Method for plating thick gold layer in circuit board manufacturing process
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 深圳市九和咏精密电路有限公司
- Publication Date
- 2011-07-27
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
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Abstract
Description
technical field
[0001] The invention relates to a method for plating gold on a circuit board, in particular to a method for plating thick gold in the process of making a circuit board. Background technique
[0002] At present, the commonly used circuit board printing is to use a nickel-gold sealing oil plating thick gold technology, such as figure 1 As shown, the main steps are primary nickel gold, double-sided wet film sealing, gold plating pretreatment, and thick gold plating, wherein, a) primary nickel gold plating is formed in a plating solution containing halogen elements, containing halogen elements The plating solution pollutes the environment; b), the double-sided wet-sealed film has poor electroplating resistance and is easy to bleed as the gold thickness increases; c), as the double-sided wet-sealed film is extended with the gold-plating time, the wet film dissolves The liquid pollutes the gold cylinder, making it difficult to control the gold color in the gold pl...