97results about "Printed circuits repair/correcting" patented technology

The invention discloses a leveling method and system for PCB processing in an integrated circuit, and relates to the related field of printed circuit boards, the method comprises the following steps: collecting surface data of a to-be-processed PCB, obtaining a morphology data set, and establishing a three-dimensional morphology model of the to-be-processed PCB based on the morphology data set; performing three-dimensional deviation identification on the to-be-processed PCB through the three-dimensional shape model, and extracting a three-dimensional deviation area; mapping to an integrated circuit for leveling analysis according to the three-dimensional deviation area, setting a leveling priority mapping graph, and performing dynamic leveling planning based on the leveling priority mapping graph to generate a leveling path; the leveling path is executed for leveling monitoring, flatness verification is carried out according to multi-source monitoring data, leveling quality parameters are obtained and backtracked to the leveling path for iterative updating, and self-adaptive leveling is carried out on the PCB to be processed. The technical problem that existing PCB machining leveling is insufficient in adaptability and precision is solved, and the technical effect of high-precision self-adaptive leveling is achieved.

The present disclosure provides an electronic device and a method for manufacturing the same. The electronic device includes a first transparent substrate, a conductive element, a circuit structure, and an electronic unit. The first transparent substrate has a plurality of through holes. The conductive element is disposed in at least one of the plurality of through holes, wherein the conductive element includes a first portion and a second portion surrounded by the second portion. The circuit structure is disposed on the first transparent substrate. The electronic unit is disposed on the circuit structure and is electrically connected to the conductive element through the circuit structure. The surface of the first portion of the conductive element has a plurality of recesses, and at least one portion of the second portion of the conductive element is disposed in at least one of the plurality of recesses.

The invention provides an SMT welding quality on-line detection method, and relates to the technical field of electronic quality detection.The method comprises the steps that after first reflow soldering is completed on a bottom surface component, three-dimensional contour parameters of a welding spot are extracted to serve as initial reference data; when the top surface component is subjected to second reflow soldering, temperature distribution data of a bottom surface welding spot is collected in real time, the thermal deformation quantity of the welding spot is calculated, when the deformation of the welding spot exceeds an independently set preset threshold value, the position coordinate and the deformation direction parameter of the welding spot are extracted, and the displacement compensation quantity is calculated; and temperature compensation is carried out through a temperature zone control system of the reflow furnace, so that secondary deformation of the bottom surface component is inhibited. According to the detection method provided by the invention, the technical problems that when the PCB is subjected to double-sided mounting, the bottom surface component is easy to deviate and insufficiently solder when being subjected to secondary reflow soldering, and the existing detection equipment is difficult to find the bottom surface welding defect in time are solved, and the stability and the reliability of the bottom surface welding quality in the double-sided mounting process are improved.

To increase the density of metal in the repaired area. [Solution] The repair device is a device for repairing defects 94 in a pattern 93 formed on the upper surface 91 of a substrate 9. The substrate holding part holds the substrate 9 on which the pattern 93 is formed on the upper surface 91. The application part 32 applies droplet-shaped conductive paste to the defects 94 in the pattern 93. The hardening part 33 hardens the conductive paste by heating and drying it. The compression part 34 presses the hardened conductive paste toward the substrate 9 while heating it. This makes it possible to increase the density of metal in the repair part provided to fill the defects 94.

This invention belongs to the field of circuit board rework technology, specifically relating to a disassembly fixture and process for multiple large-sized chips. The disassembly fixture includes a support base, a counterweight heat transfer block, and a cover plate. The circuit board is installed and fixed on the support base. After the circuit board is installed, the large-sized chips on the circuit board face upwards. Multiple collection nets and multiple heat insulation baffles are provided on the cover plate, with the position and number of the heat insulation baffles corresponding one-to-one with the collection nets and the faulty large-sized chips. The hot air flowing through the large-sized chips allows them to detach from the circuit board and fall onto the collection nets. This solution creates a hot air channel for the large-sized chips through the heat insulation baffles. Combined with the counterweight heat transfer block, it allows the faulty large-sized chips to fall onto the collection nets, thus achieving the removal of multiple large-sized chips at once. This reduces the number of thermal shocks the circuit board experiences during chip removal and improves rework efficiency.

