56 results about "Gold surface" patented technology

The invention provides a low-cyanide gold leaching agent system and a dump leaching process thereof, and belongs to the technical field of hydrometallurgy. According to the method, a synergistic process of'interface activation, cyanide etching and iron precipitation inhibition 'is constructed by designing a low-cyanide gold leaching agent system. The amino acid auxiliary leaching agent adsorbs the gold surface to weaken lattice energy, so that the etching efficiency of trace cyanide ions is improved; mercapto-containing malic acid is used as a chelating agent, specific mercapto in molecules of the mercapto-containing malic acid and iron ions form an ultrahigh-stability water-soluble complex, generation of ferric hydroxide precipitates is thoroughly blocked, ferrous ions stabilized by the chelating agent are subjected to in-situ oxidation through dissolved oxygen and efficiently regenerated into potassium ferricyanide, and accumulation of free cyanogens in a solution system is eliminated; meanwhile, a chelating agent-iron complex forms a self-buffering pair, the pH of the dump leaching solution is accurately controlled, and secondary precipitation caused by local alkalization is prevented. According to the process, under the synergistic effect that the core chelating agent guarantees permeation stability and the leaching aid accelerates gold dissolution, the heap leaching period is compressed to 45 days.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.

Various examples are provided related to functionalization for sensing of antibodies. In one example, a method for functionalizing a test strip includes cleaning a gold surface of an electrode of a test strip; submerging the cleaned gold surface in a 3-Mercaptopropanyl-N-hydroxysuccinimide ester solution; cleaning channels of the test strip; injecting an antibody into the channels; sealing the injected antibody in the test strip; storing the sealed test strip at a controlled temperature; and deactivating unfunctionalized groups. In another example, a method includes connecting a functionalized test strip to a strip connector; generating a test pattern that is passed through the functionalized test strip and input into a gate terminal of a MOSFET in a readout block; converting a readout signal into a frequency signal; and counting the frequency signal at fixed intervals to generate a counter output, and displaying a sample concentration based upon the counter output.

The invention belongs to the technical field of circuit board detection, and discloses a traceless spring test needle and a gold surface traceless test method. Comprising a needle tube, a needle head and a first spring, a first sliding groove is formed in the inner wall of the needle tube, a sliding assembly is arranged in the first sliding groove, and the sliding assembly is located between the needle head and the first spring; the spiral first sliding groove is formed in the inner wall of the needle tube, and the sliding assembly is embedded into the spiral first sliding groove, so that the sliding assembly obtains circumferential rotating force while axially moving, and the needle head is driven to synchronously rotate. The needle head is in erasing type rotary contact when being in contact with a gold surface, so that a surface oxide layer or insulating stains are effectively removed; compared with a traditional vertical press-in mode, the rotating mechanism can greatly reduce the contact pressure in unit area; damage to micro welding spots and routing structures is reduced, and structural damage caused by local stress concentration is avoided.

The invention provides a gold wire drawing process. The gold wire drawing process comprises the following steps that S1, gold pretreatment is conducted, specifically, grease, dust and oxide on the surface of gold are removed through ultrasonic cleaning or a neutral solvent; s2, gold fixing and positioning, wherein a gold workpiece is fixed to a special clamp or a beewax rubber plate and positioned; s3, gold coarse wiredrawing operation is conducted, specifically, a diamond wiredrawing needle, a tungsten steel scraper or special abrasive paper is selected for bottoming according to the texture requirement; s4, gold fine wiredrawing operation is conducted, specifically, a diamond wiredrawing needle, a tungsten steel scraper or special abrasive paper is selected for refining according to the texture requirement; s5, gold dust removal, wherein metal chippings are removed through a banister brush or compressed air; s6, gold passivation treatment is conducted, specifically, a nanoscale protection layer is sprayed; and S7, gold local polishing is conducted, specifically, mirror polishing is conducted on the non-wiredrawing area through an agate knife. According to the gold wire drawing process provided by the invention, the texture of each gold workpiece ornament is unique, the wire drawing effect of combining a cat eye with velvet can be realized, and the aesthetic degree of the gold craft ornament is improved.

