72 results about "Gold surface" patented technology

The invention provides a single-molecule gene sequencing method based on an MOSFET device, and belongs to the technical field of single-molecule gene sequencing. A grid electrode and a source and drain electrode area of the MOSFET device are coated with a chromium surface and a gold surface in sequence, after the grid electrode is coated with a PMMA coating, a hole only capable of containing single polymerase is developed through high-precision electron beam exposure, and the single polymerase is formed in the hole; the PDMS micro-channel is attached to the periphery of the grid electrode to form a micro reaction chamber, and electronegative polymerase is driven into a high-potential PMMA hole by utilizing a negative pressure circulating scanning method and forms gold-sulfur bond connection with a bottom grid electrode gold atom, so that modification of a single polymerase on the grid electrode is completed. By further upgrading and improving a product-grade MOSFET device, a sequencing technology which takes a single polymerase chain reaction as a sequence information feedback source and realizes high-precision reading of a sequence by utilizing an intrinsic physiological function of biomolecules is formed, and an effective signal analysis method is constructed, so that the information reading effectiveness is improved, and the accuracy of information reading is improved. The accuracy and the high efficiency of a single molecule sequencing technology are improved.

The invention provides a low-cyanide gold leaching agent system and a dump leaching process thereof, and belongs to the technical field of hydrometallurgy. According to the method, a synergistic process of'interface activation, cyanide etching and iron precipitation inhibition 'is constructed by designing a low-cyanide gold leaching agent system. The amino acid auxiliary leaching agent adsorbs the gold surface to weaken lattice energy, so that the etching efficiency of trace cyanide ions is improved; mercapto-containing malic acid is used as a chelating agent, specific mercapto in molecules of the mercapto-containing malic acid and iron ions form an ultrahigh-stability water-soluble complex, generation of ferric hydroxide precipitates is thoroughly blocked, ferrous ions stabilized by the chelating agent are subjected to in-situ oxidation through dissolved oxygen and efficiently regenerated into potassium ferricyanide, and accumulation of free cyanogens in a solution system is eliminated; meanwhile, a chelating agent-iron complex forms a self-buffering pair, the pH of the dump leaching solution is accurately controlled, and secondary precipitation caused by local alkalization is prevented. According to the process, under the synergistic effect that the core chelating agent guarantees permeation stability and the leaching aid accelerates gold dissolution, the heap leaching period is compressed to 45 days.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.

Various examples are provided related to functionalization for sensing of antibodies. In one example, a method for functionalizing a test strip includes cleaning a gold surface of an electrode of a test strip; submerging the cleaned gold surface in a 3-Mercaptopropanyl-N-hydroxysuccinimide ester solution; cleaning channels of the test strip; injecting an antibody into the channels; sealing the injected antibody in the test strip; storing the sealed test strip at a controlled temperature; and deactivating unfunctionalized groups. In another example, a method includes connecting a functionalized test strip to a strip connector; generating a test pattern that is passed through the functionalized test strip and input into a gate terminal of a MOSFET in a readout block; converting a readout signal into a frequency signal; and counting the frequency signal at fixed intervals to generate a counter output, and displaying a sample concentration based upon the counter output.

The invention belongs to the technical field of circuit board detection, and discloses a traceless spring test needle and a gold surface traceless test method. Comprising a needle tube, a needle head and a first spring, a first sliding groove is formed in the inner wall of the needle tube, a sliding assembly is arranged in the first sliding groove, and the sliding assembly is located between the needle head and the first spring; the spiral first sliding groove is formed in the inner wall of the needle tube, and the sliding assembly is embedded into the spiral first sliding groove, so that the sliding assembly obtains circumferential rotating force while axially moving, and the needle head is driven to synchronously rotate. The needle head is in erasing type rotary contact when being in contact with a gold surface, so that a surface oxide layer or insulating stains are effectively removed; compared with a traditional vertical press-in mode, the rotating mechanism can greatly reduce the contact pressure in unit area; damage to micro welding spots and routing structures is reduced, and structural damage caused by local stress concentration is avoided.

