165results about "Printed circuits repair/correcting" patented technology

The invention discloses a leveling method and system for PCB processing in an integrated circuit, and relates to the related field of printed circuit boards, the method comprises the following steps: collecting surface data of a to-be-processed PCB, obtaining a morphology data set, and establishing a three-dimensional morphology model of the to-be-processed PCB based on the morphology data set; performing three-dimensional deviation identification on the to-be-processed PCB through the three-dimensional shape model, and extracting a three-dimensional deviation area; mapping to an integrated circuit for leveling analysis according to the three-dimensional deviation area, setting a leveling priority mapping graph, and performing dynamic leveling planning based on the leveling priority mapping graph to generate a leveling path; the leveling path is executed for leveling monitoring, flatness verification is carried out according to multi-source monitoring data, leveling quality parameters are obtained and backtracked to the leveling path for iterative updating, and self-adaptive leveling is carried out on the PCB to be processed. The technical problem that existing PCB machining leveling is insufficient in adaptability and precision is solved, and the technical effect of high-precision self-adaptive leveling is achieved.

The invention provides an industrial circuit board intelligent repairing method and system based on a lossless damping chip, and the method comprises the steps: obtaining multi-dimensional acoustic response data in an industrial circuit board, carrying out the spatial analysis of a phase offset in the data, and generating a three-dimensional geometric boundary coordinate set of a microcrack region; activating a resonant wave stabilization processing mode of the lossless damping chip, and generating a mechanical resonant frequency and a dynamic constraint force field for inhibiting crack propagation; generating a target filling scheme according to the stress distribution state of the dynamic constraint force field; constructing a conductive filling path topological structure, and generating a continuous conductive interface; according to the resonance response characteristic between the continuous conductive interface and the mechanical resonance frequency, a micron-sized crack repairing scheme is generated, and intelligent repairing of the industrial circuit board is carried out. The method breaks through the problem of fuzzy positioning of the crack spatial form in the traditional detection technology; the accurate permeation of the filling material along the crack is ensured; verification and closed loop feedback of the repairing effect are achieved, and the stability and reliability of the repaired industrial circuit board are remarkably improved.

The present disclosure provides an electronic device and a method for manufacturing the same. The electronic device includes a first transparent substrate, a conductive element, a circuit structure, and an electronic unit. The first transparent substrate has a plurality of through holes. The conductive element is disposed in at least one of the plurality of through holes, wherein the conductive element includes a first portion and a second portion surrounded by the second portion. The circuit structure is disposed on the first transparent substrate. The electronic unit is disposed on the circuit structure and is electrically connected to the conductive element through the circuit structure. The surface of the first portion of the conductive element has a plurality of recesses, and at least one portion of the second portion of the conductive element is disposed in at least one of the plurality of recesses.

The invention discloses circuit board processing and welding equipment, which relates to the technical field of welding jig application, and comprises a tin welding gun body, and further comprises a control box fixedly connected to one side of the tin welding gun body and used for controlling the operation of the welding equipment; the smoke exhausting and air cooling mechanism is arranged at the bottom of the control box, is used for adsorbing smoke during tin soldering of the tin welding gun body and performing air cooling on the tin welding gun body when the tin welding gun body is idle, and comprises an adsorption box fixedly connected with the bottom of the control box and fan blades movably arranged in the adsorption box in a sleeving manner; and the protective isolation mechanism is arranged on one side of the adsorption box and is used for shielding a tin point tip of the tin welding gun body and preventing tin dripping. The equipment not only can be used for shielding flowing tin, but also can be used for sucking and collecting smoke generated during tin soldering and quickly air-cooling the used tin welding gun body when the tin welding gun body is idle, so that the use effect and the service life of the circuit board plug-in welding jig are effectively guaranteed.

