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Thermosetting ink for selectively resisting electroless nickel/immersion gold

A chemical nickel gold, thermosetting technology, applied in the field of selective chemical nickel gold resistant thermosetting ink, can solve the problems of chemical nickel/gold potion pollution, reduction of nickel cylinder, complicated process, etc.

Active Publication Date: 2016-12-21
广东科鼎新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the current PCB production, the OSP surface treatment part is covered with a dry film before the chemical nickel gold (through lamination, alignment, exposure, and development). Not only is the proces

Method used

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  • Thermosetting ink for selectively resisting electroless nickel/immersion gold
  • Thermosetting ink for selectively resisting electroless nickel/immersion gold
  • Thermosetting ink for selectively resisting electroless nickel/immersion gold

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0109] The thermosetting ink of the selective chemical resistance to nickel and gold, calculated in parts by weight, includes:

[0110]

[0111] Wherein, the mass ratio of the ethylene glycol monobutyl ether to the diethylene glycol ether in the solvent is 1:1.5; the curing agent is 2-methylimidazole; the thickener is gas phase dioxide silicon; the lubricant is polyethylene wax; the dispersant is a maleic acid-acrylic acid copolymer; the leveling agent is EL-2818 leveling agent.

[0112] The preparation steps of the thermosetting ink of the selective chemical resistance to nickel and gold are as follows:

[0113] (1) Blending: add modified phenolic resin, pigment, solvent, modified talcum powder, curing agent, auxiliary agent to the reaction kettle according to the weight part, and fully stir;

[0114] (2) Grinding: Send the blended solution in step (1) to a three-roll mill for dispersion and grinding for 2 to 3 times until the fineness is less than 10 microns. After passi...

Embodiment 2

[0123] The thermosetting ink of the selective chemical resistance to nickel and gold, calculated in parts by weight, includes:

[0124]

[0125] Wherein, the mass ratio of the ethylene glycol monobutyl ether to the diethylene glycol ether in the solvent is 1:2; the curing agent is 2-methylimidazole; the thickener is gas phase dioxide Silicon; the lubricant is polyethylene wax; the dispersant is a maleic acid-acrylic acid copolymer; the leveling agent is EL-2819 leveling agent;

[0126] The preparation steps of the thermosetting ink with selective chemical resistance to nickel and gold, the preparation steps of the modified phenolic resin, and the preparation steps of the modified talcum powder are the same as in Example 1.

Embodiment 3

[0128] The thermosetting ink of the selective chemical resistance to nickel and gold, calculated in parts by weight, includes:

[0129]

[0130] Wherein, the mass ratio of the ethylene glycol monobutyl ether to the diethylene glycol ether in the solvent is 1:1.2;

[0131] The curing agent is 2-methylimidazole; the thickener is fumed silica; the lubricant is polyethylene wax;

[0132] Described dispersion agent is maleic acid-acrylic acid copolymer; Described leveling agent is EL-2820 leveling agent;

[0133] The preparation steps of the thermosetting ink with selective chemical resistance to nickel and gold, the preparation steps of the modified phenolic resin, and the preparation steps of the modified talcum powder are the same as in Example 1.

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PUM

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Abstract

The invention provides a thermosetting ink for selectively resisting electroless nickel/immersion gold. The thermosetting ink comprises the following components in parts by weight: 30-40 parts of modified phenolic resin, 3-4 parts of pigment, 30-50 parts of solvent, 20-30 parts of modified talcum powder, 1-10 parts of curing agent and 0.5-10 parts of aid. The modified phenolic resin is a 2-(4-hydroxybenzoyl)benzoic acid modified phenolic resin; and the modified talcum powder is stearic-acid-containing octaphenyloctasilsesquioxane-modified acrylic acid talcum powder. The curing agent is one of a polyamide resin, an imidazole curing agent and a 590 curing agent.

Description

technical field [0001] The invention relates to the field of manufacturing printed circuit boards, and more specifically, the invention provides a thermosetting ink with selective chemical resistance to nickel and gold. Background technique [0002] The development of the electronics industry is changing with each passing day, and the design of PCB is becoming more and more difficult. In order to meet the needs of assembly and surface mount technologies such as BGA, FC (Flip-Chip), and COB (Chip-On-Board), PCB surface treatment Craftsmen are always looking for an ideal coating. The OSP process solves the uniformity and flatness of the coating and has good weldability and low cost. The process is simple and easy to control and is widely used. However, because the solder protection layer is thin and easily damaged, elastic contact cannot be achieved. The chemical nickel / gold coating is even and flat and can achieve elastic contact, and can also be used for conduction and heat...

Claims

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Application Information

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IPC IPC(8): C09D11/103C09D11/03
CPCC09D11/03C09D11/103
Inventor 聂雪峰
Owner 广东科鼎新材料股份有限公司
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