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43 results about "Nano grid" patented technology

Phenolic resin/silicon dioxide composite aerogel materialand preparation method thereof

The invention provides a phenolic resin/silicon dioxide compositeaerogel material and a preparation method thereof. The phenolic resin/silicon dioxide composite aerogel material has a nano-grid structure in which a silicon dioxide phase and a resin phase are mutually tangled. The phenolic resin/silicon dioxide composite aerogel material is prepared from a material containing an organic silicon precursor, a phenolic compound, an aldehyde compound and chitosan by virtue of a sol-gel method and supercritical carbon dioxide. According to the composite aerogel material, an organic phase and an inorganic phase are respectively continuous nano-scale tangle structures and are integrated with the mechanical property of organic aerogel and the thermal insulation property and fire resistance of silicon dioxide aerogel; and after the composite gel material with a thickness of 1cm is impacted by the 1300-DEG C flame of a blast burner for over 30 minutes, the falling and the separation of the inorganic phase are not caused, and meanwhile, the temperature of a protected side does not exceed 300 DEG C. The preparation method has the beneficial effects that the operation is simple, the reaction is safe and reliable, and the thermal insulation property and the fire resistance of the material can be regulated and controlled by simply changing the material proportion.
Owner:UNIV OF SCI & TECH OF CHINA

Clinical data automatic extracting and calculating method, system and device and storage medium

The invention provides a clinical data automatic extracting and calculating method, system and device and a storage medium. The method comprises the following steps of: establishing a scientific research project queue on a special disease database, wherein clinical data of a special patient is stored in the special disease database; screening patients by adopting a nano-grid mode to generate scientific research project data, wherein the scientific research project data comprises screened clinical data of the patients; establishing an extraction rule and performing filtering and/or aggregationcalculation on the scientific research project data through the extraction rule to generate baseline data for the scientific research project, wherein the baseline data for the scientific research project comprises scientific research target fields required by a plurality of scientific research projects, and finally deriving the baseline data for the scientific research project. Under a conditionof an existing objective clinical full data set, according to the technical scheme, by the adoption of the clinical data automatic extracting and calculating method, system and device and the storagemedium, automatic extraction and calculation of the specific data required by CRF for clinical test or research are achieved, and the efficiency and accuracy of specific clinical data acquisition areimproved.
Owner:YIDU CLOUD (BEIJING) TECH CO LTD

Method for manufacturing three-dimensional nano grid structure based on one-dimensional soft template nanoimprinting

The invention belongs to the technical field of micro-nano manufacturing, and in particular relates to a method for manufacturing a large-area three-dimensional nano grid structure based on a one-dimensional soft template nanoimprinting technology. The method comprises the following steps of: performing first-time nanoimprinting by using a soft template; removing a imprinting glue residual layer by oxygen reactive ion etching (RIE); degumming by using a manufactured imprinting glue pattern as a masking film etching substrate material to obtain a one-dimensional nano grating structure; performing a second-time imprinting and etching process by using parameters the same as those of the previous imprinting and etching process; and adjusting the included angle formed between the direction of the template during the second-time imprinting and the direction of the template during the first-time imprinting to be between 0 and 90 degrees so as to obtain the three-dimensional nano grid structure with a 25nm nano-point. Due to the adoption of the soft template, permanent damages caused by contacting a hard template with a hard substrate can be effectively avoided, and the usage of a three-dimensional template is avoided simultaneously. The size and the shape of the manufactured nano structure are controllable. The method is low in cost and high in efficiency, controllability and resolution.
Owner:DALIAN UNIV OF TECH

Method for producing transistor T type nano grid using once electron beam exposure

