Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Hot ultrasonic sintering method and device of nano silver/graphene composite ink

A technology of graphene composite and sintering method, which is applied in the direction of ink, application, electrical components, etc., can solve the problems of high sintering temperature, high circuit resistivity, long sintering time, etc., and achieve excellent electrical conductivity and good mechanical bending performance , the effect of large specific surface area

Active Publication Date: 2016-12-07
CENT SOUTH UNIV
View PDF2 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the introduction of graphene has brought problems such as inconvenient writing (graphene is easy to block the traditional writing pen), high sintering temperature, long sintering time, and large circuit resistivity after sintering.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Hot ultrasonic sintering method and device of nano silver/graphene composite ink
  • Hot ultrasonic sintering method and device of nano silver/graphene composite ink
  • Hot ultrasonic sintering method and device of nano silver/graphene composite ink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The present invention will be further described below in conjunction with accompanying drawing.

[0038] see figure 1 with figure 2 , the device provided by the invention to realize the thermosonic sintering method of nano-silver / graphene composite ink, including the writing system of nano-silver / graphene composite ink and the thermosonic sintering system of nano-silver / graphene composite ink, nano-silver / graphene The structure of the writing system of the vinyl composite ink is: the writing base 11 is provided with a writing column, an up and down translation platform 2 and a writing movement translation platform 12, and the writing column and the up and down translation platform 2 are provided with a writing fixed bracket 7, and a writing fixed bracket 7 is arranged on the writing base 11. A writing force sensor 4 and a rubber tube 6 are provided. The upper end of the rubber tube 6 is connected to the air pressure controller 3 through the air pipe 5, and the lower e...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a hot ultrasonic sintering method and device of nano silver / graphene composite ink. According to the method, nano silver powder and graphene are dispersed into a mixed organic solvent; the nano silver / graphene composite ink with the mass percent of 0.01%-90% is prepared; the high-viscosity nano silver / graphene composite ink is extruded from a rubber sleeve through air pressure; scribbling is carried out on a flexible substrate through a dispensing head to form the flexible substrate with a conductive circuit; the dried flexible substrate with the conductive circuit is put between two layers of PDMS protective plastic, and pressure is applied to reach a required value of 3-30MPa; the heating temperature is 60-160 DEG C; hot-pressing pre-sintering is carried out under the conditions of 3-30MPa and 60-160 DEG C for 1-10 minutes; hot ultrasonic sintering is carried out under the conditions of 3-30MPa and 60-160 DEG C for 1-10 minutes; solid-state diffusion between nano silver / graphene is achieved through the effects of ultrasound, pressure and temperature; and a flexible circuit with good conductivity and mechanical bending property is prepared.

Description

technical field [0001] The invention relates to a method for preparing a conductive circuit in the field of flexible electronics, in particular to a method for preparing a high-strength, low-resistance flexible circuit using nano-silver / graphene composite ink. The invention also relates to a device for realizing the thermosonic sintering method of the nano-silver / graphene composite ink. Background technique [0002] Wearable smart devices are the future development direction of the electronics industry, and flexible electronics technology is the key technology. Flexible electronics can be summarized as an emerging electronic technology that makes organic / inorganic material electronic devices on flexible / ductile plastic or thin metal plates. , medical, national defense and other fields have broad application prospects. The paper-based circuit with nano-metal ink as the medium is one of the main development directions of flexible circuits. It disperses nano-metal powder in o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/12H05K1/09C09D11/52
CPCC09D11/52H05K1/097H05K3/1283H05K2203/0285
Inventor 王福亮朱海新何虎李军辉朱文辉
Owner CENT SOUTH UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products