This invention relates to the field of desoldering technology for electronic components, specifically an auxiliary stripping device for electronic components. It includes a platform and a main frame fixedly connected to the top of the platform. A slide is installed on the inner side of the platform, and a fixed bracket is provided on the top of the slide. This invention provides an auxiliary stripping device for electronic components, which uses pushing components and clamps to clamp and fix the substrate. In use, the substrate can be placed between the two pushing components on both sides, and then water is added to the U-shaped tube. The water enters the inside of the pushing tube and pushes the driven slider. The driven rod connected to the driven slider extends from the inside of the pushing tube and fixes the substrate through the clamps. When the two left and two right clamps approach each other, they conform to the surface shape of the substrate through the arc-shaped clamp and contact pad, providing the advantage of stable fixation even for irregularly shaped or round substrates.

The invention belongs to the field of PCB (printed circuit board) production, and particularly relates to a production method for preventing waste blockage in PCB forming routing, which comprises the following steps of: S1, performing positioning drilling on a PCB to drill a positioning hole; s2, the PCB is placed on a machine table, the PCB is positioned according to the positioning holes and fixed in a vacuum adsorption mode, and it is ensured that the board surface is flat and free of warping; s3, according to the specific graphic design of the PCB, a forming routing path is planned, and a waste crushing path is designed; s4, the forming routing equipment is started, according to the routing process, an end mill conducts contour cutting according to the preset path, and meanwhile the end mill crushes the waste along the waste crushing path; and S5, in the cutting process, a machine table dust collection system operates synchronously, a waste crushing path is designed before board milling, during board milling, an end mill conducts contour cutting according to a preset path, meanwhile, the end mill crushes waste along the waste crushing path, waste powder is crushed into small-particle waste, and therefore follow-up waste blockage and dust collection can be prevented.

The invention relates to a low-temperature thermal detinning and disassembling device for a circuit board. The low-temperature thermal detinning and disassembling device for the circuit board comprises a tin soldering fusion part, a mechanical separation part and an intermediate transfer part, the tin soldering melting part is a heating groove body filled with a liquid heat-conducting medium and is used for heating a circuit board, so that tin soldering is melted from a solid state to be in a flowable state; the mechanical separation part can be used for separating components and substrates on the circuit board, a centrifugal scattering shaft is arranged in the mechanical separation part, and the centrifugal scattering shaft comprises a centrifugal main shaft driven by a motor and scattering rods arranged on the surface of the centrifugal main shaft; and the intermediate transfer part is used for transferring and conveying the circuit board from the tin soldering melting part to the mechanical separation part and comprises a grating and a rotary driving lever driven by a motor, and the grating is obliquely fixed above the tail end of the tin soldering melting part. By reducing the working temperature of the liquid heat-conducting medium, tin soldering is kept in a molten state or only in a softened state, and in cooperation with a subsequent enhanced mechanical separation mode, separation among tin soldering, components and a substrate is promoted.

The application discloses LED product repair equipment and a repair method, and the LED product repair equipment comprises a product bearing moving device, a tin material supply device, a chip supply device, a tin point removing assembly module and a crystal taking and welding assembly module; the product bearing moving device comprises a workbench and a horizontal driving mechanism; the tin point removing assembly module comprises a first moving mechanism and a first moving table, a removing mechanism and a tin point mechanism are arranged on the first moving table, the first moving mechanism is connected with the first moving table and can drive the tin point mechanism to move above the tin material supply device or the workbench; the crystal taking and welding assembly module comprises a second moving mechanism and a second moving table, a crystal taking mechanism and a laser welding mechanism are arranged on the second moving table, the second moving mechanism is connected with the second moving table and can drive the crystal taking mechanism to move above the chip supply device and the workbench; the application can remove the defective chips on the LED product one by one and replace them with new chips, and can improve the repair efficiency.

