17 results about "Gold surface" patented technology

The utility model discloses a kind of ultra-thin FPC function test fixture, specifically related to FPC test technical field, comprising: lower mould, the lower mould is provided with the placement area matched with FPC appearance on, the edge of the placement area is equipped with multiple positioning pins;Upper mould, the upper mould is located above lower mould;FPC connects flat cable, one end of the FPC connecting flat cable is connected with test mainboard, the other end of the FPC connecting flat cable is equipped with the contact PAD corresponding with FPC gold finger.The utility model is provided with lower mould, upper mould and FPC connecting flat cable, FPC is fixed on lower mould, one end of FPC connecting flat cable is connected with test mainboard, the contact PAD of the other end is contacted with FPC gold finger under the pressing of upper mould, solve the gold surface pressure point problem caused by FPC and fixture direct plug, simultaneously avoid repeatedly plugging connection to cause test mainboard damaged.

This invention discloses a method for electroplating soft gold onto a circuit board, and also discloses the circuit board. The method includes the following steps: S1: Obtaining a circuit board with a copper layer on its surface; S2: Electroplating a nickel layer on the surface of the copper layer, wherein the surface of the nickel layer has gold bonding lines and non-gold bonding lines; S3: Forming multiple arrayed and spaced bump structures in the gold bonding lines, each bump structure including a nickel substrate and a gold surface layer disposed on the surface of the nickel substrate; S4: Electroplating the circuit board with gold to form a first gold layer on the gold bonding lines and a second gold layer on the non-gold bonding lines, wherein the thickness of the first gold layer is greater than the thickness of the second gold layer. In this way, selective thickening of the gold bonding lines is achieved during the gold plating process, ensuring that the gold bonding lines have a sufficiently thick gold layer to guarantee the reliability of the gold bonding lines, while the non-gold bonding lines maintain a relatively thin gold layer, which can reduce the amount of gold used and lower the production cost of the circuit board.

The invention discloses a flexible circuit double-sided board and a preparation process thereof, and relates to the technical field of flexible circuit boards, the flexible circuit double-sided board comprises a flexible circuit board base material and a covering film covering the surface of the flexible circuit board base material, and the covering film is provided with a window for exposing a copper surface to be subjected to gold immersion. According to the method, the white stains on the gold surface are thoroughly eliminated, the reaction path between the oxidation area of the windowing edge and the golden finger is blocked through the 200-micron copper bars, gold plating abnormity of the oxidation area is concentrated on the copper bars, gold plating on the surface of the golden finger is uniform, and the elimination rate of the white stains reaches 100%; a board grinding process does not need to be newly added, the technical index of'copper surface board grinding forbidding 'of a client is completely met, and potential damage of board grinding to the performance of the circuit board is avoided.

This application relates to the field of flexible printed circuit board (FPC) manufacturing technology, and provides a pre-laser gold plating method for preventing oxidation of the gold surface of FPC connectors after laser processing. The method includes: sequentially performing bonding, encapsulation, lamination, and surface treatment on the flexible circuit board; then applying polyimide reinforcement, followed by a second lamination and surface treatment; printing reinforcement marking lines and text on the flexible circuit board, and after curing; laser-cutting the connector finger positions on the flexible circuit board, with laser cutting only extending to the tips of the connector fingers and both sides of the polyimide reinforcement, controlling the cutout size to avoid affecting subsequent grinding and sandblasting processes; performing a third surface treatment on the laser-cut flexible circuit board, thoroughly removing carbon powder residue generated during laser cutting through sandblasting to prevent carbon powder contamination of the subsequent electroless plating tank; and finally, electroless nickel-gold plating on the surface-treated flexible circuit board to complete subsequent conventional production processes.

The utility model discloses rubber track core gold surface cleaning and drying integration device. The utility model relates to mechanical engineering technical field, and this device includes the casing, still includes: high pressure gas conveying assembly, the outer wall of gas conveying assembly is connected with the inner wall rotation of casing, the outer wall fixed connection of high pressure gas conveying assembly has cleaning assembly, the inner wall of casing is clamped and has sawtooth doctor, high pressure gas conveying assembly includes high pressure gas pipeline, and the both ends of high pressure gas pipeline are clamped and have the protective cover, the inner wall fixed connection of protective cover has gas inlet pipeline and gas outlet pipeline respectively, the inner wall fixed connection of high pressure gas pipeline has helical guide vane, the inner wall rotation of protective cover is connected with the rotating shaft, the outer wall fixed connection of rotating shaft has turbine blade, realizes cleaning and drying integration design under the action of cleaning assembly and high pressure gas through with high pressure gas pipeline outer wall fixed connection.