The present invention relates to a Harness PCB that replaces the traditional wiring harness used in a pinball machine. The Harness PCB comprises circuit traces, connectors for all playfield components, LED assemblies, and connectors for device boards. The Harness PCB is attached to the bottom of the playfield and may comprise a single PCB or multiple interconnected PCBs. All playfield components, cabinet components, device boards, and LEDs are connected to the Harness PCB in such a manner that all components that may fail during normal operation are both modular and replaceable. The Harness PCB can be replicated by connecting the device boards directly to breakout boards to create an identical software and hardware environment as the full Harness PCB.

The invention provides an SMT welding quality on-line detection method, and relates to the technical field of electronic quality detection.The method comprises the steps that after first reflow soldering is completed on a bottom surface component, three-dimensional contour parameters of a welding spot are extracted to serve as initial reference data; when the top surface component is subjected to second reflow soldering, temperature distribution data of a bottom surface welding spot is collected in real time, the thermal deformation quantity of the welding spot is calculated, when the deformation of the welding spot exceeds an independently set preset threshold value, the position coordinate and the deformation direction parameter of the welding spot are extracted, and the displacement compensation quantity is calculated; and temperature compensation is carried out through a temperature zone control system of the reflow furnace, so that secondary deformation of the bottom surface component is inhibited. According to the detection method provided by the invention, the technical problems that when the PCB is subjected to double-sided mounting, the bottom surface component is easy to deviate and insufficiently solder when being subjected to secondary reflow soldering, and the existing detection equipment is difficult to find the bottom surface welding defect in time are solved, and the stability and the reliability of the bottom surface welding quality in the double-sided mounting process are improved.

To increase the density of metal in the repaired area. [Solution] The repair device is a device for repairing defects 94 in a pattern 93 formed on the upper surface 91 of a substrate 9. The substrate holding part holds the substrate 9 on which the pattern 93 is formed on the upper surface 91. The application part 32 applies droplet-shaped conductive paste to the defects 94 in the pattern 93. The hardening part 33 hardens the conductive paste by heating and drying it. The compression part 34 presses the hardened conductive paste toward the substrate 9 while heating it. This makes it possible to increase the density of metal in the repair part provided to fill the defects 94.

Systems and methods are provided for inline process monitoring (e.g., remote inline process monitoring) for scalable and precision high-yield manufacturing. Antenna probes, such as millimeter (mm) wave (mmWave) antenna (mWA) probes, can be introduced into fabrication equipment to reveal the nature of hidden conductor and / or dielectric defects, as well as via-pad and / or device pad-trace misalignments, going beyond automated optical inspection (AOI) or contact probing.

The invention discloses a PCB (printed circuit board) maintenance support which comprises a support body, a motion track is arranged at the top of the support body, a motion base is arranged on the motion track, and the motion base is used for mounting a maintenance manipulator and providing a motion basis for the maintenance manipulator; a pressing plate mechanism is further arranged on the top of the frame body. According to the support for overhauling the PCB, the pressing plate mechanism and the movement track are erected, the mechanical arm is erected through the movement track, automatic pressing and large-range movement of the mechanical arm are achieved, automatic overhauling is carried out, and the overhauling efficiency and quality of the flexible circuit board are greatly improved.

A method and apparatus extracts solder from a redress site of multiple chips on a laminate structure. The method includes depositing conductive pads on a flexible insulating film with a same pitch as solder bumps on a laminate structure that are to be extracted. The flexible film is mounted on a retaining surface, and the conductive pads are heated at a temperature above a solder melting temperature. The retaining surface descends toward a laminate having solder thereon until the heated conductive pads come into contact with at least one solder bump. The retaining surface is retracted from contact and includes most of the at least one contacted solder bump that was on the laminate structure. The operations repeat until the solder remaining on die pads on the laminate is similar to an amount of initially arranged pre-solder.

