Industrial circuit board intelligent repairing method and system based on lossless damping chip

Abstract

The invention provides an industrial circuit board intelligent repairing method and system based on a lossless damping chip, and the method comprises the steps: obtaining multi-dimensional acoustic response data in an industrial circuit board, carrying out the spatial analysis of a phase offset in the data, and generating a three-dimensional geometric boundary coordinate set of a microcrack region; activating a resonant wave stabilization processing mode of the lossless damping chip, and generating a mechanical resonant frequency and a dynamic constraint force field for inhibiting crack propagation; generating a target filling scheme according to the stress distribution state of the dynamic constraint force field; constructing a conductive filling path topological structure, and generating a continuous conductive interface; according to the resonance response characteristic between the continuous conductive interface and the mechanical resonance frequency, a micron-sized crack repairing scheme is generated, and intelligent repairing of the industrial circuit board is carried out. The method breaks through the problem of fuzzy positioning of the crack spatial form in the traditional detection technology; the accurate permeation of the filling material along the crack is ensured; verification and closed loop feedback of the repairing effect are achieved, and the stability and reliability of the repaired industrial circuit board are remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of industrial circuit board repair, and in particular to an industrial circuit board intelligent repair method and system based on a lossless damping chip. Background Art

[0002] With the widespread use of industrial multi-layer circuit boards in complex operating conditions such as high density, high frequency, and high temperature, the generation of internal microcracks has become a key factor affecting the stability and service life of the equipment. However, because microcracks are often located within the multi-layer structure and are very small, traditional external detection methods cannot accurately locate and effectively repair them. Therefore, a technical solution is urgently needed that can achieve 3D modeling of microcrack areas and implement intelligent intervention without destroying the overall structure.

[0003] The current mainstream approach is a repair method based on a combination of laser ultrasonic imaging and local thermal stress compensation. High-precision lasers are used to generate ultrasonic waves within the material, thereby constructing a rough image of the distribution of microcracks. A micro-heating module is then used to apply controllable thermal stress to the surface of the detected cracked area to inhibit crack propagation, supplemented by the localized application of conductive adhesive to restore the electrical path. Existing approaches have several drawbacks, including the scattering and mode conversion of ultrasonic signals when propagating through multilayered media, making it difficult to accurately characterize the three-dimensional boundary features of micron-scale cracks; the lack of spatial directionality in local thermal stress control, which degrades the material properties of adjacent areas; and the reliance on manual experience to set the path for the conductive adhesive filling process, resulting in difficulties in meeting the conductivity and mechanical stability requirements of the repaired material for long-term operation. Summary of the Invention

[0004] The present invention provides an intelligent repair method and system for industrial circuit boards based on a lossless damping chip, which is used to solve problems in the prior art, including the scattering and mode conversion that occur easily when ultrasonic signals propagate in multi-layer media, making it difficult to accurately characterize the three-dimensional boundary characteristics of micron-level cracks; the lack of spatial directionality in local thermal stress control, resulting in deterioration of material properties in adjacent areas; and the reliance on manual experience to set the path during the filling process of conductive glue, resulting in the conductivity and mechanical stability after repair being difficult to meet long-term operation requirements.

[0005] In a first aspect, the present invention provides an intelligent repair method for an industrial circuit board based on a lossless damping chip, comprising:

[0006] Acquiring multi-dimensional acoustic response data from within the industrial circuit board, and spatially resolving phase offsets in the multi-dimensional acoustic response data to generate a three-dimensional geometric boundary coordinate set of microcrack regions within the industrial circuit board, the three-dimensional geometric boundary coordinate set including depth distribution characteristics and spatial extension vectors of the microcrack regions;

[0007] Based on the depth distribution characteristics, activate the resonance wave stabilization processing mode of the lossless damping chip, generate a mechanical resonance frequency that matches the depth of the microcrack region, and generate a dynamic constraint force field that inhibits crack propagation on the surface of the microcrack region according to the mechanical resonance frequency;

[0008] According to the stress distribution state of the dynamic constraint force field, adjust the flow direction of the conductive filling material to generate a target filling scheme including path planning parameters, and the target filling scheme defines the directional filling of the conductive filling material along the adaptive penetration path within the three-dimensional geometric boundary coordinate set;

[0009] During the directional filling process, construct a conductive filling path topological structure that matches the spatial extension vector within the microcrack region, and jointly generate a continuous conductive interface covering the three-dimensional geometric boundary coordinate set according to the conductive filling path topological structure and the lossless damping chip;

[0010] According to the resonance response characteristics between the continuous conductive interface and the mechanical resonance frequency, generate a microcrack repair scheme for intelligent repair of industrial circuit boards.

[0011] Optionally, obtain multi-dimensional acoustic response data inside the industrial circuit board, perform spatial analysis on the phase offset in the multi-dimensional acoustic response data to generate a three-dimensional geometric boundary coordinate set of the microcrack region of the industrial circuit board, and the three-dimensional geometric boundary coordinate set includes the depth distribution characteristics and spatial extension vector of the microcrack region, including:

[0012] Apply multi-directional ultrasonic excitation signals to the industrial circuit board, collect acoustic wave reflection signals under different propagation paths, and form multi-dimensional acoustic response data including the time dimension and direction dimension;

[0013] Decompose the propagation direction of the multi-dimensional acoustic response data, and extract the set of phase offsets in each propagation direction;

[0014] Based on the set of phase offsets and a preset ultrasonic propagation rate mapping model, establish the correlation between the phase offset and the change in medium thickness, where the change in medium thickness characterizes the depth distribution characteristics of the microcrack region of the industrial circuit board;

[0015] Perform directional fitting on the boundary of the microcrack region according to the correlation, and calculate the extension vector of the microcrack region in the physical structure space of the industrial circuit board;

[0016] Integrate the depth distribution characteristics and the extension vector to generate a three-dimensional geometric boundary coordinate set including the complete morphological parameters of the microcrack region.

[0017] Optionally, based on the depth distribution feature, activate the resonance wave stabilization processing mode of the lossless damping chip, generate a mechanical resonance frequency matching the depth of the microcrack region, and generate a dynamic binding force field for suppressing crack propagation on the surface of the microcrack region, including:

[0018] Determine the base frequency value of the mechanical resonance frequency according to the maximum depth value in the depth distribution feature and the material resonance characteristics of the substrate of the industrial circuit board;

[0019] Based on different depth levels in the depth distribution feature, expand the base frequency value according to a preset depth-frequency gradient rule to generate a stepped mechanical resonance frequency sequence covering the depth of the microcrack region;

[0020] Synchronously output the stepped mechanical resonance frequency sequence through the piezoelectric laminate structure of the lossless damping chip, so that the mechanical vibration waves corresponding to the stepped mechanical resonance frequency sequence are superimposed and interfered in the depth direction of the microcrack region, and generate superimposed interference process data;

[0021] Construct a hierarchical binding force intensity gradient on the surface of the microcrack region according to the vibration energy distribution in the superimposed interference process data;

[0022] Limit and adjust the vibration wave amplitudes of each layer in the hierarchical binding force intensity gradient to generate a dynamic binding force field for suppressing crack propagation.

[0023] Optionally, synchronously output the stepped mechanical resonance frequency sequence through the piezoelectric laminate structure of the lossless damping chip, so that the mechanical vibration waves corresponding to the stepped mechanical resonance frequency sequence are superimposed and interfered in the depth direction of the microcrack region, and generate superimposed interference process data, including:

[0024] Allocate the stepped mechanical resonance frequency sequence to each piezoelectric unit corresponding to the piezoelectric laminate structure of the lossless damping chip according to the depth level, wherein each piezoelectric unit obtains a frequency allocation parameter matching the corresponding depth level;

[0025] Apply a driving voltage matching the frequency allocation parameter to each piezoelectric unit, generate a mechanical vibration wave matching the frequency allocation parameter, and increase the amplitude value of the mechanical vibration wave in proportion to the increasing frequency of the stepped mechanical resonance frequency sequence to generate a gradient amplitude vibration wave;

[0026] Control the emission phase of the gradient amplitude vibration wave so that the vibration wave phase of the surface piezoelectric unit lags behind that of the deep piezoelectric unit by a quarter of a cycle to generate a vibration wave emission sequence with a phase lag;

[0027] Record the vibration waveform superposition state of the vibration wave emission sequence with phase lag in the depth direction of the microcrack region, and generate an interference peak distribution map;

[0028] Extract the interference region coordinates in the interference peak distribution map whose amplitude intensity exceeds the preset substrate yield strength threshold, and mark the interference region coordinates as the effective binding force action area;

[0029] Generate superimposed interference process data according to the distribution density and position parameters of the effective binding force action area.

[0030] Optionally, according to the stress distribution state of the dynamic binding force field, adjust the flow direction of the conductive filler material to generate a target filling scheme including path planning parameters, and the target filling scheme defines the directional filling of the conductive filler material along the adaptive penetration path within the three-dimensional geometric boundary coordinate set, including:

[0031] Perform directional decomposition on the stress distribution state of the dynamic binding force field to obtain the set of principal stress direction angles of each position point on the surface of the microcrack region;

[0032] Calculate the direction matching degree between the set of principal stress direction angles and the spatial extension vector of the three-dimensional geometric boundary coordinate set to generate the set of flow direction correction parameters for each position point, where the set of flow direction correction parameters includes the candidate filling direction of each parameter and the included angle value between each parameter and the spatial extension vector;

[0033] Screen the effective filling paths according to the set of flow direction correction parameters to generate a set of effective filling paths;

[0034] Generate a target filling scheme including path planning parameters according to the spatial distribution density and direction continuity of the set of effective filling paths, and the target filling scheme consists of a main channel priority coefficient, a branch path filling order parameter, and an adaptive penetration path;

[0035] Adjust the injection pressure gradient of the conductive filler material according to the main channel priority coefficient, and at the same time control the stage change of the flow rate according to the branch path filling order parameter to perform directional filling along the adaptive penetration path.

