Preparation of low temperature drying wafer capacitance electrode silver plasm

A low-temperature drying and capacitive electrode technology, which is applied in the fields of fixed capacitor electrodes, capacitor manufacturing, and capacitors, can solve the problems of easy scratching and falling off of the silver layer, and achieve the effect of simple preparation process

Inactive Publication Date: 2008-06-25
宁波元太导电材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the currently prepared silver paste has shortcomings such as easy scratching and fal...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] (1) Mix 40-60g of 200-type ethyl cellulose, 40-60g of 40-type ethyl cellulose, 80-150g of polyvinyl butyral, and 730-800g of diethylene glycol butyl ether acetate to prepare adhesive ;

[0021] (2) Mix 20-30g of glass frit, 30-40g of bismuth oxide, add 900-950g of ultra-fine silver powder, and make powder, after stirring well, add ball mill and mill for 2-3 hours;

[0022] (3) Mix terpineol 400-500g, ethylene glycol butyl ether 300-400g, ethylene glycol ether 200-300g, prepare diluent;

[0023] (4) Mix adhesive and powder, pass through a three-roll mill until the fineness is less than 10 μm, add diluent to make silver paste, stir for 1 hour, measure viscosity, and adjust viscosity with a small amount of diluent.

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Abstract

The invention relates to a preparation method of low temperature baking disc capacitance electrode silver paste, which comprises the steps that: firstly, 200 model ethyl cellulose, 40 model ethyl cellulose, polyvinyl butyral, diethylene glycol dibutyl ether acetate are mixed to prepare an adhesive; secondly, super fine silver powder, frit and bismuth oxide are mixed to prepare a powder material; thirdly, terpilenol, butyl glycol ether and cellosolve are mixed to prepare a thinning agent; fourthly, the adhesive and the power material are mixed, the fineness is adjusted through a trio mill, the thinning agent is added, and then the silver paste is prepared. The preparation process is simple, the prepared silver paste can prevent the defects that the silver layer is scratched and deciduous under the low temperature and baking conditions, ensure that the volatilization of the solvent during the low temperature and baking process is uniform, the air bubble is not existent, and the invention is suitable for the electrode solver paste under the low temperature (lower than 250 DEG C) and baking conditions.

Description

technical field [0001] The invention belongs to a method for preparing silver paste for a disc capacitor electrode, in particular to a method for preparing silver paste for a disc capacitor electrode with low-temperature drying. Background technique [0002] Electronic paste is the basic material for manufacturing thick film components. It is prepared and processed from metal conductive powder, adhesive, organic solvent and other raw materials. Metal conductive powder plays a conductive role in the electrode. Commonly used metal powders include copper, aluminum, and zinc. , silver powder. Silver powder is the most widely used metal electrode because of its excellent conductivity and is not easily oxidized in the air. As a new type of material, electronic paste is far superior to traditional circuit equipment (such as resistance wire, electric heating tube, etc.), and has the characteristics of environmental protection, high efficiency and energy saving, and its cost is also...

Claims

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Application Information

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IPC IPC(8): H01G13/00H01G4/005H01G5/011H01G9/042
Inventor 许明勇
Owner 宁波元太导电材料科技有限公司
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