This invention belongs to the field of circuit board rework technology, specifically relating to a disassembly fixture and process for multiple large-sized chips. The disassembly fixture includes a support base, a counterweight heat transfer block, and a cover plate. The circuit board is installed and fixed on the support base. After the circuit board is installed, the large-sized chips on the circuit board face upwards. Multiple collection nets and multiple heat insulation baffles are provided on the cover plate, with the position and number of the heat insulation baffles corresponding one-to-one with the collection nets and the faulty large-sized chips. The hot air flowing through the large-sized chips allows them to detach from the circuit board and fall onto the collection nets. This solution creates a hot air channel for the large-sized chips through the heat insulation baffles. Combined with the counterweight heat transfer block, it allows the faulty large-sized chips to fall onto the collection nets, thus achieving the removal of multiple large-sized chips at once. This reduces the number of thermal shocks the circuit board experiences during chip removal and improves rework efficiency.

This invention relates to the field of desoldering technology for electronic components, specifically an auxiliary stripping device for electronic components. It includes a platform and a main frame fixedly connected to the top of the platform. A slide is installed on the inner side of the platform, and a fixed bracket is provided on the top of the slide. This invention provides an auxiliary stripping device for electronic components, which uses pushing components and clamps to clamp and fix the substrate. In use, the substrate can be placed between the two pushing components on both sides, and then water is added to the U-shaped tube. The water enters the inside of the pushing tube and pushes the driven slider. The driven rod connected to the driven slider extends from the inside of the pushing tube and fixes the substrate through the clamps. When the two left and two right clamps approach each other, they conform to the surface shape of the substrate through the arc-shaped clamp and contact pad, providing the advantage of stable fixation even for irregularly shaped or round substrates.

The invention belongs to the field of PCB (printed circuit board) production, and particularly relates to a production method for preventing waste blockage in PCB forming routing, which comprises the following steps of: S1, performing positioning drilling on a PCB to drill a positioning hole; s2, the PCB is placed on a machine table, the PCB is positioned according to the positioning holes and fixed in a vacuum adsorption mode, and it is ensured that the board surface is flat and free of warping; s3, according to the specific graphic design of the PCB, a forming routing path is planned, and a waste crushing path is designed; s4, the forming routing equipment is started, according to the routing process, an end mill conducts contour cutting according to the preset path, and meanwhile the end mill crushes the waste along the waste crushing path; and S5, in the cutting process, a machine table dust collection system operates synchronously, a waste crushing path is designed before board milling, during board milling, an end mill conducts contour cutting according to a preset path, meanwhile, the end mill crushes waste along the waste crushing path, waste powder is crushed into small-particle waste, and therefore follow-up waste blockage and dust collection can be prevented.

The invention provides a component repairing device which comprises a glue removing assembly, a picking assembly, a heating assembly, a driving mechanism, a working table with a heating area and a loading table driven by the driving mechanism to move above the working table. The glue removing assembly comprises a glue removing mechanism used for removing glue and a first power mechanism used for driving the glue removing mechanism to move in the vertical direction. The picking assembly is mounted on the loading table and comprises a picking mechanism for picking the components and parts and a second power mechanism for driving the picking mechanism to move in the vertical direction; the heating assembly is installed on the loading table and comprises a heat source capable of generating hot air and a third power mechanism used for driving the heat source to move in the vertical direction, the heat source is provided with a hot air outlet, and the hot air outlet faces downwards. The repair efficiency of components can be greatly improved, and the structure is simple and compact.

The invention relates to a low-temperature thermal detinning and disassembling device for a circuit board. The low-temperature thermal detinning and disassembling device for the circuit board comprises a tin soldering fusion part, a mechanical separation part and an intermediate transfer part, the tin soldering melting part is a heating groove body filled with a liquid heat-conducting medium and is used for heating a circuit board, so that tin soldering is melted from a solid state to be in a flowable state; the mechanical separation part can be used for separating components and substrates on the circuit board, a centrifugal scattering shaft is arranged in the mechanical separation part, and the centrifugal scattering shaft comprises a centrifugal main shaft driven by a motor and scattering rods arranged on the surface of the centrifugal main shaft; and the intermediate transfer part is used for transferring and conveying the circuit board from the tin soldering melting part to the mechanical separation part and comprises a grating and a rotary driving lever driven by a motor, and the grating is obliquely fixed above the tail end of the tin soldering melting part. By reducing the working temperature of the liquid heat-conducting medium, tin soldering is kept in a molten state or only in a softened state, and in cooperation with a subsequent enhanced mechanical separation mode, separation among tin soldering, components and a substrate is promoted.