[0036] Optionally, during the directional filling process, construct a conductive filler path topology structure in the microcrack region that matches the spatial extension vector, and jointly generate a continuous conductive interface covering the three-dimensional geometric boundary coordinate set with the non-destructive damping chip, including:

[0037] During the process of the directional filling, the flow path of the conductive filling material is calibrated with the spatial extension vector to have the same direction angle, so as to generate an initial filling path topology defined by the main path vector in the spatial extension vector;

[0038] A local electric field is applied to the node region of the initial filling path topology, and the dendritic growth direction of the conductive filling material in the node region is controlled to generate a branch path expansion structure that matches the branch vector in the spatial extension vector;

[0039] Based on the fusion state of the branch path expansion structure and the main path vector, conductive filling path topology verification data is generated;

[0040] According to the piezoelectric effect of the non-destructive damping chip, periodic micro-vibrations are performed in the interface region of the conductive filling path topology, so that the microscopic pores at the interface between the conductive filling material and the substrate are closed, and microscopic pore closing degree data is generated;

[0041] The resistance difference parameter in the conductive filling path topology verification data is compared and analyzed with the pore closing rate parameter in the microscopic pore closing degree data. When the resistance difference parameter is less than or equal to a first preset threshold and the pore closing rate parameter is greater than or equal to a second preset threshold, a continuous conductive interface covering the three-dimensional geometric boundary coordinate set is generated.

[0042] Optionally, according to the resonance response characteristics between the continuous conductive interface and the mechanical resonance frequency, a micron-level crack repair scheme is generated for intelligent repair of industrial circuit boards, including:

[0043] A test vibration wave with the same frequency as the mechanical resonance frequency is applied to the continuous conductive interface, and the resonance response characteristics of the continuous conductive interface are detected to generate interface dynamic response data including a resonance frequency offset and a resonance amplitude attenuation value;

[0044] The resonance frequency offset and the resonance amplitude attenuation value related to the mechanical resonance frequency are extracted from the interface dynamic response data;

[0045] The resonance frequency offset and the resonance amplitude attenuation value are compared with a preset interface integrity criterion. When the resonance frequency offset and the resonance amplitude attenuation value simultaneously meet the preset interface integrity criterion, a micron-level crack repair scheme is generated for intelligent repair of industrial circuit boards.

[0046] In a second aspect, the present invention provides an intelligent repair system for industrial circuit boards based on a non-destructive damping chip, including:

[0047] An analysis module, configured to obtain multi-dimensional acoustic response data inside an industrial circuit board, spatially analyze the phase offset in the multi-dimensional acoustic response data to generate a set of three-dimensional geometric boundary coordinates of the micro-crack region of the industrial circuit board, where the set of three-dimensional geometric boundary coordinates includes the depth distribution characteristics and spatial extension vectors of the micro-crack region;

[0048] An activation module, configured to activate the resonance wave stabilization processing mode of the lossless damping chip based on the depth distribution characteristics, generate a mechanical resonance frequency matching the depth of the micro-crack region, and generate a dynamic constraint force field for suppressing crack propagation on the surface of the micro-crack region according to the mechanical resonance frequency;

[0049] An adjustment module, configured to adjust the flow direction of the conductive filling material according to the stress distribution state of the dynamic constraint force field, generate a target filling scheme including path planning parameters, where the target filling scheme defines that the conductive filling material is directionally filled along the adaptive penetration path within the set of three-dimensional geometric boundary coordinates;

[0050] A construction module, configured to construct a conductive filling path topology structure matching the spatial extension vector in the micro-crack region during the directional filling process, and cooperate with the lossless damping chip according to the conductive filling path topology structure to generate a continuous conductive interface covering the set of three-dimensional geometric boundary coordinates;

[0051] A generation module, configured to generate a micron-level crack repair scheme according to the resonance response characteristics between the continuous conductive interface and the mechanical resonance frequency for intelligent repair of the industrial circuit board. In a third aspect, the present invention provides a computing device, including a processor and a memory, where a computer program is stored in the memory, and the processor is configured to run the computer program to execute any one of the methods for intelligent repair of an industrial circuit board based on a lossless damping chip in the first aspect.

[0052] In a fourth aspect, the present invention provides a computer storage medium, on which computer program instructions are stored, and when the computer program instructions are executed by a processor, the methods for intelligent repair of an industrial circuit board based on a lossless damping chip as described in any one of the first aspect are implemented.

[0053] The present invention realizes the precise repair of microcracks in industrial circuit boards through the collaborative control of multi-dimensional acoustic detection and dynamic constraint force fields. First, a three-dimensional geometric boundary coordinate set is generated based on the spatial analysis of phase offset, breaking through the fuzzy positioning problem of crack spatial morphology by traditional detection techniques and solving the detection blind area of internal cracks in multi-layer circuit boards. Secondly, through the dynamic constraint force field driven by mechanical resonance frequency, the crack propagation is actively inhibited during the filling process to avoid the risk of secondary damage. Subsequently, by combining the adaptive penetration path and the topological structure of the conductive filling path, it is ensured that the filling material penetrates precisely along the true morphology of the crack. Finally, a repair plan is generated based on the resonance response characteristics to realize the dynamic verification and closed-loop feedback of the repair effect, improving the electrical stability and mechanical reliability of the circuit board after repair and meeting the high-precision repair requirements at the industrial level.

[0054] Furthermore, through the multi-directional ultrasonic excitation and propagation path decomposition technology, the detection accuracy and reliability of the three-dimensional morphology of cracks are improved. That is, the time-direction two-dimensional acoustic response data acquisition is adopted, combined with the physical mapping relationship between the phase offset and the ultrasonic propagation rate, to convert the abstract acoustic signal into a quantifiable medium thickness change parameter, breaking through the undetected limitation of inclined cracks and branched cracks by traditional single-path detection. The three-dimensional extension trajectory of the crack in the physical space of the circuit board is reproduced through directional fitting and extension vector calculation, providing a high-precision spatial reference for subsequent repair. This solution is applicable to circuit boards with laminated structures, can identify the depth and direction differences of micron-level microcracks, and lays a key data foundation for the generation of dynamic constraint force fields and the planning of adaptive filling paths, forming a complete technical closed-loop of "detection - control - repair".

[0055] These aspects or other aspects of the present invention will be more clearly understood in the following description of the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0057] Figure 1 It is a flowchart of an intelligent repair method for industrial circuit boards based on a lossless damping chip provided by an embodiment of the present invention;

[0058] Figure 2 It is a schematic structural diagram of an intelligent repair system for industrial circuit boards based on a lossless damping chip provided by an embodiment of the present invention;

[0059] Figure 3 It is a schematic structural diagram of a computing device provided by an embodiment of the present invention. Detailed implementation manners

[0060] In order to enable those skilled in the art of the present technology to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0061] In some processes described in the specification, claims and above-mentioned accompanying drawings of the present invention, a plurality of operations appear in a specific order. However, it should be clearly understood that these operations may not be executed in the order in which they appear herein or may be executed in parallel. The serial numbers of the operations, such as 101, 102, etc., are only used to distinguish different operations, and the serial numbers themselves do not represent any execution order. In addition, these processes may include more or fewer operations, and these operations may be executed in sequence or in parallel. It should be noted that the descriptions such as "first" and "second" in this article are used to distinguish different messages, devices, modules, etc., do not represent the sequence, and do not limit that "first" and "second" are of different types.

[0062] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present invention.

[0063] Figure 1 The flow chart of an intelligent repair method for an industrial circuit board based on a lossless damping chip is provided for the embodiments of the present invention, as Figure 1 shown, the method includes:

[0064] In view of the industry pain points that the internal micro-cracks of industrial multi-layer circuit boards are highly concealed, the traditional repair process has the risk of secondary damage and it is difficult to achieve three-dimensional precise repair, the present invention proposes an intelligent repair solution with cross-physical field collaboration. There are three major limitations in the prior art: First, the ultrasonic detection technology is limited by single-dimensional signal analysis, resulting in a mismatch between the repair range and the actual damage area; Second, the conventional filling process uses static pressure injection, which is prone to material accumulation or insufficient penetration in complex crack branches; Third, the verification of the repair effect relies on destructive sampling or surface electrical testing, and in-situ interface integrity assessment cannot be achieved. This solution establishes a three-dimensional coordinate system of the crack depth extension vector through multi-dimensional acoustic phase space analysis, breaking through the traditional two-dimensional detection blind area; generates a gradient dynamic constraint force field based on the crack depth characteristics to match the mechanical resonance frequency, and realizes the mechanical suppression of crack propagation at the nanoscale amplitude; designs an adaptive penetration path in combination with the stress distribution state and the spatial vector direction, and constructs a conductive topological network that matches the crack morphology through electric field-regulated dendrite growth; finally, forms a full-process repair system by using the collaborative verification mechanism of the resonance response characteristics and the original mechanical frequency. Based on this, the present invention provides an intelligent repair method for industrial circuit boards based on a non-destructive damping chip, such as Figure 1 , including:

[0065] Step 101: Obtain multi-dimensional acoustic response data inside the industrial circuit board, perform spatial analysis on the phase offset in the multi-dimensional acoustic response data to generate a set of three-dimensional geometric boundary coordinates of the micro-crack area of the industrial circuit board, and the set of three-dimensional geometric boundary coordinates includes the depth distribution characteristics and spatial extension vector of the micro-crack area.

