The present application relates to the technical field of piezoelectric
crystal, and particularly relates to a roughening
processing method for the back surface of an ultrathin
lithium tantalate wafer, which comprises the following steps: a) protecting the front surface of the
lithium tantalate wafer by pasting a film; b) heating and sandblasting
abrasive, and baking the sandblasting
abrasive; c) starting the rotation of a sandblasting platform, adjusting the distance between the sandblasting gun and the
lithium tantalate wafer, adjusting the sandblasting pressure to 0.2-0.3 Mpa, and performing first roughening
processing on the back surface of the wafer; d) after the first roughening
processing is completed, removing the sandblasting particle residues attached to the surface of the wafer, readjusting the sandblasting pressure to 0.1-0.15 Mpa, and performing second roughening processing on the back surface of the wafer; e) after the second roughening processing is completed, immersing the wafer in a
mixed solution tank of
hydrofluoric acid and
nitric acid, then immersing the wafer in a
warm water tank for ultrasonic cleaning, then immersing the wafer in a normal temperature tank for ultrasonic cleaning, and finally immersing the wafer in an overflow tank to complete wafer cleaning.