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Shutter device for exposure subsystem of photoetching machine

A technology of sub-system and lithography machine, applied in microlithography exposure equipment, photolithography process exposure device and other directions, can solve the problems of slow start-up speed of rotating motor, unsuitable for thin glue process, low exposure yield, etc. Heat resistance, improved exposure yield, effect of high shutter speed

Inactive Publication Date: 2011-06-08
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this technology avoids the disadvantages of the drive shutter caused by the poor load capacity of the relay, due to the slow start speed of the rotating motor, the shutter exposure takes a long time, so the exposure yield of this method is low. And it is not suitable for thin glue process

Method used

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  • Shutter device for exposure subsystem of photoetching machine
  • Shutter device for exposure subsystem of photoetching machine
  • Shutter device for exposure subsystem of photoetching machine

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Embodiment Construction

[0021] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0022] Such as figure 1 Shown is a top view of the shutter device of the exposure subsystem provided in this embodiment. The shutter device in this embodiment includes two shutter blades 1 a and 1 b , corresponding heat shields 2 a and 2 b , voice coil motors 3 a and 3 b , position sensors 4 a and 4 b and a shutter controller 5 . The voice coil motors 3a and 3b, the position sensors 4a and 4b and the shutter controller 5 are all located on the bracket. Such as figure 2 As shown, the shutter controller forms a closed-loop control loop with the voice coil motor and the position sensor. The shutter blades are used to block the exposure light and are symmetrically distributed on both sides of the exposure light path. It should be added that the shutter blades in t...

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Abstract

The technical problem to be solved by the invention is to provide a shutter device for an exposure subsystem of a photoetching machine. The shutter device comprises at least one shutter blade, a shutter controller, a position sensor, a bracket and a voice coil motor, wherein the shutter controller is used for controlling opening and closing of the shutter blade; the positioning sensor is coupled with the shutter controller and the shutter blade and provides movement position information of the shutter blade for the shutter controller; the bracket is positioned below the shutter controller and the position sensor and is used for supporting the voice coil motor and the position sensor; the voice coil motor is controlled by the shutter controller to move; the voice coil motor is positioned on the bracket, is coupled with the shutter controller and is controlled by the shutter controller to move; the voice coil motor drives the shutter blade to move so as to form the operation of opening and closing the shutter blade; and the thickness of the shutter blade is 0.5 to 2mm. The shutter device is suitable for a large-dose exposure device. Due to the adoption of the shutter device, a thin photoresist process and a thick photoresist process can be realized simultaneously and on the premise of guaranteeing the speed of a shutter, the service life of the shutter in the high temperature environment is prolonged.

Description

technical field [0001] The invention relates to the field of lithography machine equipment manufacturing, in particular to a shutter device used in the exposure sub-system of the lithography machine. Background technique [0002] Photolithography is used to print a pattern of features on the surface of a substrate. Often used substrates are semiconductor wafers or glass substrates coated with light-sensitive media. During lithography, a wafer is placed on a wafer stage, and a pattern of features is projected onto the wafer surface by an exposure device located in the lithography apparatus. [0003] An important index of the lithography machine is the minimum line width. Excessive or insufficient exposure dose will affect the photoresist development effect, thereby reducing the minimum line width index. The precise control of exposure dose lays a solid foundation for the stability of the entire photolithography process. [0004] The exposure system of the existing middle a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
Inventor 孙智超罗闻
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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