The utility model discloses a kind of ultra-thin FPC function test fixture, specifically related to FPC test technical field, comprising: lower mould, the lower mould is provided with the placement area matched with FPC appearance on, the edge of the placement area is equipped with multiple positioning pins;Upper mould, the upper mould is located above lower mould;FPC connects flat cable, one end of the FPC connecting flat cable is connected with test mainboard, the other end of the FPC connecting flat cable is equipped with the contact PAD corresponding with FPC gold finger.The utility model is provided with lower mould, upper mould and FPC connecting flat cable, FPC is fixed on lower mould, one end of FPC connecting flat cable is connected with test mainboard, the contact PAD of the other end is contacted with FPC gold finger under the pressing of upper mould, solve the gold surface pressure point problem caused by FPC and fixture direct plug, simultaneously avoid repeatedly plugging connection to cause test mainboard damaged.

The invention discloses a rubber track core gold pretreatment and impregnation integrated process and device, and relates to the technical field of track core gold treatment. In the phosphating pretreatment process, cleaning needs to be carried out again generally after a phosphoric acid solution pool is led out, but in the leading-out process, a large amount of residual solution exists on the surface of core gold, so that the loss of the phosphoric acid solution is increased, and meanwhile, the cleaning difficulty is increased. Through cooperation of a top guide roller and an outer guide roller, when core gold subjected to phosphoric acid treatment is guided and conveyed, the top guide roller is higher than the outer guide roller, so that the core gold obliquely moves upwards, the inclined core gold has a drainage effect in the movement process of the core gold, and the residual phosphoric acid solution rapidly flows downwards along the core gold in cooperation with the gravity of the residual phosphoric acid solution on the surface of the core gold; therefore, the waste of the phosphoric acid solution is avoided, and the cleaning difficulty is reduced.

The present invention provides a process for manufacturing gold micro-bumps with a high aspect ratio and low bonding pressure on a glass adapter plate. The method adopts a double-layer photoresist (cross-linked carbonized thin resist + thick resist) to form an electroplating pattern mask, thereby improving the adhesion of the photoresist without reducing the accuracy of the photoresist pattern, and reducing the problems of floating and debonding of the electroplated gold surface. Flattening and grayscale photolithography etching methods are adopted to prepare a bonding-enhancing microstructure on the surface of the micro-bumps, optimize the micro-bump height consistency and surface contact area, and reduce the bonding pressure requirement and bonding difficulty. Commonly used micro-nano processing technologies are adopted to effectively realize the preparation of micro-bumps required for three-dimensional integrated vertical interconnection of glass-based adapter plates in microwave components.

This invention discloses a method for electroplating soft gold onto a circuit board, and also discloses the circuit board. The method includes the following steps: S1: Obtaining a circuit board with a copper layer on its surface; S2: Electroplating a nickel layer on the surface of the copper layer, wherein the surface of the nickel layer has gold bonding lines and non-gold bonding lines; S3: Forming multiple arrayed and spaced bump structures in the gold bonding lines, each bump structure including a nickel substrate and a gold surface layer disposed on the surface of the nickel substrate; S4: Electroplating the circuit board with gold to form a first gold layer on the gold bonding lines and a second gold layer on the non-gold bonding lines, wherein the thickness of the first gold layer is greater than the thickness of the second gold layer. In this way, selective thickening of the gold bonding lines is achieved during the gold plating process, ensuring that the gold bonding lines have a sufficiently thick gold layer to guarantee the reliability of the gold bonding lines, while the non-gold bonding lines maintain a relatively thin gold layer, which can reduce the amount of gold used and lower the production cost of the circuit board.