[0066] In this step, the multi-dimensional acoustic response data refers to a set of acoustic signals obtained through multi-directional ultrasonic excitation and propagation path decomposition; the spatial analysis operation refers to the process of converting the phase offset into the change of medium thickness through the propagation rate model and fitting the three-dimensional morphology of the crack; the set of three-dimensional geometric boundary coordinates refers to a set of spatial parameters including the three-dimensional coordinate points, depth levels and extension vectors of the crack; the depth distribution characteristics refer to the hierarchical depth data of the crack along the thickness direction of the circuit board, which is generated by mapping the phase offset and the sound speed model; the spatial extension vector refers to the extension direction of the crack in three-dimensional space.

[0067] In an embodiment of the present invention, an ultrasonic excitation signal generator in multiple directions transmits ultrasonic waves with different propagation paths to an industrial circuit board, collects time-series data and direction distribution data of the reflected signals, and forms multi-dimensional acoustic response data including a time dimension and a direction dimension. Secondly, the multi-dimensional acoustic response data is decomposed in the propagation direction to extract a set of phase offset amounts in each direction. Then, based on an ultrasonic wave propagation rate mapping model, the phase offset amounts are converted into medium thickness change values. Subsequently, a directional fitting is performed on the crack boundary to calculate the extension vector of the crack in the three-dimensional physical space of the circuit board. Finally, the depth distribution feature and the extension vector are integrated to generate a set of three-dimensional geometric boundary coordinates.

[0068] Step 102: Based on the depth distribution feature, activate the resonance wave stabilization processing mode of the non-destructive damping chip, generate a mechanical resonance frequency matching the depth of the micro-crack region, and generate a dynamic constraint force field for suppressing crack propagation on the surface of the micro-crack region according to the mechanical resonance frequency.

[0069] In this step, the resonance wave stabilization processing mode refers to a control mode that outputs a stepped mechanical resonance frequency through a piezoelectric stack structure to generate a dynamic constraint force field; the mechanical resonance frequency refers to a sequence of vibration frequencies generated according to an inverse proportional relationship with the crack depth, with a high frequency corresponding to the deep layer and a low frequency corresponding to the surface layer; the dynamic constraint force field refers to a layered force field formed by superimposing vibration waves of different frequencies.

[0070] In an embodiment of the present invention, first, based on the depth distribution feature in the set of three-dimensional geometric boundary coordinates, extract the maximum crack depth value and query the substrate resonance coefficient, and calculate the basic value of the mechanical resonance frequency. Secondly, perform gradient expansion on the basic frequency according to the depth levels to generate a stepped mechanical resonance frequency sequence. Then, activate the piezoelectric stack structure of the non-destructive damping chip, allocate the stepped frequencies to the piezoelectric units corresponding to the levels, and generate mechanical vibration waves matching the frequencies. Finally, through the superimposed interference effect of the vibration waves, form a layered constraint force distribution pattern on the crack surface, adjust the driving voltages of the piezoelectric units in each layer so that the constraint force intensity of the deep layer is 3 to 5 times that of the surface layer, and generate a dynamic constraint force field for suppressing crack propagation.

[0071] Step 103: According to the stress distribution state of the dynamic constraint force field, adjust the flow direction of the conductive filling material to generate a target filling scheme including path planning parameters, and the target filling scheme defines that the conductive filling material performs directional filling along the adaptive penetration path within the set of three-dimensional geometric boundary coordinates.

[0072] In this step, the stress distribution state refers to the principal stress direction and strength distribution data on the crack surface under the action of the dynamic constraint force field; the adjustment operation refers to the action of screening the filling path and generating the injection parameters according to the matching degree between the stress direction and the spatial vector; the path planning parameters refer to the path control rules including the priority of the main path, the branch filling order, and the curvature radius limit; the adaptive penetration path refers to the filling path matching the crack morphology, and the curvature radius is not less than 5 times the branch width; the directional filling operation refers to the precise filling process of controlling the injection pressure and flow rate of the material according to the path planning parameters.

[0073] In the embodiment of the present invention, first, the set of principal stress direction angles at each position point is extracted; second, the direction matching degree between the principal stress direction angle and the spatial extension vector in the three-dimensional geometric boundary coordinate set is calculated, and the candidate filling directions with an included angle less than 30 degrees with the extension vector are screened; then, according to the stress interference coefficient of the candidate filling direction and the crack branch width, an effective filling path set with a curvature radius not less than 5 times the branch width is generated; finally, based on the spatial density and direction continuity of the effective filling path, the path planning parameters including the priority of the main channel and the branch filling order are generated, and accordingly, the injection pressure gradient and the flow rate stage change rule of the conductive filling material along the adaptive penetration path are defined to form the target filling scheme.

[0074] Step 104: During the directional filling process, a conductive filling path topological structure matching the spatial extension vector is constructed within the microcrack region, and a continuous conductive interface covering the three-dimensional geometric boundary coordinate set is jointly generated according to the conductive filling path topological structure and the non-destructive damping chip.

[0075] In this step, the conductive filling path topological structure matching the spatial extension vector refers to a conductive network structure in which the deviation angles between the filling path and the crack main axis and branch directions are less than 15 degrees; the continuous conductive interface refers to a repaired circuit interface with a resistance difference less than or equal to 5% and a pore closure rate greater than or equal to 95%.

[0076] In the embodiment of the present invention, first, the flow path of the conductive filling material is calibrated with the spatial extension vector to have the same direction angle, and an initial filling path topology defined by the main path vector is generated; second, a local electric field of 50 V / mm is applied in the node region of the initial path to control the dendrite growth direction of the conductive filling material at the node so that the deviation angle from the branch vector is less than 15 degrees, and a branch path expansion structure is generated; then, the connection resistance difference between the main path and the branch path is detected by a four-probe resistance tester, and it is required that the difference does not exceed 5%, and at the same time, it is verified that the curvature radius at the connection is not less than 2 times the branch width; finally, a periodic micro-vibration of 30 kHz is generated by the non-destructive damping chip, the amplitude is controlled within 5 μm, and it lasts for 5 seconds to make the interface pore closure rate exceed 95%, generating a continuous conductive interface covering the three-dimensional geometric boundary coordinate set.

[0077] Step 105: Generate a micron-level crack repair plan according to the resonance response characteristics between the continuous conductive interface and the mechanical resonance frequency for intelligent repair of industrial circuit boards.

[0078] In this step, the resonance response characteristics refer to the frequency shift and amplitude attenuation parameters of the interface after repair under the test vibration wave; the micron-level crack repair plan refers to a closed-loop control plan including repair coordinates, performance parameters, and secondary repair instructions.

[0079] In the embodiment of the present invention, first, apply a 20 kHz test vibration wave with the same frequency as the mechanical resonance frequency to the continuous conductive interface, detect the interface vibration amplitude and phase offset through a laser interferometer, and generate interface dynamic response data including resonance frequency shift and amplitude attenuation; secondly, extract the resonance frequency shift amount and amplitude attenuation value from the interface dynamic response data; then input the frequency shift amount and amplitude attenuation value into a preset qualified repair parameter mapping table, requiring the frequency shift not to exceed 3% and the amplitude attenuation not to exceed 15%; finally, when the parameters meet the standards simultaneously, generate a micron-level crack repair plan including the three-dimensional coordinates and performance indicators of the repair area, otherwise trigger a local secondary repair instruction.

[0080] For example, first, emit multi-band excitation signals to a multi-layer circuit board through multi-directional ultrasonic transmitters, collect reflected signals in multiple directions, generate acoustic response data including time and direction dimensions, and detect the phase offset amount of the micro-crack area. Secondly, according to the sound velocity model of the substrate material, convert the phase offset amount into a depth distribution feature, calculate the depth level of the crack, and generate a spatial extension vector. Then activate the piezoelectric laminate structure of the non-destructive damping chip, output a stepped mechanical resonance frequency sequence, and form a layered dynamic binding force field on the crack surface. Next, screen the filling path matching the extension vector according to the stress distribution, adjust the injection pressure and flow rate of the conductive filling material, and adjust the parameters to supplement the branches after the main path filling. Apply a local electric field in the node area, control the growth of dendrites along the branch vector direction, and detect the connection resistance difference and curvature radius of the main branch. Finally, apply a test vibration wave with the same frequency as the mechanical resonance frequency, detect the interface resonance frequency shift and amplitude attenuation, generate a qualified repair plan, and mark the coordinates of the repair area.

[0081] To solve the problem of difficult to accurately identify the three-dimensional boundary of microcracks in industrial circuit boards, this step performs spatial analysis on the phase offset of multi-dimensional acoustic response data to generate a set of three-dimensional geometric boundary coordinates including depth distribution and extension vector. The present invention provides a specific embodiment. In step 101, multi-dimensional acoustic response data inside the industrial circuit board is obtained, and the phase offset in the multi-dimensional acoustic response data is subjected to spatial analysis to generate a set of three-dimensional geometric boundary coordinates of the microcrack region of the industrial circuit board. The set of three-dimensional geometric boundary coordinates includes the depth distribution characteristics and spatial extension vector of the microcrack region, and specifically includes the following steps:

[0082] Step 111: Apply multi-directional ultrasonic excitation signals to the industrial circuit board, collect acoustic wave reflection signals under different propagation paths, and form multi-dimensional acoustic response data including time dimension and direction dimension.

