The application belongs to the field of smart fibers and
flexible electronics, and relates to an
integrated circuit fiber and a preparation method thereof. The
fiber contains electronic components integrated in a
single fiber, and the electronic components are composed of multiple functional
layers serving as components of the
fiber and extending along the axial direction of the fiber. The
integrated circuit fiber includes two types of integration schemes: one is a two-dimensional grid structure of multiple electronic components arranged radially side by side, and the electronic components can be electrically interconnected or isolated; the other is a radial stacking structure of a single
electronic component, which can be adapted to five types of functional units, including
electroluminescence, resistance-
capacitance processing,
capacitance sensing, transistors and organic electrochemical diodes. The preparation method comprises the following steps: a multi-channel
microfluidic chip is used, multiple
spinning solutions are injected into different channels, the
spinning solutions in some channels are periodically turned on and off, the flow rates of the channels are independently controlled, the solutions are combined to form a multi-layer laminar flow structure, and the product is obtained through solidification in a coagulation bath, cleaning and
drying. The application realizes high-density and high-stability functional integration in a
single fiber.