Hot ultrasonic sintering method and device of nano silver/graphene composite ink

A technology of graphene composite and sintering method, which is applied in the direction of ink, application, electrical components, etc., can solve the problems of high sintering temperature, high circuit resistivity, long sintering time, etc., and achieve excellent electrical conductivity and good mechanical bending performance , the effect of large specific surface area

Active Publication Date: 2016-12-07
CENT SOUTH UNIV
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Problems solved by technology

[0005] However, the introduction of graphene has brought problems such as inconvenient writing (graphene is easy to block t

Method used

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  • Hot ultrasonic sintering method and device of nano silver/graphene composite ink
  • Hot ultrasonic sintering method and device of nano silver/graphene composite ink
  • Hot ultrasonic sintering method and device of nano silver/graphene composite ink

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[0037] The present invention will be further described below in conjunction with the drawings.

[0038] See figure 1 with figure 2 , The device provided by the present invention for realizing the thermosonic sintering method of nano silver / graphene composite ink includes a writing system of nano silver / graphene composite ink and a thermosonic sintering system of nano silver / graphene composite ink. Nano silver / graphene composite ink The structure of the writing system of the olefin composite ink is: a writing post and an up-and-down translation table 2 and a writing motion translation table 12 are provided on the writing base 11, and a writing fixing bracket 7 is provided on the writing column and the upper and lower translation table 2, and the writing fixing bracket 7 It is equipped with a writing force sensor 4 and a glue cylinder 6. The upper end of the glue cylinder 6 is connected to the air pressure controller 3 through the air pipe 5, and the lower end of the glue cylinder ...

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Abstract

The invention discloses a hot ultrasonic sintering method and device of nano silver/graphene composite ink. According to the method, nano silver powder and graphene are dispersed into a mixed organic solvent; the nano silver/graphene composite ink with the mass percent of 0.01%-90% is prepared; the high-viscosity nano silver/graphene composite ink is extruded from a rubber sleeve through air pressure; scribbling is carried out on a flexible substrate through a dispensing head to form the flexible substrate with a conductive circuit; the dried flexible substrate with the conductive circuit is put between two layers of PDMS protective plastic, and pressure is applied to reach a required value of 3-30MPa; the heating temperature is 60-160 DEG C; hot-pressing pre-sintering is carried out under the conditions of 3-30MPa and 60-160 DEG C for 1-10 minutes; hot ultrasonic sintering is carried out under the conditions of 3-30MPa and 60-160 DEG C for 1-10 minutes; solid-state diffusion between nano silver/graphene is achieved through the effects of ultrasound, pressure and temperature; and a flexible circuit with good conductivity and mechanical bending property is prepared.

Description

technical field [0001] The invention relates to a method for preparing a conductive circuit in the field of flexible electronics, in particular to a method for preparing a high-strength, low-resistance flexible circuit using nano-silver / graphene composite ink. The invention also relates to a device for realizing the thermosonic sintering method of the nano-silver / graphene composite ink. Background technique [0002] Wearable smart devices are the future development direction of the electronics industry, and flexible electronics technology is the key technology. Flexible electronics can be summarized as an emerging electronic technology that makes organic / inorganic material electronic devices on flexible / ductile plastic or thin metal plates. , medical, national defense and other fields have broad application prospects. The paper-based circuit with nano-metal ink as the medium is one of the main development directions of flexible circuits. It disperses nano-metal powder in o...

Claims

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Application Information

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IPC IPC(8): H05K3/12H05K1/09C09D11/52
CPCC09D11/52H05K1/097H05K3/1283H05K2203/0285
Inventor 王福亮朱海新何虎李军辉朱文辉
Owner CENT SOUTH UNIV
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