High-throughput preparation device and method for high-silicon aluminum alloy structural gradient material used for packaging

Abstract

The invention discloses a high-throughput preparation device and method for a high-silicon aluminum alloy structural gradient material used for packaging. The device comprises an upper high-temperature die, outer die moulds, induction coils, a gradient workpiece, cooling water circulating devices, a lower low-temperature die and thermocouples, wherein the upper high-temperature die is used for keeping the inner temperature of the whole die balancing and supplying a certain heat source to atomized powder of the high-silicon aluminum alloy; the outer die moulds are used for positioning two or three kinds of the prepared atomized powder of the gradient high-silicon aluminum alloy; the atomized powder of the high-silicon aluminum alloy is fed based on the sequence that the low-component alloy powder is at the bottom end of each outer die mould, and the high-component aluminum powder is at the top end of each outer die mould; the induction coils can be used as movable induction heating elements for supplying heat to the whole preparation process; the gradient workpiece is used for preparing the gradient material; the cooling water circulating devices can be used for exporting excess heat when the temperature in the preparation process is beyond a set temperature; the temperature of the lower low-temperature die is in contrast to the temperature of the upper high-temperature die, so that temperature gradient can be generated; the thermocouples are used for testing the temperature and controlling the induction heating time, so as to generate the temperature gradient. The alloy prepared by the device and the method is high in density, and the structure is refined, so that the alloy is outstanding in comprehensive performances.

Description

technical field [0001] The invention relates to the technical field of material processing, in particular to a high-throughput preparation device and method for a high-silicon aluminum alloy structural gradient material for packaging. Background technique [0002] Electronic packaging mainly plays the role of sealing, heat dissipation and shielding, which has an important impact on the stability of the device. At the same time, it also provides mechanical support for fine electronic circuits and serves as a conductive connection medium. In the electronic packaging system of modern fighter jets and missiles, the bare chip is integrated on the bottom of the packaging box, which requires the expansion coefficient of the packaging shell to match the GaAs or Si chip and have good heat dissipation performance; on the other hand, the side wall of the packaging shell and the upper cover are supported. And protection, must have good mechanical properties, air tightness and weldabilit...

AI Technical Summary

Problems solved by technology

As the silicon content in the alloy increases, the thermal expansion coefficient of the alloy gradually decreases, but its mechanical and welding properties become poor, which seriously affects the application of high-silicon aluminum alloys in the field of electronic packaging.

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