[0083] In this step, the multi-directional ultrasonic excitation signal refers to a set of ultrasonic pulses emitted from multiple azimuth angles, and typical directions include 0°, 45°, 90°, etc.; the acoustic wave reflection signal refers to the time-domain waveform data formed after the ultrasonic wave propagates in different directions inside the circuit board and is reflected by the crack.

[0084] In the embodiment of the present invention, first, a multi-directional excitation signal is applied to the surface of the industrial circuit board through a multi-channel ultrasonic emission device; second, the acoustic wave reflection signals under different propagation paths are collected, and the time-domain waveform data and arrival time difference of each path are recorded to form multi-dimensional acoustic response data; then, environmental noise and reflection interference on the circuit board surface are filtered out, and finally, an acoustic data set including two dimensions of time and direction is generated.

[0085] Step 112: Decompose the propagation direction of the multi-dimensional acoustic response data, and extract the set of phase offsets in each propagation direction.

[0086] In this step, the propagation direction decomposition operation refers to separating the mixed acoustic signal into independent direction components through a beamforming algorithm; the set of phase offsets refers to the data set of the phase delay difference caused by the crack for the ultrasonic wave in each propagation direction, which is generated through Hilbert transform and normalization processing.

[0087] In the embodiment of the present invention, first, the propagation direction of the multi-dimensional acoustic response data is decomposed to separate the mixed signal into sub-data sets in each independent propagation direction; second, the phase information in each sub-data set is extracted through Hilbert transform, and the phase difference between the ultrasonic wave in the crack region and the complete medium region is calculated to form the set of phase offsets in each propagation direction; then, the phase offsets are normalized to eliminate the influence caused by the propagation distance difference, and a normalized phase offset matrix is generated.

[0088] Step 113: Based on the set of phase offsets and a preset ultrasonic propagation rate mapping model, establish the correlation between the phase offset and the change in the thickness of the medium, where the change in the thickness of the medium characterizes the depth distribution characteristics of the microcrack region of the industrial circuit board.

[0089] In this step, the preset ultrasonic propagation rate mapping model refers to a database storing the relationship between the sound speed of the base material, temperature, and thickness, which is used to convert the phase difference into the change in the thickness of the medium; the change in the thickness of the medium refers to the reduction in the thickness of the base material caused by cracks, which is calculated by multiplying the time delay by the sound speed and dividing by 2.

[0090] In the embodiment of the present invention, first, call the preset ultrasonic propagation rate mapping model; second, convert each phase difference in the set of phase offsets into a time delay, where the time delay is equal to the phase difference divided by the ultrasonic angular frequency; then calculate the change value of the medium thickness according to the product of the time delay and the sound speed, where the thickness change value is equal to the time delay multiplied by the sound speed and divided by 2; finally, establish a linear correlation between the phase offset and the change in the medium thickness, and generate a depth distribution feature dataset of the microcrack region.

[0091] Step 114: According to the correlation, perform directional fitting on the boundary of the microcrack region, and calculate the extension vector of the microcrack region in the physical structure space of the industrial circuit board.

[0092] In this step, the directional fitting operation refers to performing direction regression analysis on the crack boundary points using the least squares method to determine the extension trend of the main channel and branches; the extension vector refers to a parameter describing the three-dimensional spatial orientation of the crack, including the azimuth angle of the main channel, the branch angle, and the tilt angle of the Z-axis.

[0093] In the embodiment of the present invention, first, based on the dataset of the change in the medium thickness, perform directional fitting on the crack boundary using the least squares method to calculate the extension direction angle of the crack main channel; second, determine the expansion direction of the crack branches through spatial gradient analysis and extract the included angle data between each branch and the main channel; then integrate the main channel direction angle and the branch angle into a three-dimensional spatial vector; finally, complete the discrete data points through an interpolation algorithm to generate a set of extension vectors describing the complete spatial orientation of the crack.

[0094] Step 115: Integrate the depth distribution characteristics and the extension vector to generate a set of three-dimensional geometric boundary coordinates including the complete morphological parameters of the microcrack region.

[0095] In this step, the complete morphological parameters refer to the three-dimensional digital description of the crack integrating depth, direction, and coordinates, including the layered depth, spatial vector, and topological connection relationship.

[0096] In the embodiment of the present invention, first, the hierarchical depth values in the depth distribution feature dataset are spatially aligned with the direction parameters in the extension vector set; secondly, the three-dimensional coordinate points are clustered according to the depth levels, and the coordinate points within the same depth level share the same extension direction angle; then, the depth values, direction angles, and coordinate points are integrated into a structured data table; finally, a visual geometric boundary coordinate set is generated.

[0097] To improve the depth matching of the microcrack constraint force field, this step generates a stepped mechanical resonance frequency sequence based on the depth distribution feature and constructs a dynamic constraint force field for suppressing crack propagation through superposition interference. The present invention provides a specific embodiment. Step 102: Based on the depth distribution feature, activate the resonance wave stabilization processing mode of the non-destructive damping chip, generate a mechanical resonance frequency that matches the depth of the microcrack region, and generate a dynamic constraint force field for suppressing crack propagation on the surface of the microcrack region according to the mechanical resonance frequency. The specific steps are as follows:

[0098] Step 121: Determine the base frequency value of the mechanical resonance frequency according to the maximum depth value in the depth distribution feature and the material resonance characteristics of the substrate of the industrial circuit board.

[0099] In this step, the material resonance characteristic refers to the functional relationship between the natural frequency of the substrate and its thickness and temperature, which is stored in the database for frequency calculation; the base frequency value refers to the reference frequency calculated inversely proportional to the maximum crack depth and the substrate resonance coefficient. The formula is base frequency = substrate resonance coefficient / maximum depth.

[0100] In the embodiment of the present invention, first, call the material resonance characteristic database of the substrate of the industrial circuit board; secondly, convert the maximum depth value into the base frequency value of the mechanical resonance frequency through the inverse proportional relationship formula; finally, use the calculated base frequency value as the reference for subsequent frequency expansion.

[0101] Step 122: Based on different depth levels in the depth distribution feature, expand the base frequency value according to a preset depth-frequency gradient rule to generate a stepped mechanical resonance frequency sequence covering the depth of the microcrack region.

[0102] In this step, the preset depth-frequency gradient rule refers to a linear or non-linear expansion rule for increasing the frequency according to the crack depth level; the frequency expansion operation refers to the algorithm process of distributing the base frequency to different depth levels according to the gradient rule; the stepped mechanical resonance frequency sequence refers to the frequency set divided according to the depth level.

[0103] In the embodiment of the present invention, first, different depth levels in the depth distribution feature are divided at a preset interval; second, based on a preset depth frequency gradient rule, the basic frequency value is expanded according to a hierarchical increasing ratio; subsequently, a stepped mechanical resonance frequency sequence is generated, and increasing frequency values are assigned to different depth levels to ensure that the frequency covers the entire depth region of the crack.

[0104] Step 123: Synchronously output the stepped mechanical resonance frequency sequence through the piezoelectric stack structure of the non-destructive damping chip, so that the mechanical vibration waves corresponding to the stepped mechanical resonance frequency sequence are superimposed and interfered in the depth direction of the microcrack region, and generate superimposed interference process data.

[0105] In this step, the piezoelectric stack structure refers to an actuator composed of multiple layers of piezoelectric ceramic sheets, and each layer corresponds to a specific depth level; the mechanical vibration wave refers to the vibration wave generated by each piezoelectric layer according to the assigned frequency; the superimposed interference operation refers to the energy superposition and phase interference process of vibration waves with different frequencies in the crack depth direction; the superimposed interference process data refers to a detection data set including the energy peak value, phase difference and interference mode at each depth point.

[0106] In the embodiment of the present invention, first, the stepped mechanical resonance frequency sequence is assigned to the corresponding piezoelectric unit group; second, all piezoelectric units are synchronously driven to generate mechanical vibration waves; subsequently, the superimposed interference process of the vibration waves is recorded in the depth direction of the microcrack region, the vibration energy peak value and phase difference at each depth point are collected, and the superimposed interference process data including the energy distribution and interference mode is generated.

[0107] Step 124: Construct a hierarchical binding force intensity gradient on the surface of the microcrack region according to the vibration energy distribution in the superimposed interference process data.

[0108] In this step, the vibration energy distribution refers to the intensity distribution of the vibration wave energy along the crack depth direction; the hierarchical binding force intensity gradient refers to the binding force intensity parameters distributed according to the depth level.

[0109] In the embodiment of the present invention, first, the vibration energy distribution is extracted from the superimposed interference process data, and the energy peak position is mapped to the crack depth level; second, according to the linear relationship between the energy peak value and the binding force intensity, a hierarchical binding force intensity gradient is set, and the deep binding force intensity is the energy peak value multiplied by the conversion coefficient; finally, each layer of binding force intensity gradient is solidified through the voltage adjustment module of the piezoelectric stack structure.

[0110] Step 125: Limit and adjust the vibration wave amplitude of each layer in the hierarchical binding force intensity gradient to generate a dynamic binding force field that inhibits crack propagation.

[0111] In this step, the vibration wave amplitude refers to the mechanical vibration amplitude output by the piezoelectric layer, which is positively correlated with the frequency and the driving voltage; the limiting adjustment operation refers to the action of dynamically adjusting the amplitude according to the substrate strength threshold.