The invention discloses a multi-layer aluminum core copper-clad plate adopting a plasma oxidation-copper plating process and also discloses a preparation method of the copper-clad plate, and the preparation method comprises the following steps: carrying out plasma anodic oxidation and copper plating treatment on the surface of an aluminum substrate to obtain a copper-clad plasma anodic aluminum oxide substrate; manufacturing an inner-layer circuit pattern on the surface of the copper-clad plasma anodic aluminum oxide substrate, then overlapping the inner-layer circuit pattern with a copper foil and a prepreg, and carrying out vacuum hot-pressing curing to obtain a multi-layer plate blank embedded with an aluminum core; through holes are formed in the multi-layer plate blank, activation and copper plating treatment are carried out, and interlayer electrical interconnection is achieved; and manufacturing an outer-layer circuit pattern on the surface of the multi-layer plate blank, preparing a solder mask layer on the surface of the circuit, and carrying out nickel plating and gold leaching surface treatment to obtain the multi-layer aluminum core copper-clad plate. According to the method, the problems of weak interlayer binding force, low heat dissipation efficiency, insufficient electrical interconnection reliability and the like of the aluminum core multilayer board are solved, and the prepared copper-clad plate can meet the use requirements of high-frequency and high-power electronic equipment.

The invention belongs to the field of material chemistry and molecular electronics, and discloses a preparation method of a gold nanorod assembly. Comprising the following steps: providing a dispersion system containing a plurality of gold nanorods in a liquid-phase medium; introducing a heterocyclic ring assembly molecule anchored on the surface of the gold nanorod into the dispersion system, wherein the heterocyclic ring assembly molecule comprises an aromatic heterocyclic ring providing structural rigidity, a sulfur-containing anchoring group forming a coordinate bond with the gold surface, and a group or atom capable of forming a hydrogen bond; the gold nanorod assembly comprises at least two gold nanorods and heterocyclic ring assembly molecules located on the gold nanorods respectively, and the two gold nanorods are connected with each other through hydrogen bond supramolecular interaction formed between complementary functional groups of the heterocyclic ring assembly molecules. The preparation of the gold nanorod assembly with high yield and linear orientation is realized by utilizing the heterocyclic ring assembly molecules.

The invention discloses a method for improving cleaning efficiency before electrogilding of a back hole. The method comprises the following steps: detecting components of a to-be-etched position on a wafer by using an EDS; an etching machine is used for etching the wafer to form a back hole, in the etching process, signal detection is continuously carried out on the surface of the wafer until a gold signal appears, an etching end point is taken, and the etching process is ended; an EDS is used for detecting a signal of the etched position of the wafer, and back hole components are detected; checking the surface state of the side wall of the back hole and the gold surface roughness of the etching stop layer by using an SEM (Scanning Electron Microscope), wherein the surface state of the side wall is a smooth state or a rough state; configuring a shower head according to the signal type; and cleaning the back hole by using a configured shower head according to the signal type, the side wall surface state and the gold surface roughness until the side wall surface state is a smooth state, and the signals of the etching position only comprise the gold signal and the signal from the semiconductor material. The process can be simplified, and the cleaning efficiency is improved.

The invention discloses a preparation method of gold nano bipyramid surface localized coated silicon dioxide based on an iodide sub-monolayer mask. The method comprises the following steps: firstly, obtaining a high-purity gold nano bipyramid through seed growth and an AgNO3-Ag selective etching process; then, NaI is introduced into the degassed CTAC solution, so that a sub-monolayer adsorption mask is formed on the gold surface, and gradient centrifugal purification is performed; and finally, in a weakly alkaline CTAB system, the mask-modified gold nano bipyramid reacts with a TEOS-ethanol solution, so that silicon dioxide is precisely deposited only in the end part and waist region which are not covered by the mask. According to the method, the atomic-scale iodide sub-monolayer mask technology and the efficient purification process are combined, precise positioning and plaque homogenization of the silicon dioxide coating area are achieved, and compared with a traditional preparation path, the structural purity, the controllability of the coating area and the experimental repeatability are remarkably improved.

A method is provided for making test structures suitable for characterizing and calibrating semiconductor metrology equipment. The test structure may include patterned chromium features that protrude vertically from a thin-film gold surface deposited onto a fused silica substrate.

The application discloses a gold surface hammer grain processing method and a gold ornament, and comprises the following steps: sanding, using sandpaper to coarsely grind the gold surface; chiseling, using a pointed chisel needle to strike the coarsely ground gold surface to form fine concave-convex textures on the gold surface. The application changes the hammer grain process in the existing gold ornament industry, forms obvious hammer grain that is obviously different from hammer grain, and makes the hammer grain on the gold ornament surface more delicate and beautiful.

The invention relates to the technical field of metal plate manufacturing, in particular to an anti-scratch manufacturing method for a golden finger plate gold surface. The method comprises the following steps: cleaning and deburring a golden finger plate, and eliminating edge hidden dangers which are easy to generate scratches; the plate placing direction is reasonably set in the conveying and circulating process, so that the metal surface is located on the non-stress side; during forming and edge processing, the board feeding posture is controlled to avoid an equipment contact path, and gold surface appearance inspection and abnormal separation are implemented in the manufacturing process, so that the gold surface of the golden finger board is effectively prevented from being scratched and damaged. According to the invention, the stress direction, the placement direction and the board feeding posture of the golden finger board in the conveying, circulating and processing processes are systematically controlled, and the process detection and abnormal separation of the appearance state of the gold surface are combined, so that the abrasion damage caused by the contact between the gold surface and equipment or components is avoided from the source; therefore, the appearance quality and the process yield of the gold finger plate gold surface are stably improved.

