The invention provides a method for coarsening the surface of a
gallium nitride (GaN)-based light-emitting
diode (LED) epitaxial
wafer, which comprises the following steps of: (1) preparing an epitaxial
wafer, growing a nucleating layer on a substrate epitaxially, growing a GaN buffer layer, an N-type GaN layer, a luminescent layer multi-
quantum well structure, a P-type AlGaN layer and a P-type GaN layer on the nucleating layer sequentially, wherein the growth of the P-type GaN layer is divided into two parts; (2) preparing solution of
hydrofluoric acid (HF); (3)
welding a Pt lead serving as a positive
electrode on the surface of the P-type GaN layer by using
metal, and connecting a
Pt electrode serving as a negative
electrode with the HF solution prepared in the step (2); (4) connecting a power supply of 10 to 50 V between the positive
electrode and the negative electrode; and (5) corroding, so that an obvious coarsening graph is formed on the surface of the P-type GaN layer. In the method, the coarsened surface of the GaN-based LED epitaxial
wafer is prepared by changing the epitaxial growth condition and combining photo-electrochemical (PEC)
etching, a process is simple, and the cost is reduced, the coarsening effect is obvious, the light extraction efficiency is high, and the damage of
dry etching or high-temperature
corrosion to
quantum wells is prevented simultaneously.