[0112] In the embodiment of the present invention, first, the vibration wave amplitudes of each layer in the delamination binding force strength gradient are detected; second, an amplitude limit rule is set according to the preset substrate yield strength threshold, requiring that the surface layer amplitude does not exceed 50% of the amplitude corresponding to the substrate yield strength; subsequently, by reducing the driving voltage of the surface piezoelectric unit, while maintaining the amplitude of the deep layer unchanged, its amplitude is adjusted to finally generate a dynamic binding force field that inhibits crack propagation.

[0113] To solve the problem of insufficient superposition interference of vibration waves in the depth direction of microcracks, this step generates interference process data for the effective binding force action area through phase lag control and gradient amplitude adjustment of the piezoelectric stack structure. The present invention provides a specific embodiment, step 303, which synchronously outputs the stepped mechanical resonance frequency sequence through the piezoelectric stack structure of the non-destructive damping chip, so that the mechanical vibration waves corresponding to the stepped mechanical resonance frequency sequence are superimposed and interfered in the depth direction of the microcrack area, and generates superposition interference process data, specifically including the following steps:

[0114] Step 331: Allocate the stepped mechanical resonance frequency sequence to each piezoelectric unit corresponding to the piezoelectric stack structure of the non-destructive damping chip according to the depth level, wherein each piezoelectric unit obtains a frequency allocation parameter matching the corresponding depth level.

[0115] In this step, the frequency allocation parameter refers to the specific frequency value allocated to each unit in the piezoelectric stack structure, which is strictly corresponding to the crack depth level.

[0116] In the embodiment of the present invention, first, according to the depth level division of the stepped mechanical resonance frequency sequence, the frequency parameters are correspondingly allocated to each piezoelectric unit in the piezoelectric stack structure according to the physical position; second, the frequency allocation parameters of each piezoelectric unit are written into the drive control module through a frequency encoder to ensure that the parameters are strictly matched with the level.

[0117] Step 332: Apply a driving voltage matching the frequency allocation parameter to each piezoelectric unit, generate a mechanical vibration wave matching the frequency allocation parameter, and increase the amplitude value of the mechanical vibration wave in a preset ratio as the frequency of the stepped mechanical resonance frequency sequence increases, so as to generate a gradient amplitude vibration wave.

[0118] In this step, the driving voltage refers to the voltage value determined according to the frequency-voltage mapping relationship; the mechanical vibration wave refers to the vibration wave output by the piezoelectric unit, whose frequency is consistent with the allocation parameter, and the amplitude increases according to a preset rule; the increasing operation refers to the control process in which the amplitude of the vibration wave increases according to the square relationship as the frequency increases; the gradient amplitude vibration wave refers to a sequence of vibration waves whose amplitude increases in depth levels, and the amplitude of the deep layer is significantly higher than that of the surface layer.

[0119] In an embodiment of the present invention, first, the driving voltage values of each piezoelectric unit are determined; secondly, matching voltages are applied to each piezoelectric unit to generate mechanical vibration waves corresponding to the frequency parameters, and the amplitude of the vibration wave increases according to the square relationship of the frequency; finally, the output is adjusted by the amplitude calibration module to generate a gradient amplitude vibration wave sequence in which the amplitude increases as the frequency increases.

[0120] Step 333: Control the emission phase of the gradient amplitude vibration wave so that the vibration wave phase of the surface piezoelectric unit lags behind that of the deep piezoelectric unit by a quarter of a cycle to generate a vibration wave emission sequence with a phase lag.

[0121] In this step, the emission phase refers to the starting time of the vibration wave emission, and the interference regulation of different-level waveforms is realized through lag control; the vibration wave emission sequence with a phase lag refers to the control strategy in which the emission time of the surface vibration wave is delayed by a quarter of a cycle compared with that of the deep layer, and is used to optimize the interference effect.

[0122] In an embodiment of the present invention, first, the vibration periods of each piezoelectric unit are calculated; secondly, the vibration wave emission time of the surface piezoelectric unit is controlled to lag behind that of the deep unit by 10 microseconds to form a vibration wave emission sequence with a phase lag; subsequently, the waveform phase difference is monitored to ensure that the lag error is less than 1 microsecond to generate a vibration wave emission sequence with a precisely controllable phase.

[0123] Step 334: Record the superposition state of the vibration waveforms of the vibration wave emission sequence with a phase lag in the depth direction of the microcrack region to generate an interference wave peak distribution map.

[0124] In this step, the vibration waveform superposition state refers to the composite waveform after the superposition of vibration waves with different frequencies in space, including constructive and destructive interference regions; the interference wave peak distribution map records a two-dimensional or three-dimensional map of the synthetic amplitude intensity at each spatial point, and is used to identify high-energy regions.

[0125] In an embodiment of the present invention, first, samples are taken at 1-micron intervals along the depth direction of the microcrack region by a laser Doppler vibrometer to record the vibration waveform data at each point; secondly, the vibration waveforms of different piezoelectric units are superimposed along the time axis to detect the interference positions of the wave peaks and wave valleys; subsequently, the amplitude intensity at each depth point is extracted through Fourier transform to generate an interference wave peak distribution map including the wave peak positions and the amplitude intensity.

[0126] Step 335: Extract the interference region coordinates in the interference peak distribution diagram where the amplitude intensity exceeds the preset substrate yield strength threshold, and mark the interference region coordinates as the effective binding force action area.

[0127] In this step, the preset substrate yield strength threshold refers to the critical stress value at which the material undergoes plastic deformation; the interference region coordinates refer to the set of spatial position points where the amplitude intensity exceeds the yield strength; the effective binding force action area refers to the high-energy interference region screened by the threshold.

[0128] First, read the amplitude intensity values of each coordinate point from the interference peak distribution diagram to detect the amplitude intensity in a specific depth region; second, query the preset substrate yield strength threshold and mark all coordinate points with amplitude intensity exceeding the threshold as the effective binding force action area; finally, generate an effective action area data set containing the coordinate set and intensity values.

[0129] Step 336: Generate superimposed interference process data based on the distribution density and position parameters of the effective binding force action area.

[0130] In this step, the operation of generating superimposed interference process data refers to the process of integrating distribution density, coordinate position, and intensity parameters to form structured data; the superimposed interference process data refers to a data set containing the density, position, and intensity of the effective action area, which is used for iterative optimization of the dynamic binding force field.

[0131] In the embodiment of the present invention, first, count the spatial distribution density of the effective binding force action area, and the number of action areas per unit volume is 25 per cubic millimeter; second, extract the position parameters including the depth level and direction angle deviation in the action area coordinates; finally, integrate the distribution density and position parameters into a structured data table to generate superimposed interference process data for optimizing the binding force field.

[0132] To solve the problem of insufficient flow direction adaptability of the conductive filling material in the microcracks, this step generates a target filling scheme with an adaptive penetration path through the calculation of the direction matching degree between the stress distribution and the spatial vector. The present invention provides a specific embodiment, step 103, adjust the flow direction of the conductive filling material according to the stress distribution state of the dynamic binding force field, and generate a target filling scheme including path planning parameters. The target filling scheme defines that the conductive filling material is directionally filled along the adaptive penetration path within the three-dimensional geometric boundary coordinate set, and specifically includes the following steps:

[0133] Step 301: Perform directional decomposition on the stress distribution state of the dynamic binding force field to obtain the set of principal stress direction angles of each position point on the surface of the microcrack region.

[0134] In this step, the directional decomposition operation refers to the process of decomposing the stress tensor into the direction of the maximum principal stress, which is used to extract the dominant stress direction of each point; the set of principal stress direction angles refers to the data set of the direction angles of the maximum principal stress of each point on the surface of the microcrack region, which is used to guide the filling path planning.

[0135] In the embodiment of the present invention, first, the stress distribution state of the dynamic constraint force field is directionally decomposed to extract the maximum principal stress direction angles of each position point on the surface of the microcrack region, forming a set of principal stress direction angles; second, the stress direction of each point is converted into an angle value from 0° to 360°; then, noise interference is eliminated to generate a standardized data set containing the principal stress direction angles of each point as the input for subsequent direction matching.

[0136] Step 302: Calculate the direction matching degree between the set of principal stress direction angles and the spatial extension vector of the three-dimensional geometric boundary coordinate set to generate a set of flow direction correction parameters for each position point, where the set of flow direction correction parameters includes the candidate filling direction of each parameter and the included angle value between each parameter and the spatial extension vector.

[0137] In this step, the direction matching degree calculation operation refers to the process of calculating the included angle between the principal stress direction and the spatial extension vector direction, and screening the candidate directions with an included angle less than the threshold; the set of flow direction correction parameters refers to the parameter list including the candidate filling direction and the included angle between it and the spatial vector.

[0138] In the embodiment of the present invention, first, the difference is calculated between each angle value in the set of principal stress direction angles and the spatial extension vector direction angle in the three-dimensional geometric boundary coordinate set; second, the direction matching degree threshold is set to 30 degrees, and the candidate filling directions with a difference less than the threshold are screened to generate a set of flow direction correction parameters; then, the candidate filling direction and the included angle between it and the spatial vector are recorded for each parameter to form a parameter list for path screening.

[0139] Step 303: Screen the effective filling paths according to the set of flow direction correction parameters to generate a set of effective filling paths.

[0140] In this step, the screening operation refers to the multi-condition path filtering process based on the included angle, stress interference coefficient, and curvature radius; the effective filling path refers to the qualified path that simultaneously satisfies that the included angle is less than or equal to 30 degrees, the stress interference coefficient is less than or equal to 0.8, and the curvature radius is greater than or equal to 5 times the branch width.