The invention relates to the technical field of circuit boards, and discloses a device for improving warpage of a circuit board, the device comprises a heating box and a warped circuit board located in the heating box, the top of the heating box is provided with a flattening mechanism, the interior of the heating box is fixedly connected with an object placing plate, two sides of the object placing plate are provided with sliding grooves, and the sliding grooves are arranged in the heating box. A bearing plate is slidably connected to the inner wall of the sliding groove, a protection pad is arranged on the outer wall of the top of the bearing plate, a plurality of adjusting springs are fixedly connected between the bearing plate and the inner wall of the sliding groove, and the two ends of the bottom of the warped circuit board are located on the corresponding protection pads. A first guide column and a third guide column are fixedly connected to the two sides of the interior of the sliding groove correspondingly. The protection pads bearing the two ends of the circuit board are driven to move synchronously through the displacement change of the steel wire rope, so that the protection pads follow the displacement track of the edge of the circuit board, relative friction between the protection pads and the circuit board is eliminated, abrasion is remarkably reduced, and the service life is prolonged.

A component carrier, a component carrier arrangement, and a method of manufacturing the component carrier are disclosed. The component carrier includes a stack having i) at least one electrically insulating layer structure and at least one electrically conductive layer structure on top of the electrically insulating layer structure; and ii) at least one lateral wall. The electrically insulating layer structure includes a first edge portion defining at least partially the lateral wall of the stack. The electrically conductive layer structure includes a second edge portion being offset with respect to the first edge portion towards the inner part of the stack, in particular by a distance in the range between 0.05 μm and 15 μm.

The application discloses LED product repair equipment and a repair method, and the LED product repair equipment comprises a product bearing moving device, a tin material supply device, a chip supply device, a tin point removing assembly module and a crystal taking and welding assembly module; the product bearing moving device comprises a workbench and a horizontal driving mechanism; the tin point removing assembly module comprises a first moving mechanism and a first moving table, a removing mechanism and a tin point mechanism are arranged on the first moving table, the first moving mechanism is connected with the first moving table and can drive the tin point mechanism to move above the tin material supply device or the workbench; the crystal taking and welding assembly module comprises a second moving mechanism and a second moving table, a crystal taking mechanism and a laser welding mechanism are arranged on the second moving table, the second moving mechanism is connected with the second moving table and can drive the crystal taking mechanism to move above the chip supply device and the workbench; the application can remove the defective chips on the LED product one by one and replace them with new chips, and can improve the repair efficiency.

The invention relates to the technical field of printed circuit board manufacturing, and discloses a method for improving poor gold surface of nickel immersion gold. The method comprises the following steps: sequentially carrying out board grinding and sand blasting pretreatment on the copper surface of the circuit board, carrying out automatic visual inspection to identify defects of the copper surface, overhauling and sorting based on defect identification, carrying out secondary sand blasting treatment and carrying out nickel-gold immersion treatment. According to the method, a closed-loop process of automatic visual inspection and maintenance sorting is embedded before the main process of nickel and gold immersion of the circuit board, so that the conversion from passive scrapping to active prevention is realized, the copper surface defects can be accurately identified and repaired on line, the poor gold surface caused by the defects is completely eradicated from the source, and the product rejection rate is remarkably reduced; and meanwhile, the unrepairable units are blocked, so that invalid consumption of precious metal materials is avoided, and the production cost is saved. In addition, a process optimization closed loop is formed based on feedback adjustment of detection data, and the quality stability and the production yield are improved.

