The invention provides an ultralow-thermal-resistance low-temperature
welding material, a preparation method and a
welding method, and belongs to the technical field of
electronic packaging and thermal management materials.The ultralow-thermal-resistance low-temperature
welding material comprises, by weight, 70%-85% of
tin-
bismuth alloy powder, 5%-10% of
gallium-based
liquid metal and 5%-25% of scaling
powder, the
tin-
bismuth alloy powder comprises
tin and
bismuth, the
gallium-based
liquid metal comprises
gallium and
indium, and the scaling powder comprises the tin-bismuth
alloy powder, the gallium-based
liquid metal and the scaling powder. The
soldering flux comprises modified
rosin,
dipropylene glycol and
diethylene glycol dibutyl ether. The preparation method comprises the following steps: preparing the tin-bismuth alloy powder, the gallium-based liquid
metal and the
soldering flux, mixing the gallium-based liquid
metal with the
soldering flux, mechanically stirring, and ultrasonically dispersing until the materials are uniformly mixed; and adding tin-bismuth alloy powder into the mixture, mechanically stirring, and cooling to
room temperature. In the
welding process, tin and bismuth react with the base material to generate an IMC layer, gallium and
indium are filled in a welding cavity in a high-temperature
molten state, and a compact IMC interface is generated. The interface
thermal resistance is reduced, and the compatibility, the safety and the connection reliability are improved.