[0141] In the embodiment of the present invention, first, the included angle value in the set of flow direction correction parameters is corrected, and the candidate directions with an included angle exceeding 30 degrees are excluded; secondly, the stress interference coefficient of the remaining candidate directions is calculated, which is defined as the ratio of the stress intensity in this direction to the average stress of the region, and the paths with a screening coefficient lower than 0.8 are selected; subsequently, it is verified whether the path curvature radius meets the condition of not less than 5 times the crack branch width, that is, if the branch width is 0.1 mm, the curvature radius needs to be greater than or equal to 0.5 mm, so as to generate a set of effective filling paths.

[0142] Step 304: Generate a target filling scheme including path planning parameters according to the spatial distribution density and direction continuity of the set of effective filling paths. The target filling scheme consists of a main channel priority coefficient, a branch path filling order parameter, and an adaptive penetration path.

[0143] In this step, the spatial distribution density refers to the number of effective filling paths in a unit area; the direction continuity refers to the coherence requirement that the direction angle deviation between adjacent filling paths is less than or equal to 15 degrees; the main channel priority coefficient refers to the filling priority weight of the main crack channel; the branch path filling order parameter refers to the filling execution order rule arranged in descending order according to the branch width or length.

[0144] In the embodiment of the present invention, first, the spatial distribution density of the set of effective filling paths is counted; secondly, the direction continuity of the paths is analyzed, and it is calculated whether the direction angle deviation between adjacent paths is less than 15 degrees, and the continuous path groups are selected; subsequently, a priority coefficient 1 is assigned to the main crack channel, and the branch paths are assigned priorities 2 to N in descending order according to the width; finally, the density, continuity, and priority parameters are integrated to generate a target filling scheme including the main channel priority coefficient, the branch filling order, and the adaptive penetration path rule.

[0145] Step 305: Adjust the injection pressure gradient of the conductive filling material according to the main channel priority coefficient, and at the same time control the stage change of the flow rate according to the branch path filling order parameter, so as to perform directional filling along the adaptive penetration path.

[0146] In this step, the injection pressure gradient refers to the filling pressure difference corresponding to paths with different priorities; the adjustment operation refers to the control action of dynamically adjusting the pressure and flow rate according to the real-time monitoring data; the stage change of the flow rate refers to reducing the flow rate in stages according to the filling order; the directional filling operation refers to the precise execution process of controlling the injection direction and speed of the material according to the planned path.

[0147] In the embodiments of the present invention, first, the injection pressure gradients of different regions are set according to the main channel priority coefficient, so that the main channel obtains a higher pressure level and the pressure values of the branch paths are set in decreasing order of priority. Secondly, the flow rate is controlled in stages according to the filling order parameter of the branch paths. The main channel adopts a higher flow rate level and the flow rate levels of the branch paths decrease in turn. Subsequently, a directional filling operation is performed along the adaptive penetration path, and the penetration depth of the filling material and the path matching degree are monitored in real time. When the detected path deviation exceeds the preset threshold, a dynamic pressure adjustment mechanism is triggered to ensure the spatial matching accuracy between the filling path and the three-dimensional morphology of the crack.

[0148] In order to improve the coordination between the conductive interface and the geometric boundary of the microcrack, in this step, a continuous conductive path topology structure linked to the non-destructive damping chip is constructed through spatial vector calibration and dendrite growth control. The present invention provides a specific embodiment. Step 104, during the directional filling process, a conductive filling path topology structure matching the spatial extension vector is constructed within the microcrack region, and a continuous conductive interface covering the three-dimensional geometric boundary coordinate set is jointly generated according to the conductive filling path topology structure and the non-destructive damping chip, which specifically includes the following steps:

[0149] Step 401: During the directional filling process, calibrate the flow path of the conductive filling material with the main path vector direction angle in the spatial extension vector to generate an initial filling path topology defined by the main path vector in the spatial extension vector.

[0150] In this step, the calibration operation refers to a closed-loop control process of adjusting the flow direction of the filling material to be consistent with the direction angle of the spatial extension vector through sensor feedback and path control algorithm; the direction angle being consistent refers to a strict matching state where the angle deviation between the filling path direction and the spatial vector direction is less than or equal to 2 degrees; the main path vector refers to the crack main channel extension direction parameter defined in the three-dimensional geometric boundary coordinate set; the initial filling path topology refers to the digital model of the filling path generated after calibration.

[0151] In the embodiments of the present invention, first, calibrate the flow path of the conductive filling material with the direction angle of the main path vector in the spatial extension vector to ensure that the deviation between the filling path and the crack main axis direction is less than 2 degrees; secondly, adjust the moving trajectory of the injection nozzle in real time to make it strictly extend along the spatial coordinates of the main path vector; subsequently, record the morphology of the calibrated flow path to generate an initial filling path topology including the main path coordinate points and direction parameters, which serves as the basis for subsequent branch expansion.

[0152] Step 402: Apply a local electric field to the node region of the initial filling path topology and control the dendrite growth direction of the conductive filling material in the node region to generate a branch path extension structure matching the branch vector in the spatial extension vector.

[0153] In this step, the local electric field refers to the electric field generated in a specific area through microelectrodes, with an intensity of 50 volts per millimeter; the dendrite growth direction refers to the tree-like extension path formed by the conductive material under the action of the electric field, and the direction deviates from the branch vector by less than 5 degrees; the branch path expansion structure refers to the expansion structure where the dendrite path is consistent with the crack branch direction and the length does not exceed 3 times the branch width.

[0154] In an embodiment of the present invention, first, a microelectrode array is arranged in the branch node area of the initial filling path topology, and a local electric field of 50 volts per millimeter is applied; second, the migration direction of metal ions in the conductive filling material is controlled to make the dendrites grow along the branch vector direction in the spatial extension vector, with a deviation angle less than 5 degrees; then, it is monitored that the dendrite length does not exceed 3 times the branch width, and a branch path expansion structure matching the branch vector is generated.

[0155] Step 403: Generate conductive filling path topology verification data based on the fusion state of the branch path expansion structure and the main path vector.

[0156] In this step, the fusion state refers to the physical bonding state where the resistance difference at the connection between the main path and the branch path is less than or equal to 5% and the curvature radius is greater than or equal to 2 times the branch width; the conductive filling path topology verification data refers to the quality inspection data set including the resistance difference, the curvature radius, and the connection score.

[0157] In an embodiment of the present invention, first, the resistance difference at the connection between the main path and the branch path is detected, and it is required that the difference does not exceed 5%; second, the curvature radius at the connection is measured by using microscopic imaging technology to ensure that it is not less than 2 times the branch width; then, the resistance difference and the curvature radius data are integrated to generate conductive filling path topology verification data including the connection quality score, and a repair instruction is triggered when the score is lower than the threshold.

[0158] Step 404: According to the piezoelectric effect of the non-destructive damping chip, perform periodic micro-vibrations in the interface area of the conductive filling path topology, so that the microscopic pores at the interface between the conductive filling material and the substrate are closed, and microscopic pore closure degree data is generated.

[0159] In this step, the piezoelectric effect refers to the physical mechanism of generating mechanical vibrations by using the inverse effect of piezoelectric materials; the periodic micro-vibration operation refers to the process of applying vibration waves at a fixed frequency and amplitude to close the interface pores through alternating stress; the microscopic pore closure degree data refers to the quantization parameter of the proportion of the pore closure area, which is calculated through microscopic image analysis.

[0160] In an embodiment of the present invention, first, the piezoelectric effect module of the lossless damping chip is activated to output a periodic micro-vibration with a frequency of 30 kHz and an amplitude of 5 μm. Secondly, through vibration transmission, the microscopic pores at the interface between the conductive filling material and the substrate are closed under the action of alternating stress, and a scanning electron microscope is used to monitor the change of the porosity in real time. Finally, the ratio of the closed pore area to the total pore area is calculated to generate a pore closure rate parameter, which drops from the initial 25% to 3%, and the vibration stops after reaching the standard.

[0161] Step 405: Compare and analyze the resistance difference parameter in the conductive filling path topology verification data and the pore closure rate parameter in the microscopic pore closure degree data. When the resistance difference parameter is less than or equal to a first preset threshold and the pore closure rate parameter is greater than or equal to a second preset threshold, a continuous conductive interface covering the three-dimensional geometric boundary coordinate set is generated.

[0162] In this step, the resistance difference parameter refers to the relative resistance difference between the main path and the branch path; the pore closure rate parameter refers to the ratio of the closed pore area to the total pore area, and it is required to be greater than or equal to 95% to meet the standard.

[0163] In an embodiment of the present invention, first, the main branch resistance difference parameter is extracted from the conductive filling path topology verification data; secondly, the pore closure rate parameter is read from the microscopic pore closure degree data; then, the two parameters are compared with the preset standard. When the resistance difference is less than or equal to 5% and the pore closure rate is greater than or equal to 95%, it is determined to be qualified, a continuous conductive interface covering the three-dimensional geometric boundary coordinate set is generated, and a repair report is output.

[0164] To solve the problem that it is difficult to verify the integrity of the conductive interface after repair, this step analyzes the interface dynamic data through resonance response characteristics to generate a micron-level crack repair scheme that meets the integrity criterion. The present invention provides a specific embodiment, step 105, generating a micron-level crack repair scheme according to the resonance response characteristics between the continuous conductive interface and the mechanical resonance frequency for intelligent repair of industrial circuit boards, which specifically includes the following steps:

[0165] Step 501: Apply a test vibration wave with the same frequency as the mechanical resonance frequency to the continuous conductive interface, and detect the resonance response characteristics of the continuous conductive interface to generate interface dynamic response data including a resonance frequency offset and a resonance amplitude attenuation value.

