Silicon-based coplanar micro-gas sensor chip and its application in micro-gas sensor preparation

Abstract

Belonging to the technical field of micro-nano electronic devices, the invention specifically relates to a silicon-based coplanar low-power micro-gas sensor chip and its application in micro-gas sensor preparation, wherein, the sensor chip is founded on a silicon substrate, and a heating electrode and a signal electrode coexist on one medium plane. And the prepared sensor of the above structure can realize operation at a low temperature. The micro-gas sensor chip is prepared by the steps of: preparing an SiO2 insulating layer on an Si substrate in (100) crystal orientation with a routine thermal oxidation method; employing a semiconductor plane technology to sputter a Ti adhesion layer and a Pt electrode layer (the heating electrode and the signal electrode) in order on the SiO2 insulating layer; then conducting photoetching and scribing so as to obtain a coplanar micro-gas sensor chip. The gas sensor chip prepared in the invention has low power consumption and is far superior to cantilever beam micro-sensors. The micro-gas sensor chip provided in the invention has the advantages of simple technology, low cost, low power consumption and easy integration.

Description

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AI Technical Summary

Benefits of technology

This technology allows for easy creation of small devices called sensors by making them more reliable at lower costs than traditional methods like thermocouple or resistance wire. These sensing elements are tiny parts on one side only, allowing it to measure temperatures up to 230°C without being affected by external factors such as pressure changes. They have strong connections between themselves but they cannot easily break down if bent too much force during use. Overall this design improves their durability over time while reducing overall productivity.

Problems solved by technology

This patented describes how current methods for making MEMS devices can be improved with smaller sizes while maintaining good electrical conductivity without increasing energy usage. One method involves creating tiny bending arms that block off some parts from being able to transmit thermal signals effectively. Another approach suggests placing these minute hotplates and signal elecrodes onto one side of the device instead of just overall improving its overall functionality through reduction of power consumed. Additionally, there may exist issues related to manufacturing stability during fabricating integrated circuits containing these components.

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