The invention discloses a flexible circuit double-sided board and a preparation process thereof, and relates to the technical field of flexible circuit boards, the flexible circuit double-sided board comprises a flexible circuit board base material and a covering film covering the surface of the flexible circuit board base material, and the covering film is provided with a window for exposing a copper surface to be subjected to gold immersion. According to the method, the white stains on the gold surface are thoroughly eliminated, the reaction path between the oxidation area of the windowing edge and the golden finger is blocked through the 200-micron copper bars, gold plating abnormity of the oxidation area is concentrated on the copper bars, gold plating on the surface of the golden finger is uniform, and the elimination rate of the white stains reaches 100%; a board grinding process does not need to be newly added, the technical index of'copper surface board grinding forbidding 'of a client is completely met, and potential damage of board grinding to the performance of the circuit board is avoided.

This application relates to the field of flexible printed circuit board (FPC) manufacturing technology, and provides a pre-laser gold plating method for preventing oxidation of the gold surface of FPC connectors after laser processing. The method includes: sequentially performing bonding, encapsulation, lamination, and surface treatment on the flexible circuit board; then applying polyimide reinforcement, followed by a second lamination and surface treatment; printing reinforcement marking lines and text on the flexible circuit board, and after curing; laser-cutting the connector finger positions on the flexible circuit board, with laser cutting only extending to the tips of the connector fingers and both sides of the polyimide reinforcement, controlling the cutout size to avoid affecting subsequent grinding and sandblasting processes; performing a third surface treatment on the laser-cut flexible circuit board, thoroughly removing carbon powder residue generated during laser cutting through sandblasting to prevent carbon powder contamination of the subsequent electroless plating tank; and finally, electroless nickel-gold plating on the surface-treated flexible circuit board to complete subsequent conventional production processes.

The invention relates to the technical field of gold processing, in particular to a gold surface texture processing method which comprises the following steps: preparing processing equipment, a cutter system, a clamp system, a dust collection system, polishing equipment and ultrasonic cleaning equipment, then cleaning the surface of a gold workpiece to ensure that no oil stain and oxide exist, then loading the workpiece into the clamp system and screwing the workpiece, secondly, a three-dimensional model is imported into software, a tool path with the direction perpendicular to the curved surface is generated, cutting parameters are set, machining is started, the tool abrasion condition is monitored in real time, meanwhile, a dust collection system sucks and collects metal powder generated in the carving process, and finally a finished gold workpiece is taken down. The polishing equipment is used for further polishing and grinding the surface of the gold workpiece, and then the ultrasonic cleaning equipment is used for cleaning the gold workpiece, so that the fineness and the machining speed of the texture on the surface of the workpiece are effectively improved, the original texture and glossiness of gold are kept, regional reflection can be formed, and pollution is avoided.

The utility model discloses rubber track core gold surface cleaning and drying integration device. The utility model relates to mechanical engineering technical field, and this device includes the casing, still includes: high pressure gas conveying assembly, the outer wall of gas conveying assembly is connected with the inner wall rotation of casing, the outer wall fixed connection of high pressure gas conveying assembly has cleaning assembly, the inner wall of casing is clamped and has sawtooth doctor, high pressure gas conveying assembly includes high pressure gas pipeline, and the both ends of high pressure gas pipeline are clamped and have the protective cover, the inner wall fixed connection of protective cover has gas inlet pipeline and gas outlet pipeline respectively, the inner wall fixed connection of high pressure gas pipeline has helical guide vane, the inner wall rotation of protective cover is connected with the rotating shaft, the outer wall fixed connection of rotating shaft has turbine blade, realizes cleaning and drying integration design under the action of cleaning assembly and high pressure gas through with high pressure gas pipeline outer wall fixed connection.

This invention discloses a method for detecting the purity of gold, comprising the following steps: creating a detection platform and placing the gold to be tested on the platform; acquiring image information of the gold to be tested; capturing several "impurity units" on the surface of the gold to be tested in the image and locating the "impurity units"; moving the gold to be tested according to the location of the "impurity units" so that the spectrometer can perform multi-point purity measurements on the "impurity units" and calculate the purity of the gold to be tested. Through the above method, during detection, the gold to be tested is placed on the detection platform, 3D image information of the gold to be tested is acquired by a camera, and all "impurity units" in the image information are captured to obtain the position coordinates of each "impurity unit". Based on the coordinates, the gold to be tested is moved so that each "impurity unit" is positioned below the detection end of the spectrometer, thereby enabling the spectrometer to perform precise multi-point measurements on each "impurity unit" and improving the accuracy of gold purity detection.