[0166] In this step, the test vibration wave refers to a vibration wave with a frequency strictly consistent with the original mechanical resonance frequency; the interface dynamic response data refers to a structured data set including the measured resonance frequency offset and amplitude attenuation value.

[0167] In an embodiment of the present invention, first, a test vibration wave exactly the same as the mechanical resonance frequency is applied to the continuous conductive interface; second, the interface vibration response is detected in real time, and the vibration amplitude and phase offset data are collected; subsequently, the amplitude attenuation ratio and the frequency offset are integrated into interface dynamic response data, providing a quantitative basis for subsequent determination.

[0168] Step 502: Extract the resonance frequency offset and resonance amplitude attenuation value related to the mechanical resonance frequency from the interface dynamic response data.

[0169] In this step, the resonance frequency offset refers to the relative deviation ratio of the measured resonance frequency to the original mechanical frequency; the resonance amplitude attenuation value refers to the reduction ratio of the measured amplitude relative to the initial excitation amplitude.

[0170] In an embodiment of the present invention, first, the resonance frequency offset is extracted from the interface dynamic response data. The calculation formula is (the difference between the measured frequency and the mechanical resonance frequency) divided by the mechanical resonance frequency and then multiplied by 100%; second, the resonance amplitude attenuation value is extracted. The calculation formula is (the difference between the initial amplitude and the measured amplitude) divided by the initial amplitude and then multiplied by 100%; subsequently, the two parameters are standardized into percentage form, generating a quantitative index directly related to the mechanical resonance frequency, which is used as the input parameter for interface integrity determination.

[0171] Step 503: Compare the resonance frequency offset and the resonance amplitude attenuation value with a preset interface integrity criterion. When the resonance frequency offset and the resonance amplitude attenuation value simultaneously meet the preset interface integrity criterion, a micron-level crack repair plan is generated for intelligent repair of industrial circuit boards.

[0172] In this step, the preset interface integrity criterion refers to a pre-set repair qualification standard, requiring the frequency offset to be less than or equal to 3% and the amplitude attenuation to be less than or equal to 15%, ensuring the mechanical stability and conductivity of the interface meet the standards.

[0173] In an embodiment of the present invention, first, a preset interface integrity criterion database is called. The criterion requires that the resonance frequency offset does not exceed 3% and the resonance amplitude attenuation value does not exceed 15%; second, the extracted 1.5% frequency offset and 15% amplitude attenuation value are input into the criterion comparison module to detect whether both meet the threshold conditions; subsequently, when the parameters meet the standards, a micron-level crack repair plan including the three-dimensional coordinates of the repair area, the frequency offset, and the amplitude attenuation value is generated and marked as "qualified"; if any parameter exceeds the standard, a repair instruction including the rework coordinates and the exceeded parameter is generated to trigger the local secondary repair process.

[0174] Figure 2 The structure diagram of an intelligent repair system for industrial circuit boards based on a non-destructive damping chip is provided for an embodiment of the present invention, as Figure 2As shown, the system includes:

[0175] An analysis module 21, configured to obtain multi-dimensional acoustic response data inside an industrial circuit board, spatially analyze the phase offset in the multi-dimensional acoustic response data to generate a set of three-dimensional geometric boundary coordinates of the micro-crack region of the industrial circuit board, where the set of three-dimensional geometric boundary coordinates includes the depth distribution characteristics and spatial extension vectors of the micro-crack region;

[0176] An activation module 22, configured to activate the resonant wave stabilization processing mode of the lossless damping chip based on the depth distribution characteristics, generate a mechanical resonant frequency matching the depth of the micro-crack region, and generate a dynamic binding force field for suppressing crack propagation on the surface of the micro-crack region according to the mechanical resonant frequency;

[0177] An adjustment module 23, configured to adjust the flow direction of the conductive filling material according to the stress distribution state of the dynamic binding force field, generate a target filling scheme including path planning parameters, where the target filling scheme defines the directional filling of the conductive filling material along the adaptive penetration path within the set of three-dimensional geometric boundary coordinates;

[0178] A construction module 24, configured to construct a conductive filling path topological structure matching the spatial extension vector in the micro-crack region during the directional filling process, and jointly generate a continuous conductive interface covering the set of three-dimensional geometric boundary coordinates according to the conductive filling path topological structure and the lossless damping chip;

[0179] A generation module 25, configured to generate a micro-scale crack repair scheme according to the resonance response characteristics between the continuous conductive interface and the mechanical resonant frequency for intelligent repair of the industrial circuit board.

[0180] Figure 2 The described intelligent repair system for industrial circuit boards based on lossless damping chips can execute Figure 1 The described intelligent repair method for industrial circuit boards based on lossless damping chips in the illustrated embodiment, and its implementation principle and technical effects will not be elaborated. For the intelligent repair system for industrial circuit boards based on lossless damping chips in the above embodiment, the specific manners in which each module and unit perform operations have been described in detail in the embodiments related to the method, and will not be elaborated here.

[0181] In a possible design, Figure 2 The intelligent repair system for industrial circuit boards based on lossless damping chips in the illustrated embodiment can be implemented as a computing device, such as Figure 3 As shown, the computing device may include a storage component 31 and a processing component 32;

[0182] The storage component 31 stores one or more computer instructions, and the one or more computer instructions are for the processing component 32 to call and execute.

[0183] The processing component 32 is configured to obtain multi-dimensional acoustic response data inside the industrial circuit board, perform spatial analysis on the phase offset in the multi-dimensional acoustic response data to generate a three-dimensional geometric boundary coordinate set of the micro-crack area of the industrial circuit board, and the three-dimensional geometric boundary coordinate set includes the depth distribution characteristics and spatial extension vectors of the micro-crack area; based on the depth distribution characteristics, activate the resonance wave stabilization processing mode of the non-destructive damping chip, generate a mechanical resonance frequency matching the depth of the micro-crack area, and generate a dynamic binding force field for suppressing crack propagation on the surface of the micro-crack area according to the mechanical resonance frequency; according to the stress distribution state of the dynamic binding force field, adjust the flow direction of the conductive filling material to generate a target filling scheme including path planning parameters, and the target filling scheme defines the directional filling of the conductive filling material along the adaptive penetration path within the three-dimensional geometric boundary coordinate set; during the directional filling process, construct a conductive filling path topological structure matching the spatial extension vector in the micro-crack area, and jointly generate a continuous conductive interface covering the three-dimensional geometric boundary coordinate set according to the conductive filling path topological structure and the non-destructive damping chip; generate a micro-scale crack repair scheme according to the resonance response characteristics between the continuous conductive interface and the mechanical resonance frequency for intelligent repair of the industrial circuit board.

[0184] Among them, the processing component 32 may include one or more processors to execute computer instructions to complete all or part of the steps in the above method. Of course, the processing component may also be implemented by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors or other electronic components for executing the above method.

[0185] The storage component 31 is configured to store various types of data to support the operation of the terminal. The storage component can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0186] Of course, the computing device may also necessarily include other components, such as input / output interfaces, display components, communication components, etc.

[0187] The input / output interface provides an interface between the processing component and the peripheral interface module, and the above-mentioned peripheral interface module can be an output device, an input device, etc.

[0188] The communication component is configured to facilitate communication between the computing device and other devices in a wired or wireless manner, etc.

[0189] Among them, the computing device can be a physical device or an elastic computing host provided by a cloud computing platform, etc. At this time, the computing device can refer to a cloud server, and the above-mentioned processing component, storage component, etc. can be basic server resources rented or purchased from a cloud computing platform.

[0190] The embodiment of the present invention also provides a computer storage medium storing a computer program, and when the computer program is executed by a computer, it can implement the above-mentioned Figure 1 intelligent repair method of an industrial circuit board based on a lossless damping chip shown in the embodiment.

[0191] Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the above-described systems, devices, and units can refer to the corresponding processes in the foregoing method embodiments, and will not be elaborated herein.

[0192] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art can understand and implement it without creative labor.

[0193] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on this understanding, the essence of the above technical solution or the part that contributes to the prior art can be embodied in the form of a software product. The computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., including several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0194] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An intelligent repair method for industrial circuit boards based on a lossless damping chip, characterized in that, Including: Obtain multi-dimensional acoustic response data inside an industrial circuit board, spatially analyze the phase offset in the multi-dimensional acoustic response data to generate a three-dimensional geometric boundary coordinate set of the micro-crack region of the industrial circuit board, where the three-dimensional geometric boundary coordinate set includes the depth distribution characteristics and spatial extension vector of the micro-crack region; Based on the depth distribution characteristics, activate the resonance wave stabilization processing mode of the non-destructive damping chip, generate a mechanical resonance frequency matching the depth of the micro-crack region, and generate a dynamic constraint force field for suppressing crack propagation on the surface of the micro-crack region according to the mechanical resonance frequency; According to the stress distribution state of the dynamic constraint force field, adjust the flow direction of the conductive filling material to generate a target filling scheme including path planning parameters, where the target filling scheme defines the directional filling of the conductive filling material along the adaptive penetration path within the three-dimensional geometric boundary coordinate set; During the directional filling process, construct a conductive filling path topological structure matching the spatial extension vector within the micro-crack region, and jointly generate a continuous conductive interface covering the three-dimensional geometric boundary coordinate set according to the conductive filling path topological structure and the non-destructive damping chip; Generate a micro-scale crack repair scheme according to the resonance response characteristics between the continuous conductive interface and the mechanical resonance frequency for intelligent repair of the industrial circuit board.

