Preparation of hyperthermia drying wafer capacitance electrode silver plasm

Abstract

The invention relates to a preparation method of low temperature baking disc capacitance electrode silver paste, which comprises the steps that: firstly, 200 model ethyl cellulose, 40 model ethyl cellulose, polyvinyl butyral, diethylene glycol dibutyl ether acetate are mixed to prepare an adhesive; secondly, super fine silver powder, frit and bismuth oxide are mixed to prepare a powder material; thirdly, terpilenol and diethylene butyl alcohol ethylether are mixed to prepare a thinning agent; fourthly, the adhesive and the power material are mixed, the fineness is adjusted through a trio mill, the thinning agent is added, and then the silver paste is prepared. The preparation process is simple, the prepared silver paste can prevent the defects that the silver layer is scratched and deciduous under the low temperature and baking conditions, ensure that the volatilization of the solvent during the low temperature and baking process is uniform, the air bubble is not existent, and the invention is suitable for the electrode solver paste under the high temperature (higher than 300 DEG C) and baking conditions.

Description

technical field [0001] The invention belongs to a method for preparing silver paste for a disc capacitor electrode, in particular to a method for preparing silver paste for a disc capacitor electrode with high-temperature drying. Background technique [0002] High-temperature silver paste is a type of paste that has attracted much attention in the electronic paste industry. It is widely used in the manufacture of electronic components such as capacitors and potentiometers, as well as electrical components such as high-voltage and high-frequency porcelain parts. It integrates chemical industry, metallurgy and electronics. functions and structural materials. High temperature silver paste is mainly composed of three parts: functional phase (silver powder), organic carrier and glass phase. [0003] With the rapid development of the electronics industry, the requirements for the quality of electronic components are getting higher and higher, and the requirements for high-tempera...

AI Technical Summary

Problems solved by technology

The sintering process of the silver layer and the peak value of the sintering temperature affect the microstructure of the silver layer and the appearance of the silver layer, and at the same time affect the adhesion of the silver electrode film and the electrical properties of the vibrator. Under drying conditions, there are disadvantages such as the silver layer is easy to scratch and fall off, so it is urgent to solve