The invention belongs to a preparation technique of a
copper-based
composite material, and discloses a method for preparing
a diamond-
copper composite material by virtue of metallization of a surface. The method comprises the following steps of: mixing
diamond micropowder with
copper powder and
powder formed by strong
carbide elements, wherein the particle size of
diamond is 80-300mu m, the content of the strong
carbide elements is 1-10wt%, and the
mass fraction of the copper
powder is 20%-85%; blending the obtained mixed powder for 10-90 minutes at the temperature of 1050-1150 DEG C, and then cooling along with a furnace; sieving to select the powder with the particle size of 80-300 mu m; mixing the mixed powder with the copper powder again, wherein the
mass fraction of the copper powderis 40%-95%; quickly heating the mixed powder material to 850-950 DEG C for
sintering at the
sintering pressure of 30-50MPa; and then, cooling the obtained product to a
room temperature along with thefurnace to obtain the
diamond-copper
composite material. The method for preparing the diamond-copper composite material has the advantages that the
operability of the metallization of the surface of the diamond is strong; the process is simple; the
wetting property of a matrix and an
enhancer in the prepared diamond-copper composite material is improved greatly; and as an electronic encapsulatingmaterial, the composite material has better comprehensive property, wherein the
thermal conductivity is up to 672 W / m.K, the
thermal expansion is lower than 7.6 mu m / m. DEG C, and the compactness reaches above 96%.