The invention relates to the technical field of printed circuit board manufacturing, and discloses a method for improving poor gold surface of nickel immersion gold. The method comprises the following steps: sequentially carrying out board grinding and sand blasting pretreatment on the copper surface of the circuit board, carrying out automatic visual inspection to identify defects of the copper surface, overhauling and sorting based on defect identification, carrying out secondary sand blasting treatment and carrying out nickel-gold immersion treatment. According to the method, a closed-loop process of automatic visual inspection and maintenance sorting is embedded before the main process of nickel and gold immersion of the circuit board, so that the conversion from passive scrapping to active prevention is realized, the copper surface defects can be accurately identified and repaired on line, the poor gold surface caused by the defects is completely eradicated from the source, and the product rejection rate is remarkably reduced; and meanwhile, the unrepairable units are blocked, so that invalid consumption of precious metal materials is avoided, and the production cost is saved. In addition, a process optimization closed loop is formed based on feedback adjustment of detection data, and the quality stability and the production yield are improved.

Systems and methods are disclosed for overcoming technical challenges associated with machining and manufacturing printed circuit boards. In some embodiments, these systems and methods include processes for removing or reducing defects in initially fabricated printed circuit board (PCB) traces. Exemplary methods include processes for removing or reducing burrs in laser-micromachined PCB traces, which may be electrically isolated from one another. In some cases, a material is deposited on the PCB traces, forming a conductive layer that electrically connects all or most of the PCB traces and provides the electrical connection to remove or reduce defects in the PCB traces.

The invention relates to the technical field of circuit board processing, in particular to a method for saving soft gold salt in a PCB / SUB processing process, which comprises the following steps of: after an AOI (Automatic Optic Inspection) detection of a SUB jointed board is finished, cutting off electroplating lead connection between the unqualified Units and qualified Units in the SUB jointed board; and then, only qualified Units are subjected to soft gold electroplating treatment, and unqualified Units do not participate in the subsequent electroplating process. Selective electrical isolation is implemented before soft gold electroplating, so that the scrapped Units are completely separated from an electroplating loop and are prevented from participating in current distribution in the electroplating process, invalid deposition of gold salt on the scrapped Units is prevented, electroplating resources are intensively used for qualified Units, and the overall electroplating efficiency and consistency are improved. On the premise of not adding an extra complex electroplating process, the material cost is obviously saved, and good economic benefits are achieved.

The invention discloses a chip-level fault maintenance device for 10-layer and more than 10-layer PCBs, and relates to the technical field of PCB maintenance. Comprising the following steps of: 1, performing non-destructive detection on the internal structure and temperature distribution of the PCB by using a high-resolution X-ray detection system and a thermal imaging system respectively, and deducing a fault point; 2, observing the surface and microscopic internal structure of the PCB by adopting microscope equipment, obtaining the surface and internal microstructure images of the PCB, and extracting fine fault features; step 3, collecting each detection data and the extracted fine fault features; a fault point is positioned by combining an electronic probe and optical microscope equipment, and a fault element is removed by using a fusing repair mode of laser fusing or ion beam fusing; 4, monitoring and adjusting the fusing repair process in real time; and storing and analyzing maintenance process data, and providing data support for optimization and improvement.

An operating method of a dual laser repair device (100) is used to repair a circuit board (200) with circuit defects, wherein a defective circuit (210) has two conducting portions (214) and a defective portion (2121) located between the two conducting portions (214). The operating method includes: using a first laser member (112) of a dual laser repair module (110) to emit a laser beam toward the circuit board (200), thereby transforming the defective portion (2121) of the defective circuit (210) into a sintered portion (212); and directing a laser beam from the second laser member (114) of the dual laser repair module (110) with an energy and / or with an angle of divergence different from that of the laser beam emitted by the first laser member (112) toward the sintered portion (212) to carry out deflashing thereof, causing sintered sides (211) of the sintered portion (212) to be flush with two conducting sides (213) of the two conducting portions (214).