The invention relates to a method for removing a component (1) applied to a circuit board (2) wherein the component (1) has a housing (11) and a plurality of terminals, wherein each of the terminals is connected by a separate soldered connection (12) to a respective contact pad on the circuit board (2), comprising: a) positioning a milling tool (3) above the position of a first terminal, the milling tool (3) being located at an initial height above the circuit board (2) not touching the circuit board (2); b) setting the milling tool (3) in rotation and moving the milling tool (3) through the component (1) in a direction (z) substantially orthogonal to the circuit board (2) to a predefined height (h) above the circuit board (2); c) moving the milling tool (3) to the initial height; d) repeating method steps a) to c) for the other terminals. The invention further relates to a milling tool (3) designed to carry out the method according to the invention.

The present invention discloses a novel dust sticking machine and a dust sticking paper roll assembly and a dust sticking roller assembly thereon; the dust sticking machine is provided with an upper dust sticking roller assembly, a lower dust sticking roller assembly, an upper dust sticking paper roll assembly and a transmission assembly; the lower dust sticking roller assembly and the upper dust sticking roller assembly form a dust sticking roller assembly, which are respectively used for sticking dust on the upper and lower sides of a circuit board; the size of the dust sticking gap between the lower dust sticking roller assembly and the upper dust sticking roller assembly can be changed; before the circuit board enters the board, a large gap is reserved between the upper sticking roller assembly and the lower dust sticking roller assembly. When one side edge of the circuit board enters the dust sticking channel of the circuit board, the upper dust sticking paper roll assembly presses down, driving the upper dust sticking roller assembly to press down. At this time, regardless of whether the circuit board has warped, the upper dust sticking roller assembly directly presses down on the upper side of the circuit board, so that the phenomenon of card board will not occur; the upper dust sticking paper roll assembly and the dust sticking roller assembly provided by the second and third objects of the invention are components in a pull-out mode, which is convenient for cleaning and replacement.

The present invention relates to a method for attaching (P) a component (3a) to an electronic board (1), comprising the following steps: - filling (E2) the window (8) of a first screen-printing screen with solder paste (9); - applying (E3) a heat treatment to the printed circuit board (2) in order to transform the solder paste (9) into a contact pad (11); - filling (E5) the window (13) of a second screen-printing screen with solder paste; - placing (E6) a component (3a) on the solder paste (14); - applying (E7) a heat treatment to the printed circuit board (2) so as to transform the solder paste (14) into a solder joint (6a).

The invention relates to the technical field of electronic manufacturing, and discloses an aluminum substrate electrical element rapid replacement device which comprises a bottom groove plate, one side of the bottom groove plate is fixedly connected with an auxiliary bottom plate, one end of the auxiliary bottom plate is fixedly connected with a mounting partition plate, and one side, away from the bottom groove plate, of the mounting partition plate is fixedly connected with an electrical box. A handle is arranged at the upper end of the outer side face of the electrical box, two first supporting columns are fixedly connected to one end of the upper side face of the bottom groove plate, a second supporting column is fixedly connected to one end of the upper side face of the bottom groove plate, a workbench plate is fixedly connected to the tops of the upper side faces of the first supporting columns, and one side of the workbench plate is fixedly connected to the side face of the mounting partition plate. The device further comprises a plane moving device, a temperature rising auxiliary device and a dismounting and mounting equipment connecting table, precise temperature control is achieved through plane moving and layered heating, and aluminum substrates with different thicknesses can be rapidly clamped and treated in cooperation with a modular tool suspension system and a self-adaptive clamping structure.

Systems and methods are disclosed for overcoming technical challenges associated with machining and manufacturing printed circuit boards. In some embodiments, these systems and methods include processes for removing or reducing defects in initially fabricated printed circuit board (PCB) traces. Exemplary methods include processes for removing or reducing burrs in laser-micromachined PCB traces, which may be electrically isolated from one another. In some cases, a material is deposited on the PCB traces, forming a conductive layer that electrically connects all or most of the PCB traces and provides the electrical connection to remove or reduce defects in the PCB traces.

