6results about "Printed circuits repair/correcting" patented technology

The application discloses a PCB defect correction method and a circuit board manufacturing method. The correction method comprises the following steps: inputting the design document of the circuit board to be detected into an AOI device, wherein the design document comprises the size design information of each object on the circuit board; scanning the circuit board by using the AOI device to obtain a scanning image, and acquiring the pixel unit size currently set by the AOI device; in response to a detection request for a target object on the circuit board, determining the number of pixels occupied by the target object in the scanning image in a requested measurement direction; calculating the size of the target object in the requested measurement direction according to the current pixel unit size of the AOI device and the number of pixels occupied by the target object; comparing the size of the target object in the requested measurement direction with the size of the target object in the design document; if the size difference exceeds a preset difference threshold, it is determined that the target object has a defect, and the process type of the target object is determined and the process parameter of the target object is corrected according to the design document.

An electronic device includes a substrate having a surface, a first conducting layer disposed on the surface of the substrate, a second conducting layer disposed on the first conducting layer, a first electronic component disposed on the first conducting layer and electrically connected to the first conducting layer, and a second electronic component disposed on the second conducting layer and electrically connected to the second conducting layer. The second conducting layer is disposed between the first conducting layer and the second electronic component. In a cross-section view, the first electronic component is overlapped with the second conducting layer along a direction parallel to the surface of the substrate.

The application provides a mounting detection repair system and method, which adopts a digital signal processing method to amplify and identify two-dimensional image signals. A small vibration is given to a to-be-detected circuit board in a to-be-detected area, video acquisition and transmission are performed by a high-speed camera, two-dimensional images are preprocessed, aligned and cancelled, corresponding points on residual features are tracked, and the tracking is converted into one-dimensional signals for coding and filtering, so that target components are identified. Finally, a multi-degree-of-freedom mechanical arm is used for re-mounting and welding of the components. The application does not need manual participation, can accurately detect whether the mounting of the components is qualified, reduces the missed detection rate and labor cost, improves the production test efficiency, and reduces waste.

An array printed circuit board, a printed circuit board, and a method of manufacturing the same are provided. The array printed circuit board includes a plurality of substrate regions in which a plurality of printed circuit boards are respectively disposed, and a peripheral region connected to the plurality of substrate regions. At least one substrate region of the plurality of substrate regions includes a separation hole. The at least one substrate region and the peripheral region include a wiring, and the wiring includes one or more wiring layers. The wiring includes an outer side wiring including a first portion between an edge of the at least one substrate region and a first side of the separation hole adjacent to the edge of the at least one substrate region.