The invention provides a wafer aging test method, and relates to the technical field of wafer test. The first protective gas is introduced into the aging test cavity of the aging test device, so that air in the aging test cavity can be emptied, and the first protective gas with the temperature higher than the target aging test temperature is continuously blown into the aging test cavity, namely, the surface of the wafer to be tested can be blown; condensation and deposition of pollutants on the surface of the to-be-tested wafer can be avoided under the condition that the to-be-tested wafer cannot be prevented from being in contact with various gaseous pollutants, so that discoloration of the back gold surface of the to-be-tested wafer is greatly reduced.

The invention discloses a multi-layer aluminum core copper-clad plate adopting a plasma oxidation-copper plating process and also discloses a preparation method of the copper-clad plate, and the preparation method comprises the following steps: carrying out plasma anodic oxidation and copper plating treatment on the surface of an aluminum substrate to obtain a copper-clad plasma anodic aluminum oxide substrate; manufacturing an inner-layer circuit pattern on the surface of the copper-clad plasma anodic aluminum oxide substrate, then overlapping the inner-layer circuit pattern with a copper foil and a prepreg, and carrying out vacuum hot-pressing curing to obtain a multi-layer plate blank embedded with an aluminum core; through holes are formed in the multi-layer plate blank, activation and copper plating treatment are carried out, and interlayer electrical interconnection is achieved; and manufacturing an outer-layer circuit pattern on the surface of the multi-layer plate blank, preparing a solder mask layer on the surface of the circuit, and carrying out nickel plating and gold leaching surface treatment to obtain the multi-layer aluminum core copper-clad plate. According to the method, the problems of weak interlayer binding force, low heat dissipation efficiency, insufficient electrical interconnection reliability and the like of the aluminum core multilayer board are solved, and the prepared copper-clad plate can meet the use requirements of high-frequency and high-power electronic equipment.

The present application relates to the technical field of medical noble metal materials and medical devices, and in particular to a gold surface anti-coagulation coating structure, a preparation method and application thereof.The present application uses chloroauric acid to construct a micro-nano morphology surface in situ by wet chemical reduction on the surface of a gold layer, uses fluorothiol to modify the surface of the micro-nano gold layer, and injects a lubricant into the modified micro-nano gold surface to construct a lubricant-injected porous self-lubricating surface (SLIPS).The locking ability of the nano gold layer surface modified by fluorothiol is significantly improved, so that the lubricating layer is not prone to loss, thereby having a long-lasting anti-coagulation function.The present application solves the problem that the injected lubricating liquid is prone to depletion and the anti-coagulation performance has poor durability when a liquid injection surface method is used to perform anti-coagulation treatment on the surface of a material.

The invention discloses a high-heat-resistance organic weldable protective agent and a preparation method thereof, which are used in the technical field of surface treatment process, the high-heat-resistance organic weldable protective agent comprises the following components by mass: 5-10 parts of a composite film-forming agent; 0.1 to 0.5 part of an accelerant; 0.03 to 0.06 part of a homogenizing agent; 0.002 to 0.006 part of an organic solvent; and 0.1-0.3 part of a stabilizer. The obtained film is uniform and transparent, glossy in color, high in weldability, good in heat resistance, free of color change after three times of backflow and good in gold surface compatibility, is particularly suitable for half nickel-gold half OSP products, and is easy to rework. Alcohol and ester imidazole are used, so that a film cannot be formed on a gold surface, and the welding performance cannot be influenced; the accelerant is used for accelerating formation of the film-forming agent on the copper surface, equipment cannot be corroded, and the film coating speed is higher; the homogenizing agent provided by the invention can improve the uniformity of a film layer.