A system for photonic sintering of a metal electrode is provided. The system includes a display. The display includes a substrate including a first side and a second side, and the display includes the metal electrode extending from the first side to the second side. The system also includes a photonic device for sintering the metal electrode. The photonic device includes a lamp configured to generate photonic energy, and the photonic device includes a mask positioned between the metal electrode and the lamp. The mask defines a slit therein, and the mask is configured to allow a portion of the photon energy from the lamp to pass through the slit toward the metal electrode.

The invention discloses a method for repairing a microwave power amplifier module, which belongs to the field of microelectronic module repairing methods and comprises the following steps of: 1, removing a cover to process the module and visually inspecting internal faults; step 2, positioning a fault point through electrical characteristic test, including detection of gain, flatness and power indexes; step 3, carrying out plasma cleaning on the module; 4, replacing a damaged chip or adjusting circuit parameters to repair a fault; step 5, performing circuit function preliminary test on the repaired module; sixthly, conducting internal visual inspection on the states of welding spots and components; step 7, sealing a cover and finishing tin soldering operation; and step 8, self-checking the quality of the welding surface and the cleanliness of the cavity after sealing the cover. According to the method, the problems of low repair precision, poor process compatibility and high cost in the prior art are solved through a standardized process, and the module repair efficiency and reliability are improved.

This disclosure pertains to a method for repurposing a motherboard (100) to assemble an embedded computer system (1000, 2000, 3000, 4000), the method comprising the steps of: - (S1) extracting the motherboard (100) from an electronic device (10 ; 12, 14, 16); - (S2) directly connecting mechanically and electrically the extracted motherboard (100) to a carrier board (200), wherein the carrier board (200) provides electrical power and at least one motherboard interface to the extracted motherboard (100), - (S3) providing, via the carrier board (200), at least one standardized interface to the extracted motherboard (100), thereby enabling an external communication of the extracted motherboard (100), called repurposed motherboard (150), with electrical components external to the repurposed motherboard (150), and - (S4a, S4b, S4c) integrating the repurposed motherboard (150) into the embedded computer system (1000, 2000, 3000, 4000).

A single laser repair device and operating method thereof is used to carry out repairs on a defective circuit of a circuit board, wherein the defective circuit has two conducting portions and a defective portion therebetween. The operating method comprises: using a laser light source of a single laser dual optical circuit repair member of a single laser repair module to emit an initial laser beam toward an energy distribution unit, thereby producing a first laser beam and a second laser beam different from the first laser beam; using a switching unit to mask the second laser beam, thereby enabling transmitting the first laser beam toward the circuit board after passing through the switching unit, to transform the defective portion into a sintered portion; and using the switching unit to mask the first laser beam, thereby enabling transmitting the second laser beam toward the circuit board after passing through the switching unit, to carry out deflashing of the sintered portion, causing sintered sides of the sintered portion to be flush with two conducting sides of the two conducting portions.

The invention provides a high-temperature circuit board chip replacement device, and relates to the technical field of power electronics, and the device comprises a mixed top heating device which is disposed at the top of a high-temperature circuit board and is used for heating and replacing a to-be-replaced chip in the high-temperature circuit board; and the bottom movable heating device is arranged at the bottom of the high-temperature circuit board and is used for fixing the high-temperature circuit board and monitoring the temperature of the chip to be replaced. According to the invention, the hot air heating area can be strictly controlled and concentrated in the pin area of the chip needing to be loaded and unloaded, so that the soldering tin can be uniformly heated, the heating time is greatly reduced, and the influence on other devices on the board is less.