The invention provides a gold industry e-commerce SaaS cloud service realization method and system, and the method comprises the steps: collecting and extracting the dimension features of a hyperspectral feature image, a polarization feature image and a defect mask image of a gold product in real time, and splicing the dimension features to form a dimension reduction fusion feature vector; on the basis of the distribution situation of the dimensionality reduction fusion feature vector in a low-dimensional feature space, constructing a feature manifold reflecting the oxidation evolution continuity of the gold coating, and selecting and calculating the local density entropy and the feature vector field divergence of gold coating sample points along an oxidation principal axis; the invention aims to solve the problem that the development of the gold industry e-commerce is seriously restricted due to the fact that a consumer cannot truly observe the color and texture of a gold product through an image because the space-time difference between the thickness distribution of a gold surface oxide layer and the reflectivity of a plating layer is difficult to analyze by the existing SaaS cloud service implementation method for the gold industry e-commerce.

The present application discloses a kind of circuit board's scratch-proof electrical measurement method, include: preliminary step, provide a panel, its surface is defined with multiple unit areas, and each described unit area forms a first gold surface;Dry film setting step, a dry film is set on the panel and shields multiple described unit areas;A windowing step, multiple first windows are formed on the dry film, and each described first gold surface is exposed to corresponding described first window;Cutting step, the panel and the dry film are cut along the junction of described unit area, to form multiple circuit boards and multiple sub dry films covered on multiple described circuit boards;Electrical measurement step, each described circuit board is electrically measured by the part of described first gold surface exposed to described first window;And removal step, remove described sub dry film.The present application discloses the scratch-proof electrical measurement method of circuit board can improve the problem that existing circuit board manufacturing method is prone to gold surface scratch in process.

The invention provides a low-cost and high-plating-speed pure palladium chemical plating solution for a power chip, which comprises the following components based on the total amount of the plating solution: 0.4-0.6 g / L of water-soluble palladium salt, 20-30 g / L of composite complexing agent, 10-20 g / L of pH buffer agent, 8-12 g / L of double reducing agent, 0.1-0.5 g / L of accelerator and 5-8 mg / L of stabilizer, the composite complexing agent comprises 5-10 g / L of organic amines and 15-20 g / L of amino carboxylic acid; the double reducing agents are selected from two of hydrazine substances, formic acid substances or hydroxylamine substances. The chemical palladium plating solution disclosed by the invention can be used for high-speed pure palladium plating in an aluminum substrate chemical nickel-palladium-gold plating surface treatment process on a power chip, an obtained plating layer is a phosphorus-free pure palladium plating layer, the plating speed of the plating solution under the condition of lower palladium content reaches 0.049 mu m / min, the liquid medicine cost and the time cost in the production process can be effectively reduced, and the production efficiency is improved. And meanwhile, the plating solution further has good stability, and stable operation of five MTOs can be achieved.

The invention discloses a semiconductor structure and a corresponding chip and product. The structure comprises a silicon-based integrated circuit and a bump structure arranged on the silicon-based integrated circuit. The bump structure sequentially comprises a UBM layer, a copper conductor layer, a nickel conductor layer and a gold conductor layer. The exposed side walls of the UBM layer, the copper conductor layer and the nickel conductor layer are coated with a metal protection layer composed of palladium, palladium alloy, platinum or platinum alloy, and the protection layer does not cover the gold conductor layer. According to the preparation method, the step-shaped side wall is formed through etching steps in a specific sequence, selective self-growth of the protective layer on the titanium / copper / nickel side wall is achieved through chemical plating based on metal equilibrium potential difference, and the protective layer is not deposited on the gold surface. The problems of poor welding and short circuit caused by oxide generated by side wall oxidation and copper diffusion of the copper-nickel-gold bump are effectively solved, the long-term reliability is remarkably improved, meanwhile, the using amount of precious metal is small, the technology is ingenious, and the method is particularly suitable for the high-end display field of liquid crystal driving chips and the like.

The application belongs to the field of material chemistry and molecular electronics, and discloses a preparation method of gold nanorod assembly. The method comprises the following steps: providing a dispersion system containing a plurality of gold nanorods in a liquid medium; introducing a heterocyclic assembly molecule anchored on the surface of the gold nanorod into the dispersion system, wherein the heterocyclic assembly molecule contains a structural rigid aromatic heterocycle, a sulfur-containing anchoring group forming a coordination bond with the gold surface, and a group or atom capable of forming a hydrogen bond; the gold nanorod assembly contains at least two gold nanorods and the heterocyclic assembly molecule on each gold nanorod, and the two gold nanorods are connected by the hydrogen bond supramolecular interaction between the complementary functional groups of the heterocyclic assembly molecules. The preparation of the gold nanorod assembly with high yield and linear orientation is realized by using the heterocyclic assembly molecule.