The invention provides a three-dimensional laminated three-dimensional packaging component tin coating device and process method, and the method comprises the steps: obtaining a gold removal surface image of a gold removal pin, determining the gold removal color uniformity and the gold removal flatness so as to determine a gold removal characterization state, and determining whether secondary gold removal is needed or not according to the gold removal characterization state; obtaining a separation blade surface image of the gold-removed tin-coated separation blade and a tin-coated surface image of the tin-coated pin; and determining whether the height of the tinning pin is reduced or not according to the tin liquid area proportion of the surface image of the separation blade, determining a tinning characterization state according to the tinning flatness and the tinning flowing phenomenon of the tinning surface image, and adjusting the temperature of the alloy tin pot according to the tinning characterization state. According to the invention, the problem that the gold-removing and tin-coating quality of the device does not meet the standard requirement because the parameters are not adjusted according to the bottleneck that the gold-removing and tin-coating height of the device pin is difficult to control in the prior art is solved.

The invention belongs to the field of material chemistry and molecular electronics, and discloses a preparation method of a gold nanorod assembly. Comprising the following steps: providing a dispersion system containing a plurality of gold nanorods in a liquid-phase medium; introducing a heterocyclic ring assembly molecule anchored on the surface of the gold nanorod into the dispersion system, wherein the heterocyclic ring assembly molecule comprises an aromatic heterocyclic ring providing structural rigidity, a sulfur-containing anchoring group forming a coordinate bond with the gold surface, and a group or atom capable of forming a hydrogen bond; the gold nanorod assembly comprises at least two gold nanorods and heterocyclic ring assembly molecules located on the gold nanorods respectively, and the two gold nanorods are connected with each other through hydrogen bond supramolecular interaction formed between complementary functional groups of the heterocyclic ring assembly molecules. The preparation of the gold nanorod assembly with high yield and linear orientation is realized by utilizing the heterocyclic ring assembly molecules.

The invention relates to a circuit board manufacturing process capable of avoiding a laser oxidized gold surface, which comprises the following steps: preparing a substrate, pickling, performing laser treatment on an inner ring, roughening and performing electroless gold plating, in the electroless gold plating step, intermediate plates are vertically inserted into a hanging basket and are conveyed along the direction of the plate surface, and vertical electroless gold plating is performed to obtain electroless gold plates, and the spacing distance between the adjacent intermediate plates is not less than 10mm. According to the invention, the inner ring laser step is carried out before the electroless gold step, so that the risk that the electroless gold surface is oxidized under the influence of laser is avoided, and the conductivity of the product is ensured. And the middle plates are inserted into different insertion frame areas at intervals. Even if the middle plates deform, the middle plates cannot be tightly attached to the adjacent middle plates due to the fact that the middle plates are blocked by the Teflon thin wires, it is guaranteed that chemical gold acts on the plate faces of the two middle plates on the side, and the problem that the chemical gold is positively stacked due to the fact that the strength of the laser plate faces is reduced in advance is solved.

The application discloses an ammonium ion sensor and a preparation method thereof, wherein the ammonium ion sensor comprises a substrate, a reference electrode and a working electrode which are arranged on the substrate in a spaced manner; the working electrode comprises a metal electrode layer, a dendritic gold nanomaterial layer, a conductive polymer layer and an ammonium ion selective membrane which are arranged in a stacked manner; the metal electrode layer is arranged in close contact with the substrate; the conductive polymer layer is arranged in close contact with one side of the dendritic gold nanomaterial layer and wraps around the surface of the dendritic gold according to the shape of the dendritic gold. In the application, the conductive polymer layer is conformal with the dendritic gold in the dendritic gold nanomaterial layer, which is beneficial to electron transmission, reduces potential drift, makes the ammonium ion sensor have good performance, has a low detection lower limit and a wide sensing range, realizes sensitive, stable and real-time noninvasive monitoring of different ammonium ion concentrations in various body fluids, does not produce toxic substances during ammonium ion detection and can realize continuous detection of ammonium ions in body fluids.

