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Adhesive film with dicing sheet and method of manufacturing the same

An adhesive film, manufacturing method technology, applied in the direction of adhesive, film/sheet release liner, film/sheet adhesive, etc., can solve the problems of difficult semiconductor chip peeling, poor pickup, chip deformation, etc. Prevent chips from flying or chipping, good adhesive and peel, well-balanced effects

Active Publication Date: 2011-04-06
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, as semiconductor wafers become larger (10mm x 10mm or more) and thinner (about 15μm to about 100μm), it is difficult for existing dicing / die-bonding films to simultaneously satisfy the high adhesiveness required for dicing and the requirements for picking up. Desirable peelability, it is difficult to peel off the semiconductor chip with adhesive from the dicing sheet
As a result, there is sometimes a problem of poor pickup or chip deformation resulting in breakage

Method used

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  • Adhesive film with dicing sheet and method of manufacturing the same
  • Adhesive film with dicing sheet and method of manufacturing the same
  • Adhesive film with dicing sheet and method of manufacturing the same

Examples

Experimental program
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Effect test

Embodiment 1

[0166]

[0167] In a reaction vessel with a condenser tube, a nitrogen inlet tube, a thermometer and a stirring device, add 95 parts of 2-ethylhexyl acrylate (hereinafter referred to as "2EHA"), 5 parts of 2-hydroxyethyl acrylate (hereinafter referred to as "HEA") and 65 parts of toluene were polymerized at 61° C. for 6 hours in a nitrogen stream to obtain an acrylic polymer A.

[0168] Then, 3 parts of polyisocyanate compound (trade name Coronet L, manufactured by Nippon Polyurethane Co., Ltd.) was added to 100 parts of acrylic polymer A to prepare an adhesive composition solution.

[0169] The adhesive composition solution prepared above was coated on a polyethylene terephthalate film with a thickness of 50 μm, and heated and crosslinked at 80° C. for 3 minutes to form an adhesive layer with a thickness of 10 μm. Then, the obtained adhesive layer was transferred onto a polyethylene film having a thickness of 100 μm.

[0170] Next, a silicone resin was sprayed on the surfa...

Embodiment 2

[0175] In this example, except that the spraying amount of polysiloxane spray was adjusted so that the Si-Kα ray intensity was 100 kcps when the surface of the adhesive layer was surface modified, the same operation as in Example 1 was carried out to produce this Adhesive film with dicing sheet of Example.

Embodiment 3

[0177] In this example, except that a film coated with polysiloxane resin (manufactured by Mitsubishi Plastics Co., Ltd., trade name: Diyahol MRA38) was used for surface modification of the adhesive layer surface, and polysiloxane Except that alkane resin is transferred to the surface of the adhesive layer (the Si-Kα ray intensity on the surface of the adhesive layer is 0.9kcps), operate in the same way as in Example 1 to make the adhesive film with the dicing sheet of the present embodiment .

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Abstract

The present invention provides an adhesive film with a dicing sheet and a method of manufacturing the same. The adhesive film with the dicing sheet has a pressure-sensitive adhesive layer on a base material and also has a peelable adhesive film on the pressure-sensitive adhesive layer, that has an excellent peeling property when peeling a semiconductor chip obtained by dicing and an adhesive filmattached thereto together without impairing the holding power even during dicing a thin semiconductor wafer, and a method of manufacturing the same. The adhesive film with a dicing sheet of the present invention is formed by sequentially laminating a pressure-sensitive adhesive layer and an adhesive layer on a base material, in which the intensity of an Si-K[alpha] ray on at least one region on asurface of the pressure-sensitive adhesive layer to be pasted onto the adhesive layer is 0.01 to 100 kcps.

Description

technical field [0001] The present invention relates to an adhesive film with a dicing sheet that is used for dicing a semiconductor wafer in a state where an adhesive for fixing a semiconductor chip and an electrode member is attached to the semiconductor wafer before dicing, and a method for manufacturing the same. Moreover, this invention relates to the semiconductor device manufactured using the said adhesive film with a dicing sheet. Background technique [0002] The semiconductor wafer on which the circuit pattern is formed is diced into semiconductor chips after adjusting the thickness by back grinding as necessary (dicing process). In the cutting process, in order to remove the cutting layer, generally moderate hydraulic pressure (usually about 2kg / cm 2 ) to clean the semiconductor wafer. Then, the semiconductor chip is fixed to an adherend such as a lead frame with an adhesive (mounting step), and then transferred to a bonding step. In the mounting process, an ad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J133/00C09J163/00C09J161/06H01L21/68C09J7/22C09J7/30
CPCH01L2224/83855H01L24/29H01L2224/73265H01L2924/01016C09J2203/326H01L2924/01045H01L24/45H01L2924/0106H01L2924/01015H01L2224/48091H01L2924/01088C09J2201/36H01L2924/01004H01L2224/274C09J7/0239H01L2224/85205H01L2924/01024H01L2924/01005H01L2924/01057H01L2224/2919H01L2224/45144H01L2924/01013H01L2924/01056H01L2224/92247H01L2224/83191H01L2224/85201H01L2924/20106H01L2224/48247H01L21/6836H01L2224/85001H01L2924/0665H01L2924/20107H01L2924/01051H01L2924/07802H01L2924/01027H01L24/83H01L24/85H01L2924/20105H01L2224/27436H01L2224/32225H01L2225/06575H01L25/0657H01L2924/15747H01L2924/20103H01L2924/0105H01L2224/83856H01L2924/20104H01L2924/01047H01L2224/45124H01L2924/01046H01L2924/3025H01L2924/01006H01L2924/01028H01L2924/01079H01L2224/45147H01L2224/32245H01L2924/01014H01L2924/10253H01L2924/0103H01L2224/32145H01L2924/01082H01L2221/68327H01L2924/01007H01L2924/014H01L2924/01029H01L24/27H01L2924/01019H01L24/32H01L2224/48227H01L2924/01033H01L2224/92H01L2924/00014H01L2924/0102H01L2924/15787H01L2924/15788H01L2924/181H01L24/73H01L24/48C09J7/22C09J7/30Y10T428/2848Y10T156/10Y10T428/1476C09J2301/208H01L2224/2612H01L2224/78H01L2924/00H01L2924/3512H01L2924/00012C09J7/40B05D5/10C09J9/00C09J2301/312C09J2301/40
Inventor 菅生悠树天野康弘松村健村田修平
Owner NITTO DENKO CORP
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