The application discloses a PCB defect correction method and a circuit board manufacturing method. The correction method comprises the following steps: inputting the design document of the circuit board to be detected into an AOI device, wherein the design document comprises the size design information of each object on the circuit board; scanning the circuit board by using the AOI device to obtain a scanning image, and acquiring the pixel unit size currently set by the AOI device; in response to a detection request for a target object on the circuit board, determining the number of pixels occupied by the target object in the scanning image in a requested measurement direction; calculating the size of the target object in the requested measurement direction according to the current pixel unit size of the AOI device and the number of pixels occupied by the target object; comparing the size of the target object in the requested measurement direction with the size of the target object in the design document; if the size difference exceeds a preset difference threshold, it is determined that the target object has a defect, and the process type of the target object is determined and the process parameter of the target object is corrected according to the design document.

An electronic device comprising a stack with a circuit layer (15) covered by at least one delamination layer (12). A graphic layer (13) with a pattern of one or more light reflecting areas (13f) and one or more light absorbing areas (13s) is provided at a first side (S1). The one or more light reflecting areas (13f) are arranged to cover circuit parts (15c) of the circuit layer (15). The one or more light absorbing areas (13s) are arranged at areas without the circuit parts (15c) and without the at least one delamination layer (12), and are configured to delaminate under the influence of light transmitted through a first substrate (11) and absorbed by the one or more light absorbing areas (13s), while the one or more light reflecting areas (13f) are configured to reflect said light.

The invention relates to an automatic assembling and disassembling device for a PCB. The automatic assembling and disassembling device comprises a conveying mechanism and a returning mechanism arranged on one side of the conveying mechanism. The conveying mechanism comprises a conveying track and a plurality of conveying belt structures which are clamped with one another, the conveying mechanism sequentially penetrates through a solder paste printing area, a surface mounting area, a reflow soldering area and a detection area, the returning mechanism comprises a returning track and dragging structures which are arranged at the two connecting positions of the returning track and the conveying track respectively, the returning track penetrates through a PCB dismounting station, and the PCB dismounting station is connected with the PCB mounting area. The discharging end is connected with the conveying track at the feeding port of the chip mounting area, and the dragging structure is used for dragging the PCB with the welding quality at the discharging port of the detection area to the returning track and returning the PCB to the feeding port of the chip mounting area after passing through the PCB dismounting station; according to the invention, the return mechanism is arranged at the end part of the conveying mechanism, so that the PCB with the welding quality problem can be dragged out and disassembled, and then is put back to the inlet side of the chip mounting area on the conveying mechanism again, and chip mounting is carried out on the PCB again.

The invention relates to the technical field of flexible circuit boards, and discloses a control method and system for a three-dimensional curved surface attaching jig of a flexible circuit board, and the method comprises the steps: carrying out the surface scanning of a substrate, obtaining the curvature radius data, arranging a plurality of electromagnetic clamping points, dividing the electromagnetic clamping points into a plurality of sectors, meanwhile, calculating a target pressure value of a driving actuator; the release time interval between the adjacent electromagnetic clamping points is calculated, and a boundary time sequence control program is generated; all electromagnetic clamping points are kept in a locked state and the flexible circuit board is positioned in the pre-lamination stage, a flat area, a transition area and a high-curvature area are processed in sequence in the partition lamination stage, the electromagnetic clamping points in corresponding sectors are released according to a boundary time sequence control program, and corresponding target pressure values are applied. And in the pressure maintaining and curing stage, all the electromagnetic clamping points are switched to the locking state again, and partition heating is started. According to the method, the pressure distribution uniformity is ensured, and the quality defect caused by the too large stress gradient is effectively restrained.

The embodiment of the invention relates to the technical field of PCB (Printed Circuit Board) manufacturing, in particular to a circuit board surface treatment method and device, which can realize directional filling of solder resist ink in a pit area by accurately identifying a PCB pit and manufacturing a corresponding hole plugging screen plate for point plugging treatment, effectively eliminate the defect of star point copper exposure and improve the production efficiency. The method has the advantages that the filling effect of the solder resist ink in the pit area of the PCB is improved, the defect of star point copper exposure is avoided, and meanwhile the production cost and the process complexity are reduced.