The application discloses a semiconductor structure, a preparation method and a corresponding chip and product. The structure comprises a silicon-based integrated circuit and a bump structure arranged on the silicon-based integrated circuit. The bump structure comprises, in sequence, a UBM layer, a copper conductor layer, a nickel conductor layer and a gold conductor layer. A metal protective layer composed of palladium, palladium alloy, platinum or platinum alloy is coated on exposed sidewalls of the UBM layer, the copper conductor layer and the nickel conductor layer, and the protective layer does not cover the gold conductor layer. The preparation method forms stepped sidewalls through specific etching steps, and realizes selective self-growth of the protective layer on the titanium / copper / nickel sidewalls by using chemical plating based on the metal equilibrium potential difference, and the gold surface is not deposited. The application effectively solves the problems of poor welding and short circuit caused by oxidation of the copper-nickel-gold bump sidewall and oxides generated by copper diffusion, significantly improves long-term reliability, and is particularly suitable for high-end display fields such as liquid crystal drive chips.

The invention discloses a golden finger rubberizing process, which comprises the following steps of: (1) placing a PCB (Printed Circuit Board) on a positioning platform with negative pressure adsorption holes, and arranging golden finger position marking lines on the surface of the platform; (2) starting a nitrogen purging device at the flow rate of 0.5-1.5 L / min, covering the golden finger area to form an inert gas environment, and continuing until the rubberizing is completed; (3) carrying out reductive cleaning on the surface of the golden finger: wiping for 10-15 seconds by using an ammonium citrate solution with the concentration of 5%-10%, and removing a pre-oxidation layer; (4) a pre-cut anti-plating adhesive tape is used, the non-adhesive face of the adhesive tape contains an antioxidant coating benzotriazole, the thickness of the adhesive tape ranges from 0.1 micrometer to 0.5 micrometer, and manual attaching is conducted along the marked line; (5) pressing the adhesive tape step by step at an angle of 45 + / -5 degrees by adopting a silica gel scraper, and removing bubbles; the hardness Shore A of the silica gel scraper is 40-50; and (6) trimming the edge of the adhesive tape with traceless tweezers to ensure that the distance from the edge of the golden finger is less than or equal to 0.2 mm Manual operation is achieved, cost is saved, the problem of golden finger oxidation during manual film pasting can be solved, residual glue stains on the copper surface are prevented, and the gold surface is prevented from being scratched.

The invention discloses a method for improving cleaning efficiency before electrogilding of a back hole. The method comprises the following steps: detecting components of a to-be-etched position on a wafer by using an EDS; an etching machine is used for etching the wafer to form a back hole, in the etching process, signal detection is continuously carried out on the surface of the wafer until a gold signal appears, an etching end point is taken, and the etching process is ended; an EDS is used for detecting a signal of the etched position of the wafer, and back hole components are detected; checking the surface state of the side wall of the back hole and the gold surface roughness of the etching stop layer by using an SEM (Scanning Electron Microscope), wherein the surface state of the side wall is a smooth state or a rough state; configuring a shower head according to the signal type; and cleaning the back hole by using a configured shower head according to the signal type, the side wall surface state and the gold surface roughness until the side wall surface state is a smooth state, and the signals of the etching position only comprise the gold signal and the signal from the semiconductor material. The process can be simplified, and the cleaning efficiency is improved.

This invention relates to the field of electroplating technology, and discloses an electroplating gold solution, its preparation method, and its application. The electroplating gold solution, by concentration, comprises the following components: 3-15 g / L gold salt, 30-100 mg / L accelerator, 10-20 g / L complexing agent, 15-50 mg / L stabilizer, 10-50 mg / L inhibitor, 30-70 mg / L dispersant, and 10-20 g / L conductive salt; the solvent of the electroplating gold solution is water; the accelerator includes 3-amino-6-methylpyridazine. The electroplating gold solution provided by this invention, using 3-amino-6-methylpyridazine as an accelerator, can promote gold ion precipitation and improve electroplating efficiency; the electroplating gold solution does not use cyanide-containing raw materials, thus having good environmental friendliness; the electroplating gold solution has good stability and a low scrap rate, which helps to save costs; the composition and working parameters of the electroplating gold solution are reasonable, and it can form a uniform, bright coating without plating cracks, and can be applied to the electroplating gold surface treatment of ceramic substrates.