The invention relates to the technical field of circuit board processing, in particular to a method for saving soft gold salt in a PCB / SUB processing process, which comprises the following steps of: after an AOI (Automatic Optic Inspection) detection of a SUB jointed board is finished, cutting off electroplating lead connection between the unqualified Units and qualified Units in the SUB jointed board; and then, only qualified Units are subjected to soft gold electroplating treatment, and unqualified Units do not participate in the subsequent electroplating process. Selective electrical isolation is implemented before soft gold electroplating, so that the scrapped Units are completely separated from an electroplating loop and are prevented from participating in current distribution in the electroplating process, invalid deposition of gold salt on the scrapped Units is prevented, electroplating resources are intensively used for qualified Units, and the overall electroplating efficiency and consistency are improved. On the premise of not adding an extra complex electroplating process, the material cost is obviously saved, and good economic benefits are achieved.

The invention discloses a chip-level fault maintenance device for 10-layer and more than 10-layer PCBs, and relates to the technical field of PCB maintenance. Comprising the following steps of: 1, performing non-destructive detection on the internal structure and temperature distribution of the PCB by using a high-resolution X-ray detection system and a thermal imaging system respectively, and deducing a fault point; 2, observing the surface and microscopic internal structure of the PCB by adopting microscope equipment, obtaining the surface and internal microstructure images of the PCB, and extracting fine fault features; step 3, collecting each detection data and the extracted fine fault features; a fault point is positioned by combining an electronic probe and optical microscope equipment, and a fault element is removed by using a fusing repair mode of laser fusing or ion beam fusing; 4, monitoring and adjusting the fusing repair process in real time; and storing and analyzing maintenance process data, and providing data support for optimization and improvement.

A component carrier, a component carrier arrangement and a method of manufacturing a component carrier (100) are described. The component carrier (100) has a stack (101), i) wherein the stack (101) comprises at least one electrically insulating layer structure (120) and at least one electrically conductive layer structure (110) on top of the electrically insulating layer structure (120); ii) wherein the stack (101) comprises at least one lateral wall (150); iii) wherein the electrically insulating layer structure (120) comprises a first edge portion (125) at least partially defining a lateral wall (150) of the stack (101); and iv) wherein the electrically conductive layer structure (110) comprises a second edge portion (115) which is offset relative to the first edge portion (125) towards an inner portion of the stack (101), in particular by a distance (D) in a range of between 0.05 [mu] m and 15 [mu] m.

An operating method of a dual laser repair device (100) is used to repair a circuit board (200) with circuit defects, wherein a defective circuit (210) has two conducting portions (214) and a defective portion (2121) located between the two conducting portions (214). The operating method includes: using a first laser member (112) of a dual laser repair module (110) to emit a laser beam toward the circuit board (200), thereby transforming the defective portion (2121) of the defective circuit (210) into a sintered portion (212); and directing a laser beam from the second laser member (114) of the dual laser repair module (110) with an energy and / or with an angle of divergence different from that of the laser beam emitted by the first laser member (112) toward the sintered portion (212) to carry out deflashing thereof, causing sintered sides (211) of the sintered portion (212) to be flush with two conducting sides (213) of the two conducting portions (214).

A system for photonic sintering of a metal electrode is provided. The system includes a display. The display includes a substrate including a first side and a second side, and the display includes the metal electrode extending from the first side to the second side. The system also includes a photonic device for sintering the metal electrode. The photonic device includes a lamp configured to generate photonic energy, and the photonic device includes a mask positioned between the metal electrode and the lamp. The mask defines a slit therein, and the mask is configured to allow a portion of the photon energy from the lamp to pass through the slit toward the metal electrode.