QFN (quad flat no-lead package) adhesive removal and softening integrated soak solution

Abstract

The invention belongs to the technical field of package, and relates to QFN (quad flat no-lead package) adhesive removal and softening integrated soak solution. The QFN adhesive removal and softeningintegrated soak solution in a formula comprises 0.5-5 wt% of block polyether surfactants, 20-40 wt% of organic alkali, 0.1-5 wt% of inorganic alkali, 30-50 wt% of organic solvents, 20-30 wt% of alcohol ether dispersing agents, 0.01-0.05 wt% of metal corrosion inhibitors and the balance deionized water. The block polyether surfactants comprise one or two types of propylene glycol polyoxyethylene polypropylene oxide block polymers and allyl polyoxyethylene polypropylene oxide methyl ether. The QFN adhesive removal and softening integrated soak solution has the advantages that the QFN adhesive removal and softening integrated soak solution is excellent in adhesive removal and softening ability and easy to clean, integral technologies only take the total time of 25-45 min, processes can be shortened to be 1 / 4 of the original processes, and accordingly the productivity can be greatly improved; the solution soak time is only 1 / 4 of the original solution soak time, and plastic package bodiescan be prevented from being damaged.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to an integrated immersion solution for removing glue and softening for QFN. Background technique [0002] QFN (Quad Flat No-lead Package, square flat no-lead package), one of the surface mount packages. QFN is a leadless package with a square or rectangular shape. There is a large-area exposed pad at the center of the bottom of the package for heat conduction, and there are conductive pads around the periphery of the package around the large pad for electrical connection. Because the QFN package does not have gull-wing leads like the traditional SOIC and TSOP packages, the conductive path between the internal pins and the pad is short, the self-inductance coefficient and the internal wiring resistance of the package are very low, so it can provide excellent electrical performance. In addition, it provides excellent thermal performance through the exposed lead frame pad, which h...

AI Technical Summary

Problems solved by technology

[0004] 1. The key time-consuming process of the whole process seriously affects the production capacity

[0005] 2. The two potion systems of degumming and softening are different, and the residual potion of degumming will affect the performance of the softening potion if it is brought into the softening potion

[0006] 3. Long-term immersion in liquid medicine will have a negative impact on the plastic package and the frame

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