This invention relates to an automated device for foam bonding and external circuit shaping of PCBAs, comprising: a frame, a PCBA feeding assembly, a PCBA conveyor line, a foam bonding assembly, and a bending assembly; the PCBA feeding assembly includes a multi-axis feeding robot and a feeding vacuum nozzle; the foam bonding assembly includes a foam bonding frame, a foam bonding robot, a foam bonding mechanical gripper, and a foam bonding vacuum nozzle; the bending assembly includes a bending transfer assembly and a bending mechanism; the bending mechanism includes a bending frame, a bending positioning table, a bending clamping angle cylinder, a bending plate, and a bending flipping drive, the latter driving the bending plate to rotate. This invention achieves automated foam bonding to PCBAs through the foam bonding robot of the foam bonding assembly in conjunction with the PCBA conveyor line, resulting in high efficiency; the bending mechanism utilizes the flipping bending plate to automatically bend the pins into an L-shape, clamping the foam between the pin and the PCBA, ensuring that the bending plate does not damage the foam due to interference throughout the process.

The application discloses a PCB copper surface repairing device and a repairing process, relates to the PCB repairing technical field, and solves the problem that when four elastic ropes are used to fix the PCB, the elastic ropes need to be repeatedly adjusted multiple times to ensure that the rotating plate on the elastic rope is perpendicular to the PCB, and the fixing steps of the PCB are complicated, comprising a water washing pool, a drain pipe which is in communication with the water washing pool and is fixedly installed outside the water washing pool, a material supporting mechanism which is used for containing the PCB to be repaired and is installed in the inside of the water washing pool, and a driving assembly which is used for driving the material supporting mechanism to move backward in the inside of the water washing pool, and the material supporting mechanism can automatically flexibly clamp the PCB, the fixing operation of the PCB is simple and convenient, and the repairing efficiency of the copper surface of the PCB is greatly improved.

The invention belongs to circuit board piece auxiliary production equipment, and provides an electronic component maintenance intelligent flexible production line which comprises a front-section dismounting platform, a middle quality inspection table, a rear-section welding platform and a pneumatic FRL device, the middle quality inspection table is arranged between the front-section dismounting platform and the rear-section welding platform, and the pneumatic FRL device is arranged between the middle quality inspection table and the rear-section welding platform. And the pneumatic FRL device is arranged on the front-section dismounting platform. By means of the high-resolution visual systems of the front section and the rear section, components can be rapidly and accurately positioned, the robot is guided to achieve automatic disassembly and welding operation, the maintenance period is effectively shortened, and the production efficiency is improved. Meanwhile, the equipment is easy and convenient to operate and can be operated through simple training, the labor cost and labor intensity are greatly reduced, personal errors are reduced, the stability and safety of maintenance work are improved, a new intelligent and automatic solution is brought to the field of electronic component maintenance, and industrial technical progress is powerfully promoted.

The invention relates to the technical field of circuit board manufacturing, and discloses a high-density circuit board surface treatment device which comprises partition hot air knives located on the two sides of a high-density circuit board, and each partition hot air knife comprises a middle-section main hot air blowing cavity, a middle-section main hot air blowing cavity, a middle-section main hot air blowing cavity and a middle-section main hot air blowing cavity, slow cooling air flow blown out of a slow cooling air outlet of the rear-section slow cooling air cavity is obliquely and upwards blown to the high-density circuit board, and a slow cooling air conveying air duct of the rear-section slow cooling air cavity is communicated with the external environment above the top of the equipment; the waste gas upper air return cavity is located between the middle-section main blowing hot air cavity and the rear-section slow cooling air cavity, and a waste gas upper air return opening is located between the main blowing opening and the slow cooling air outlet; and the waste gas return air conveying duct is communicated with the waste gas upper return air cavity, and waste gas in the waste gas recovery pipe is led to waste gas treatment equipment. The hot air recovery and reutilization are realized, so that the energy consumption is reduced, the hot air utilization rate is improved, the environmental pollution is reduced, and the process stability is improved.