2. The method according to claim 1, characterized in that Obtain multi-dimensional acoustic response data inside an industrial circuit board, spatially analyze the phase offset in the multi-dimensional acoustic response data to generate a three-dimensional geometric boundary coordinate set of the micro-crack region of the industrial circuit board, where the three-dimensional geometric boundary coordinate set includes the depth distribution characteristics and spatial extension vector of the micro-crack region, including: Apply multi-directional ultrasonic excitation signals to the industrial circuit board, collect acoustic wave reflection signals under different propagation paths, and form multi-dimensional acoustic response data including the time dimension and the direction dimension; Decompose the propagation direction of the multi-dimensional acoustic response data and extract the set of phase offsets in each propagation direction; Based on the set of phase offsets and a preset ultrasonic propagation rate mapping model, establish the correlation between the phase offset and the change in medium thickness, where the change in medium thickness characterizes the depth distribution characteristics of the micro-crack region of the industrial circuit board; Perform directional fitting on the boundary of the micro-crack region according to the correlation and calculate the extension vector of the micro-crack region in the physical structure space of the industrial circuit board; Integrate the depth distribution characteristics and the extension vector to generate a three-dimensional geometric boundary coordinate set including the complete morphological parameters of the micro-crack region.

3. The method according to claim 1, wherein Based on the depth distribution characteristics, activate the resonance wave stabilization processing mode of the non-destructive damping chip, generate a mechanical resonance frequency matching the depth of the micro-crack region, and generate a dynamic constraint force field for suppressing crack propagation on the surface of the micro-crack region according to the mechanical resonance frequency, including: Determine the basic frequency value of the mechanical resonance frequency according to the maximum depth value in the depth distribution characteristics and the material resonance characteristics of the base material of the industrial circuit board; Based on different depth levels in the depth distribution characteristics, frequency-expand the basic frequency value according to a preset depth-frequency gradient rule to generate a stepped mechanical resonance frequency sequence covering the depth of the microcrack region; Synchronously output the stepped mechanical resonance frequency sequence through the piezoelectric laminate structure of the non-destructive damping chip, so that the mechanical vibration waves corresponding to the stepped mechanical resonance frequency sequence are superimposed and interfered in the depth direction of the microcrack region, and generate superimposed interference process data; Construct a layered binding force intensity gradient on the surface of the microcrack region according to the vibration energy distribution in the superimposed interference process data; Limit and adjust the vibration wave amplitudes of each layer in the layered binding force intensity gradient to generate a dynamic binding force field for suppressing crack propagation.

4. The method according to claim 3, wherein Synchronously output the stepped mechanical resonance frequency sequence through the piezoelectric laminate structure of the non-destructive damping chip, so that the mechanical vibration waves corresponding to the stepped mechanical resonance frequency sequence are superimposed and interfered in the depth direction of the microcrack region, and generate superimposed interference process data, including: Allocate the stepped mechanical resonance frequency sequence to each piezoelectric unit corresponding to the piezoelectric laminate structure of the non-destructive damping chip according to depth levels, wherein each piezoelectric unit obtains a frequency allocation parameter matching the corresponding depth level; Apply a driving voltage matching the frequency allocation parameter to each piezoelectric unit to generate a mechanical vibration wave matching the frequency allocation parameter, and increase the amplitude value of the mechanical vibration wave in a preset ratio as the stepped mechanical resonance frequency sequence increases in frequency to generate a gradient amplitude vibration wave; Control the emission phase of the gradient amplitude vibration wave so that the vibration wave phase of the surface piezoelectric unit lags behind that of the deep piezoelectric unit by a quarter of a cycle to generate a vibration wave emission sequence with a phase lag; Record the vibration waveform superposition state of the vibration wave emission sequence with a phase lag in the depth direction of the microcrack region to generate an interference wave peak distribution map; Extract the interference region coordinates in the interference wave peak distribution map where the amplitude intensity exceeds a preset substrate yield strength threshold, and mark the interference region coordinates as the effective binding force action area; Generate superimposed interference process data according to the distribution density and position parameters of the effective binding force action area.

5. The method according to claim 1, characterized in that, According to the stress distribution state of the dynamic binding force field, adjust the flow direction of the conductive filling material to generate a target filling scheme including path planning parameters, and the target filling scheme defines that the conductive filling material is directionally filled along an adaptive penetration path within the three-dimensional geometric boundary coordinate set, including: Perform a directional decomposition on the stress distribution state of the dynamic binding force field to obtain a set of principal stress direction angles of each position point on the surface of the microcrack region; Calculate the direction matching degree between the set of principal stress direction angles and the spatial extension vector of the three-dimensional geometric boundary coordinate set to generate a set of flow direction correction parameters for each position point, wherein the set of flow direction correction parameters includes the candidate filling direction of each parameter and the included angle value between each parameter and the spatial extension vector; Screen effective filling paths according to the set of flow direction correction parameters to generate a set of effective filling paths; Generate a target filling scheme including path planning parameters according to the spatial distribution density and direction continuity of the set of effective filling paths, where the target filling scheme consists of a main channel priority coefficient, a filling order parameter for branch paths, and an adaptive penetration path; Adjust the injection pressure gradient of the conductive filling material according to the main channel priority coefficient, and at the same time control the stage change of the flow rate according to the filling order parameter of the branch path to perform directional filling along the adaptive penetration path.

6. The method according to claim 1, characterized in that, During the directional filling process, construct a conductive filling path topological structure matching the spatial extension vector within the microcrack region, and jointly generate a continuous conductive interface covering the three-dimensional geometric boundary coordinate set according to the conductive filling path topological structure and the non-destructive damping chip, including: During the directional filling process, calibrate the flow path of the conductive filling material with the spatial extension vector to the same direction angle to generate an initial filling path topology defined by the main path vector in the spatial extension vector; Apply a local electric field in the node region of the initial filling path topology and control the dendrite growth direction of the conductive filling material in the node region to generate a branch path expansion structure matching the branch vector in the spatial extension vector; Generate conductive filling path topology verification data based on the fusion state of the branch path expansion structure and the main path vector; According to the piezoelectric effect of the non-destructive damping chip, perform periodic micro-vibrations in the interface region of the conductive filling path topology to close the microscopic pores at the interface between the conductive filling material and the substrate and generate microscopic pore closure degree data; Compare and analyze the resistance difference parameter in the conductive filling path topology verification data and the pore closure rate parameter in the microscopic pore closure degree data. When the resistance difference parameter is less than or equal to the first preset threshold and the pore closure rate parameter is greater than or equal to the second preset threshold, generate a continuous conductive interface covering the three-dimensional geometric boundary coordinate set.

7. The method according to claim 1, wherein Generate a micron-level crack repair scheme according to the resonance response characteristics between the continuous conductive interface and the mechanical resonance frequency for intelligent repair of industrial circuit boards, including: Apply a test vibration wave with the same frequency as the mechanical resonance frequency to the continuous conductive interface and detect the resonance response characteristics of the continuous conductive interface to generate interface dynamic response data including a resonance frequency offset and a resonance amplitude attenuation value; Extract the resonance frequency offset and the resonance amplitude attenuation value related to the mechanical resonance frequency from the interface dynamic response data; Compare the resonance frequency offset and the resonance amplitude attenuation value with a preset interface integrity criterion. When the resonance frequency offset and the resonance amplitude attenuation value simultaneously meet the preset interface integrity criterion, generate a micron-level crack repair scheme for intelligent repair of industrial circuit boards.

8. An intelligent repair system for industrial circuit boards based on a lossless damping chip, characterized in that, Including: An analysis module, configured to obtain multi-dimensional acoustic response data inside an industrial circuit board, spatially analyze the phase offset in the multi-dimensional acoustic response data to generate a set of three-dimensional geometric boundary coordinates of the micro-crack region of the industrial circuit board, where the set of three-dimensional geometric boundary coordinates includes the depth distribution characteristics and the spatial extension vector of the micro-crack region; An activation module, configured to activate the resonance wave stabilization processing mode of the lossless damping chip based on the depth distribution characteristics, generate a mechanical resonance frequency matching the depth of the micro-crack region, and generate a dynamic constraint force field for suppressing crack propagation on the surface of the micro-crack region according to the mechanical resonance frequency; An adjustment module, configured to adjust the flow direction of the conductive filling material according to the stress distribution state of the dynamic constraint force field, generate a target filling scheme including path planning parameters, and the target filling scheme defines that the conductive filling material is directionally filled along the adaptive penetration path within the set of three-dimensional geometric boundary coordinates; A construction module, configured to construct a conductive filling path topological structure matching the spatial extension vector in the micro-crack region during the directional filling process, and jointly generate a continuous conductive interface covering the set of three-dimensional geometric boundary coordinates according to the conductive filling path topological structure and the lossless damping chip; A generation module, configured to generate a micro-scale crack repair scheme according to the resonance response characteristics between the continuous conductive interface and the mechanical resonance frequency for intelligent repair of the industrial circuit board.

9. A computing device, characterized in that, It includes a processing component and a storage component; the storage component stores one or more computer instructions; the one or more computer instructions are used to be called and executed by the processing component to implement a method for intelligent repair of an industrial circuit board based on a lossless damping chip according to any one of claims 1 to 7.

10. A computer storage medium, characterized in that, A computer program is stored, and when the computer program is executed by a computer, it implements a method for intelligent repair of an industrial circuit board based on a lossless damping chip according to any one of claims 1 to 7.

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