The application belongs to the technical field of circuit board detection, and discloses a traceless spring test needle and a gold surface traceless test method. The traceless spring test needle comprises a needle tube, a needle head and a first spring. A first sliding groove is formed in the inner wall of the needle tube. A sliding assembly is arranged in the first sliding groove. The sliding assembly is located between the needle head and the first spring. A helical first sliding groove is arranged on the inner wall of the needle tube. The sliding assembly is embedded in the first sliding groove. The sliding assembly obtains circumferential rotation force while moving in the axial direction, and drives the needle head to rotate synchronously. The needle head rotates in a "erasing" mode when contacting the gold surface, effectively removing the surface oxidation layer or insulating stains. Compared with the traditional vertical pressing mode, the rotation mechanism can greatly reduce the contact pressure on the unit area, reduce the damage to the small welding points and wire bonding structure, and avoid the structural damage caused by local stress concentration.

The invention relates to the technical field of printed circuit boards, in particular to a solution, a preparation method of a printed circuit board, the printed circuit board and electronic equipment. The solution comprises: a first compound selected from at least one of nitrogen-containing carboxylic acid and salts thereof, and water-soluble amine compounds; a second compound selected from at least one of hydroxyl-containing carboxylic acids and salts thereof; and a third compound selected from hypophosphite. According to the solution provided by some embodiments of the invention, through the synergistic effect of the first compound, the second compound and the third compound, small molecules and molecules with low polymerization degree in the ink are selectively dissolved out in advance on the premise of not damaging the integrity of the main body structure of the solder resist ink; and the dissolution amount of the solder resist ink in the chemical plating bath solution in the subsequent chemical plating treatment process is reduced, and the bath solution is effectively protected from being polluted, so that the reduction of the deposition rate of a chemical plating layer is slowed down, the uniformity of the thickness of the plating layer is ensured, the quality defects such as skip plating, gold surface color difference and nickel corrosion are reduced, and the product yield is improved.

The present invention provides a method of preparing a complementary metal oxide semiconductor comprising one or more electrode, the method comprising: providing a complementary metal oxide semiconductor (CMOS) integrated circuit (IC) having one or more sensor regions, each sensor region comprising a sensing zone and a passivation zone, wherein the passivation zone encircles and directly abuts the sensing zone, and the sensing zone comprises an active layer, an optional adhesive layer and a conductive base layer; replacing at least part of the active layer with a metal sub¬ layer by electroless deposition; and pulse current electroplating a crystalline gold surface layer onto the metal sub-layer to form the one or more electrodes. The present invention further provides said complementary metal oxide semiconductors, electrochemical devices containing said complementary metal oxide semiconductors, and methods of using said electrochemical devices to detect biomolecules.

This application relates to the field of jewelry processing, specifically disclosing a manufacturing process for a 0.5N gold surface decorative film on bag fasteners. The process involves cleaning and drying the bag fasteners, then placing them into a vacuum coating machine. Following steps such as coarse low-vacuum extraction, fine high-vacuum extraction, argon ion cleaning, titanium ion cleaning, titanium plating, gold plating, gold plating with steel, nickel, and copper, and cooling, a uniform thickness, corrosion-resistant, wear-resistant, and oxidation-resistant surface decorative film is obtained for the bag fasteners. The color tone is L87, A2.2, B14.6, named 0.5N gold, adding a precious metal gold color to the market and filling a market gap, providing a new option for jewelry manufacturers. Furthermore, the simple and efficient production process helps improve production efficiency. Moreover, during the production process, the color tone of the surface decorative film on the bag fasteners can be adjusted by changing the current of the gold, steel, nickel, and copper targets in the vacuum coating machine.