The invention discloses a method for using once electric beam exposure to manufacture transistor T-shaped nanometer gate, comprising the steps of: A, coating a first layer electric beam glue which is liable to realize glue-stripping and peeling on a cleaned epitaxial wafer, and then soft-baking; B, coating a second layer electric beam glue ZEP520A on the first layer electric beam glue, and then soft-baking; C, coating a third layer electric beam glue which is liable to realize glue-stripping and peeling on the second layer electric beam glue ZEP520A, and then soft-baking; D, coating a fourth layer electric beam glue ZEP520A on the third layer electric beam glue, and then soft-baking; E, carrying out gate electric beam exposure; F, sequentially developing the four layer electric beam glue ZEP520A, the third layer electric beam glue which is liable to realize glue-stripping and peeling, the second layer electric beam glue ZEP520A and the first layer electric beam glue which is liable to realize glue-stripping and peeling; G, eroding the gate groove, evaporating and peeling off gate metals to form the transistor T-shaped nanometer gate. The invention has strong reliability, simple processes and is easy to peel off and strip the glue.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1

Method for preparing transistor T type nano grid

The invention discloses a method for manufacturing transistor T-shaped nanometer gate, comprising the steps of: A, coating a first layer electric beam glue which is liable to realize glue-stripping and peeling on a cleaned epitaxial wafer, and then soft-baking; B, coating a second layer electric beam glue ZEP520A on the first layer electric beam glue, and then soft-baking; C, coating a third layer electric beam glue which is liable to realize glue-stripping and peeling on the second layer electric beam glue ZEP520A, and then soft-baking; D, coating a fourth layer electric beam glue UVIII on the third layer electric beam glue, and then soft-baking; E, carrying out gate cap electric beam exposure, and sequentially developing the four layer electric beam glue UVIII, the third layer electric beam glue which is liable to realize glue-stripping and peeling; F, carrying out the gate feet electric beam exposure, and sequentially developing the second layer electric beam glue ZEP520A and the first layer electric beam glue which is liable to realize glue-stripping and peeling; G, eroding the gate groove, evaporating and peeling off gate metals to form the transistor T-shaped nanometer gate. Usage of the invention can easily manufacture the gate lines having small size, greatly reducing the process difficulty.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1

Fluorenyl donor/receptor type nano polymer as well as preparation method and application thereof

The invention discloses a fluorenyl donor/receptor type nano polymer as well as a preparation method and application thereof. In a nano grid polymer, a fluorenyl derivative is used as electron donor units in nano grid fragments, and the electron donor units and electron receptor units are arranged alternatively to form a square annular rigid structure. The preparation method comprises the following step: performing a polymerization reaction on a nano grid fragment (II) and a polymerization fragment (III) with preserved halogen end groups, thereby obtaining the polymer. The polymer material disclosed by the invention has the advantages that a synthesis mode is modularized, high extensibility and high thermal, electrochemical and optical stability can be achieved, film solvent dependency can be alleviated, large-scale soluble processing can be achieved, aperture sizes can be precisely adjusted and controlled, precise regulation and control on band gap and energy level arrangement can be achieved, and the like; and the polymer material has potential application prospects in fields of photoelectric functional materials for organic solar batteries, memories and memory resistors, sensors, detectors and the like.
Owner:NANJING UNIV OF POSTS & TELECOMM

Method for preparing transistor T type nano grid

The invention discloses a method for manufacturing transistor T-shaped nanometer gate, comprising the steps of: A, depositing a layer of silicon nitride medium or silicon dioxide medium on a cleaned epitaxial wafer; B, coating a first layer electric beam glue ZEP520A on the silicon nitride medium or silicon dioxide medium, and then soft-baking; C, coating a second layer electric beam glue which is liable to realize glue-stripping and peeling on the first layer electric beam glue ZEP520A, and then soft-baking; D, coating a third layer electric beam glue ZEP520A on the second layer electric beam glue, and then soft-baking; E, carrying out gate electric beam exposure; F, sequentially developing the third layer electric beam glue ZEP520A, the second layer electric beam glue which is liable to realize glue-stripping and peeling and the first layer electric beam glue ZEP520A; G, plasma-etching the silicon nitride medium or silicon dioxide medium; H, eroding the gate groove, evaporating and peeling off gate metals to form the transistor T-shaped nanometer gate. In free of the problem about overlaying alignment, the invention is simple in processes, easy to manufacture the gate lines having small size and strong in reliability.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI

Novel ZnO nano material and preparation method thereof

ActiveCN108821326AThe preparation equipment is matureSimple processMaterial nanotechnologyZinc oxides/hydroxidesDopantMicrosphere
The invention provides a novel ZnO nano material and a preparation method thereof. The novel ZnO nano material comprises a substrate layer, nano walls and a nano-grid, wherein the nano wall is arranged on the substrate layer and is formed by stacking ZnO nanowires, and the nano-grid is composed of the nano-walls. The method specifically comprises the following steps that 1) a precursor mixed solution is prepared by using zinc acetate, a pore-forming agent and a dopant; 2) a precursor film is prepared by utilizing the precursor mixed solution; and 3) high-temperature sintering is carried out soas to obtain the ZnO nano-material. According to the novel ZnO nano material and the preparation method thereof, preparation equipment is mature, the process is simple, and large-scale production isfacilitated; the sintering temperature is accurately controlled, zinc acetate and the pore-forming agent are decomposed into water and carbon dioxide and the water and carbon dioxide are separated from microspheres so as to help to form pore channels and nanowires; a precursor can be completely decomposed at the temperature of 500 DEG C, crystallization of the ZnO nanowires is promoted, so that the novel ZnO nano material with good crystallization state is obtained, the size of the prepared microspheres is controllable, and the pore channels are uniformly distributed; and the ZnO nano materialprepared through the preparation method provided by the invention is wide in application range.
Owner:WUYI UNIV

Double-T-shaped nano gate and preparation method thereof

The invention relates to the technical field of microelectronic devices, and particularly discloses a double-T-shaped nano gate and a preparation method thereof. The double-T-shaped nano gate grows ona substrate with a dielectric passivation layer, and the dielectric passivation layer comprises a bottom dielectric passivation layer and a top dielectric passivation layer; the double-T-shaped nanogate sequentially comprises a gate root, a gate waist and a gate cap from bottom to top. The gate root penetrates through the dielectric passivation layer and grows on the substrate, the gate root isnot in contact with the bottom dielectric passivation layer, and the lower surface of the gate waist is in contact with the upper surface of the top dielectric passivation layer. The grid root and thegrid cap of the double-T-shaped nano grid provided by the invention are suspended; the contact with the dielectric passivation layer is avoided; the top dielectric passivation layer is covered with the gate waist, the stability of the double-T-shaped gate is improved, the distance between the gate cap and the dielectric passivation layer is increased through the double-T-shaped structure, parasitic capacitance can be further reduced, gate inversion caused by the fact that no dielectric support exists during gate stripping is avoided, and the purpose of improving the frequency characteristic of the device is achieved.
Owner:THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP

Method for preparing transistor T type nano grid

The invention discloses a method for manufacturing transistor T-shaped nanometer gate, comprising the steps of: A, coating a first layer electric beam glue which is liable to realize glue-stripping and peeling on a cleaned epitaxial wafer, and then soft-baking; B, coating a second layer electric beam glue ZEP520A on the first layer electric beam glue, and then soft-baking; C, coating a third layer electric beam glue which is liable to realize glue-stripping and peeling on the second layer electric beam glue ZEP520A, and then soft-baking; D, coating a fourth layer electric beam glue ZEP520A on the third layer electric beam glue, and then soft-baking; E, carrying out gate feet electric beam exposure; F, carrying out gate cap electric beam exposure; G, sequentially developing the four layer electric beam glue ZEP520A, the third layer electric beam glue, the second layer electric beam glue ZEP520A and the first layer electric beam glue; H, eroding the gate groove, evaporating and peeling off gate metals to form the transistor T-shaped nanometer gate. Usage of the invention can easily manufacture the gate lines having extremely small size, and the invention has high alignment precision and strong reliability without growth and etching mediums, thus largely reducing the process difficulty.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1

