Ceramic substrate, ceramic heater, electrostatic chuck and wafer prober for use in semiconductor producing and inspecting devices

a ceramic heater and ceramic substrate technology, applied in the direction of ohmic-resistance heating, hot plate heating arrangement, semiconductor/solid-state device testing/measurement, etc., to achieve the effect of reducing the insulation resistance and reducing the deposition of ceramic particles thereon
US20050029244A1Inactive Publication Date: 2005-02-10IBIDEN CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
IBIDEN CO LTD
Publication Date
2005-02-10
Estimated Expiration
Not applicable · inactive patent

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Abstract

A ceramic substrate for semiconductor manufacture and / or inspection which is conducive to decrease in α-rays radiated, to prevent electrical errors, and to decrease an electrostatic chucking force such as heater or wafer prober, generation of particles, and circuit defects. The ceramic substrate is configured such that the level of α-rays radiated from the surface of the ceramic substrate is not higher than 0.250 c / cm2·hr.
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Description

TECHNICAL FIELD

[0001] The present invention relates essentially to the ceramic substrate, ceramic heater, electrostatic chuck and wafer prober for semiconductor manufacture and / or inspection and more particularly to a ceramic substrate for semiconductor manufacture and / or inspection which is conducive to the prevention of electrical errors, decrease in electrostatic chucking force, generation of particles, and circuit defects. BACKGROUND ART

[0002] Semiconductor devices are manufactured through a process which comprises coating a photosensitive resin as an etching resist on a semiconductor wafer and etching the uncoated area.

[0003] While the photosensitive resin is applied in the form of a liquid to the surface of a semiconductor wafer by means of a spin coater or the like, it must be dried after coating to dissipate the solvent etc. and the thus-coated semiconductor wafer is set on a heater and heated. It is also necessary to heat the silicon wafer by, for example, sputtering. [0...

Claims

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