and the memristor is compatible with an existing EDA tool and has the practical tape-out potential.

The present application relates to the field of integrated circuit production, in particular to a layout difference processing method, device, equipment and storage medium, by receiving Mebes original layout and Mebes modified layout, difference analysis is carried out on the Mebes modified layout and the Mebes original layout, and Mebes difference is obtained, the difference value of each Mebes difference is determined, the Mebes difference is clustered, a plurality of difference clusters are obtained, and the Mebes difference with the largest difference value is taken as the class representative Mebes difference of the corresponding difference cluster, and the class representative Mebes difference is checked to complete the layout difference processing. The Mebes difference of the same inducement is combined, the number of Mebes differences needing to be checked is greatly reduced, the time required for difference processing is shortened, the checking efficiency is improved, and accurate difference value is provided, and the accuracy of subsequent correction is guaranteed.

The invention provides an integrated circuit production system based on intelligent manufacturing. The integrated circuit production system comprises a clamping mechanism, a cutting module and a transferring module, wherein the clamping mechanism is used for adaptively clamping and fixing a circuit board of an integrated circuit; the cutting module is used for cutting the circuit board clamped and fixed by the clamping mechanism to obtain a target circuit board with a preset specification; and the transferring module is used for orderly transferring the target circuit board obtained by cutting. According to the invention, automatic transfer and transportation of the target circuit board are realized, manual intervention is reduced, and production efficiency and consistency are improved.

The invention provides an integrated circuit production line management system based on the Internet of Things. The integrated circuit production line management system comprises a transportation module for transporting produced integrated circuits, a turn-over module for turning over the integrated circuits on the transportation module, and a receiving module which is arranged adjacent to the transportation module and is used for receiving the integrated circuits transported by the transportation module, the image acquisition module is used for performing image acquisition on the integrated circuit on the transportation module; and the quality analysis module is used for analyzing and judging image information shot by the image acquisition module so as to analyze the quality condition of the integrated circuit. According to the invention, the production quality of the integrated circuit can be monitored, so that a worker can take measures in time, the defective rate is reduced, the production efficiency and consistency are improved, and batch production of unqualified products can be avoided.

The utility model discloses an integrated circuit packaging testing device in the technical field of integrated circuit production, which comprises an installation box body, an installation groove is arranged at the upper end of the installation box body, two fixing frames are arranged on the inner walls of the two sides of the installation groove, and detection structures are arranged in the two fixing frames. The detection structure comprises two mounting plates, a plurality of slots, a plurality of conductive components and two mounting bolts; the mounting plate is fixed in an embedded fixing mode, when the integrated circuit is tested, the specification of the mounting plate can be quickly changed according to the integrated circuits of different specifications, and the packaging test requirements of the integrated circuits of multiple specifications can be met; according to the integrated circuit testing device, the pushing structure is matched with the clamping structure, the upper end of the integrated circuit is pressed through the gravity of the pressing pushing block, the integrated circuit can be rapidly fixed during testing, the pushing structure and the clamping structure can be adjusted, and the integrated circuits of different specifications can be adjusted and fixed.

The present application relates to the field of integrated circuit production, in particular to a layout difference processing method, device, equipment and storage medium, by receiving Mebes original layout and Mebes modified layout, difference analysis is carried out on the Mebes modified layout and the Mebes original layout, and Mebes difference is obtained, the difference value of each Mebes difference is determined, the Mebes difference is clustered, a plurality of difference clusters are obtained, and the Mebes difference with the largest difference value is taken as the class representative Mebes difference of the corresponding difference cluster, and the class representative Mebes difference is checked to complete the layout difference processing. The Mebes difference of the same inducement is combined, the number of Mebes differences needing to be checked is greatly reduced, the time required for difference processing is shortened, the checking efficiency is improved, and accurate difference value is provided, and the accuracy of subsequent correction is guaranteed.