Nano hole detection system based on micro/nano hole net integrated structure and preparation method of nano hole detection system

The invention discloses a nano hole detection system based on a micro/nano hole net integrated structure. The nano hole detection system comprises an electrolyte solution chamber, the micro/nano hole net integrated structure and current detection systems, wherein the micro/nano hole net integrated structure is arranged in the electrolyte solution chamber, and comprises a nano hole layer film with nano holes and a grid layer film with micro/nano grids; and the current detection systems are arranged in an upper chamber and a lower chamber of the electrolyte solution. According to the nano hole detection system disclosed by the invention, the micro/nano grid structures and the nano holes are connected and integrated together in a penetrating manner by fully utilizing the advantages of a semiconductor integration technology; the nano hole detection system conforms to the development tendencies of miniaturization and integration of a long-chain polymer sequencing technology; a long-chain polymer is linearized, so that the long-chain polymer can stretch as far as possible before entering the nano hole; the entangled state of the long-chain polymer is unlocked; the entropy barrier of the long-chain polymer when passing through the nano holes is reduced; the phenomenon that the nano holes are blocked is avoided; and the reliability of detecting the long-chain polymer by the nano holes can be effectively improved.
Owner:CHONGQING INST OF GREEN & INTELLIGENT TECH CHINESE ACADEMY OF SCI

Preparation method of non-dense ordered polystyrene nanosphere template

InactiveCN108373136AEffective control of etching precisionImprove stabilityNanostructure manufactureNanowirePolystyrene
The invention relates to a preparation method of a non-dense ordered polystyrene nanosphere template, and belongs to the technical field of preparation of nanometer structures. The preparation methodspecifically comprises the following steps of after a silicon wafer is cleaned, passivating the surface of the silicon wafer by hydrogen; self-assembling a single-layer dense polystyrene nanosphere thin film on the silicon wafer, and utilizing normal incidence type Ar<+> ion beams to bombard the nanosphere thin films of different diameters, wherein the density of beam flow is 0.85 to 3.0mA/cm<2>,the energy of Ar<+> is 0.5 to 1.0keV, and the bombarding time is 5 to 28min; after bombarding by the ion beams, the diameter of each nanosphere is reduced, and the location of each nanosphere is not changed, so as to obtain the non-dense ordered polystyrene nanosphere template. The preparation method of the non-dense ordered polystyrene nanosphere template has the advantages that the size and cycle of the nanoparticle in the template are adjusted by the initial diameter and bombarding condition of the polystyrene nanosphere; the etching rate of the nanosphere is adjustable within the range of6.19 to 17.32nm/min; compared with the ion beam etching technique, the etching rate is low, and the quality of the small-size polystyrene nanosphere template is favorably controlled; the cost is low,the technology is simple, and the stability is high; the non-dense ordered polystyrene nanosphere template can be applied to the study and development fields of ordered nanowires, nanorods, nanoporesand nanomesh arrays.
Owner:YUNNAN UNIV

QLED device with enhanced composite structure and preparation method of QLED device

The invention provides a QLED device with an enhanced composite structure and a preparation method of the QLED device. The light emitting efficiency of a positive QLED device is improved through a micro-nano structure composite structure constructed by a nano grid structure composite folded structure. The composite structure is constructed on the basis of the nanoimprint technology, the micro-attachment technology and the surface plasma etching technology, and the method comprises the steps: preparing a nanoimprint template and processing the transferred pattern again. An IPS polymer is used as a nano-imprinting template through the nano-imprinting technology, and the template pattern is transferred to the PDMS dielectric layer through the micro-attachment technology; on the basis, the composite structure is constructed on the glass substrate through the surface plasma etching technology to enhance light emitting of the QLED substrate. The QLED device with the enhanced composite structure can have the highest brightness and efficiency, and the brightness and the EQE are improved by 46% at most compared with conventional devices; and the construction mode of the composite structureis simple, the cost is low, and industrial popularization and application are facilitated.
Owner:HENAN UNIVERSITY

