The invention relates to a high-temperature self-stabilization ferroelectric domain wall memory based on
bismuth oxide (BFO) and a preparation method thereof, a memory function layer is formed by sequentially depositing an STO buffer layer with the thickness of 5 nm, a BFO film with the thickness of 100 nm and a planar
Pt electrode pair on a
strontium titanate (STO) substrate in the [001] direction, the STO substrate is obliquely
cut by 0.2 degree in the [100] direction, the BFO film is of a stripe domain structure, and the
electrode gap is not smaller than 500 nm. Through the limiting effect of a beveled substrate step, the BFO ferroelectric film only forms two polarization orientations, a periodic stripe domain structure is obtained, the polarization overturning
controllability is improved, the
electrode is prepared by adopting an
electron beam photoetching and
ion etching combined process, the electric domain overturning is ensured to penetrate through the film thickness, and the performance of the BFO ferroelectric film is improved. After 105 times of
voltage pulse cycles at a high temperature of 135 DEG C, the device still keeps a rectification ratio greater than or equal to 25: 1, the turnover polarization retentivity is high, and the domain wall current attenuation rate is small. The
bottleneck that a traditional FeRAM fails in a high-temperature environment is broken through, the storage density potential is larger than 1 Gb, and the FeRAM has the effect of being suitable for high-temperature application scenes such as
aerospace, vehicle-mounted
electronics and geothermal exploration.