Method for preparing copper nano grid transparent electrode based on gas phase reduction of copper oxide

The invention relates to the technical field of semiconductors, in particular to a method for preparing a copper nano grid transparent electrode based on gas phase reduction of copper oxide. The method comprises the following steps: preparing a spinning precursor solution by using copper nitrate, preparing a copper nitrate composite nanowire through electrostatic spinning, and heating and oxidizing the prepared copper nitrate composite nanowire to obtain copper oxide nanofiber; finally, putting the obtained copper oxide nanofiber into an enclosed reaction kettle, wherein the enclosed reactionkettle contains gaseous alcohols, and then placing the reaction kettle at 200-250 DEG C for reaction for 3-5h to obtain a copper nano grid transparent electrode; the method for reducing the copper oxide nanofiber by the solvent gas phase not only keeps the appearance of the nanofiber, but also completely reduces the copper oxide; the problem that a nano grid transparent electrode is easy to breakin the prior alcohol reduction process is solved; the method has the advantages of safety, low cost and excellent reduction effect, ensures the transmittance and the conductivity, and finally obtainsthe copper grid transparent electrode with excellent performance.
Owner:TAIYUAN UNIV OF TECH

Method for producing transistor T type nano grid using once electron beam exposure

The invention discloses a method for using once electric beam exposure to manufacture transistor T-shaped nanometer gate, comprising the steps of: A, coating a first layer electric beam glue which is liable to realize glue-stripping and peeling on a cleaned epitaxial wafer, and then soft-baking; B, coating a second layer electric beam glue ZEP520A on the first layer electric beam glue, and then soft-baking; C, coating a third layer electric beam glue which is liable to realize glue-stripping and peeling on the second layer electric beam glue ZEP520A, and then soft-baking; D, coating a fourth layer electric beam glue ZEP520A on the third layer electric beam glue, and then soft-baking; E, carrying out gate electric beam exposure; F, sequentially developing the four layer electric beam glue ZEP520A, the third layer electric beam glue which is liable to realize glue-stripping and peeling, the second layer electric beam glue ZEP520A and the first layer electric beam glue which is liable to realize glue-stripping and peeling; G, eroding the gate groove, evaporating and peeling off gate metals to form the transistor T-shaped nanometer gate. The invention has strong reliability, simple processes and is easy to peel off and strip the glue.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1

A kind of zno nanometer material, and preparation method thereof

ActiveCN108821326BThe preparation equipment is matureSimple processMaterial nanotechnologyZinc oxides/hydroxidesDopantMicrosphere
The invention provides a novel ZnO nano material and a preparation method thereof. The novel ZnO nano material comprises a substrate layer, nano walls and a nano-grid, wherein the nano wall is arranged on the substrate layer and is formed by stacking ZnO nanowires, and the nano-grid is composed of the nano-walls. The method specifically comprises the following steps that 1) a precursor mixed solution is prepared by using zinc acetate, a pore-forming agent and a dopant; 2) a precursor film is prepared by utilizing the precursor mixed solution; and 3) high-temperature sintering is carried out soas to obtain the ZnO nano-material. According to the novel ZnO nano material and the preparation method thereof, preparation equipment is mature, the process is simple, and large-scale production isfacilitated; the sintering temperature is accurately controlled, zinc acetate and the pore-forming agent are decomposed into water and carbon dioxide and the water and carbon dioxide are separated from microspheres so as to help to form pore channels and nanowires; a precursor can be completely decomposed at the temperature of 500 DEG C, crystallization of the ZnO nanowires is promoted, so that the novel ZnO nano material with good crystallization state is obtained, the size of the prepared microspheres is controllable, and the pore channels are uniformly distributed; and the ZnO nano materialprepared through the preparation method provided by the invention is wide in application range.
Owner:WUYI UNIV

Method for preparing transistor T type nano grid

The invention discloses a method for manufacturing transistor T-shaped nanometer gate, comprising the steps of: A, coating a first layer electric beam glue which is liable to realize glue-stripping and peeling on a cleaned epitaxial wafer, and then soft-baking; B, coating a second layer electric beam glue ZEP520A on the first layer electric beam glue, and then soft-baking; C, coating a third layer electric beam glue which is liable to realize glue-stripping and peeling on the second layer electric beam glue ZEP520A, and then soft-baking; D, coating a fourth layer electric beam glue UVIII on the third layer electric beam glue, and then soft-baking; E, carrying out gate cap electric beam exposure, and sequentially developing the four layer electric beam glue UVIII, the third layer electric beam glue which is liable to realize glue-stripping and peeling; F, carrying out the gate feet electric beam exposure, and sequentially developing the second layer electric beam glue ZEP520A and the first layer electric beam glue which is liable to realize glue-stripping and peeling; G, eroding the gate groove, evaporating and peeling off gate metals to form the transistor T-shaped nanometer gate. Usage of the invention can easily manufacture the gate lines having small size, greatly reducing the process difficulty.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1

A method for preparing a transparent conductive nanowire grid film on a three-dimensional microstructure surface

The invention discloses a method for preparing a transparent conductive nanowire mesh film on the surface of a three-dimensional microstructure. The method comprises the steps of making a rigid substrate with a three-dimensional microstructure on the upper surface, making a matched flexible pressing plate with the rigid substrate as a template by using an imprint method, coating the three-dimensional microstructure of the rigid substrate with a conductive nanowire mixed solution and pressing down with the flexible pressing plate to maintain a certain gap between the flexible pressing plate andthe rigid substrate, and drying the conductive nanowire mixed solution in the gap to obtain the nanowire mesh film attached to the surface of the three-dimensional microstructure of the rigid substrate. Conductive nanowires overlapping each other in a mesh achieve the circuit conduction, transparent mesh openings between the nanowires achieve transparency, and the preparation of the transparent conductive nanowire mesh film on the surface of the three-dimensional microstructure is achieved. Micro steps are formed by using a method of etching after oxidation before coating the rigid substratewith the conductive nanowire mixed solution, and the size of the gap can be controlled by the cooperation of the micro steps and the flexible pressing plate. The transparent conductive nanowire mesh film has the advantages of high quality, high preparation efficiency and low cost.
Owner:XIAN TECH UNIV

Method for preparing transistor T type nano grid

The invention discloses a method for manufacturing transistor T-shaped nanometer gate, comprising the steps of: A, coating a first layer electric beam glue which is liable to realize glue-stripping and peeling on a cleaned epitaxial wafer, and then soft-baking; B, coating a second layer electric beam glue ZEP520A on the first layer electric beam glue, and then soft-baking; C, coating a third layer electric beam glue which is liable to realize glue-stripping and peeling on the second layer electric beam glue ZEP520A, and then soft-baking; D, coating a fourth layer electric beam glue ZEP520A on the third layer electric beam glue, and then soft-baking; E, carrying out gate feet electric beam exposure; F, carrying out gate cap electric beam exposure; G, sequentially developing the four layer electric beam glue ZEP520A, the third layer electric beam glue, the second layer electric beam glue ZEP520A and the first layer electric beam glue; H, eroding the gate groove, evaporating and peeling off gate metals to form the transistor T-shaped nanometer gate. Usage of the invention can easily manufacture the gate lines having extremely small size, and the invention has high alignment precision and strong reliability without growth and etching mediums, thus largely reducing the process difficulty.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1
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