The invention discloses a manufacturing method of a circuit board, and belongs to the technical field of circuit board manufacturing, and the method comprises the steps: transferring an electrogilding circuit and a pattern to a PCB, and after the PCB with the circuit and the pattern transferred is obtained, protecting a conductive wire between LGA areas by using photosensitive wet ink, and protecting other patterns by using a dry film to obtain the PCB with an exposed copper surface; performing electrogilding treatment on the PCB with the exposed copper surface to obtain an electrogilded PCB; covering the PCB subjected to gold electroplating with a protective material, and exposing the to-be-etched conductive wire and the corresponding etching liquid medicine outflow channel through exposure of a negative film; feeding the exposed PCB into etching line equipment to etch a conductive wire, and completing the manufacturing of the circuit board; according to the invention, the problem of poor corrosion of a gold surface caused by the fact that the gold surface is attacked by residual etching liquid medicine when the LGA gold-plated pattern is used for etching a conductive wire is solved.

The invention belongs to the technical field of LTCC (low temperature co-fired ceramic), and relates to a bondable alloy surface paste for LTCC co-firing and a preparation method thereof, the bondable alloy surface paste comprises the following components in percentage by mass: 75-85% of micron-sized gold powder functional phase, 0.5-2% of inorganic binding phase and 18-20% of organic carrier; the micron-sized gold powder comprises flaky gold powder and spherical gold powder, and the mass ratio of the flaky gold powder to the spherical gold powder is 5: 3. The gold surface slurry can be matched with the commercial high-frequency Ferro A6 raw ceramic; the developed LTCC electronic paste has excellent electrical performance in a millimeter wave frequency band, is excellent in bonding tensile force, and meets the requirement of a 25 [mu] m Au wire greater than or equal to 7gf.

The invention provides a gold wire drawing process. The gold wire drawing process comprises the following steps that S1, gold pretreatment is conducted, specifically, grease, dust and oxide on the surface of gold are removed through ultrasonic cleaning or a neutral solvent; s2, gold fixing and positioning, wherein a gold workpiece is fixed to a special clamp or a beewax rubber plate and positioned; s3, gold coarse wiredrawing operation is conducted, specifically, a diamond wiredrawing needle, a tungsten steel scraper or special abrasive paper is selected for bottoming according to the texture requirement; s4, gold fine wiredrawing operation is conducted, specifically, a diamond wiredrawing needle, a tungsten steel scraper or special abrasive paper is selected for refining according to the texture requirement; s5, gold dust removal, wherein metal chippings are removed through a banister brush or compressed air; s6, gold passivation treatment is conducted, specifically, a nanoscale protection layer is sprayed; and S7, gold local polishing is conducted, specifically, mirror polishing is conducted on the non-wiredrawing area through an agate knife. According to the gold wire drawing process provided by the invention, the texture of each gold workpiece ornament is unique, the wire drawing effect of combining a cat eye with velvet can be realized, and the aesthetic degree of the gold craft ornament is improved.

The utility model discloses a kind of ultra-thin FPC function test fixture, specifically related to FPC test technical field, comprising: lower mould, the lower mould is provided with the placement area matched with FPC appearance on, the edge of the placement area is equipped with multiple positioning pins;Upper mould, the upper mould is located above lower mould;FPC connects flat cable, one end of the FPC connecting flat cable is connected with test mainboard, the other end of the FPC connecting flat cable is equipped with the contact PAD corresponding with FPC gold finger.The utility model is provided with lower mould, upper mould and FPC connecting flat cable, FPC is fixed on lower mould, one end of FPC connecting flat cable is connected with test mainboard, the contact PAD of the other end is contacted with FPC gold finger under the pressing of upper mould, solve the gold surface pressure point problem caused by FPC and fixture direct plug, simultaneously avoid repeatedly plugging connection to cause test mainboard damaged.

The invention discloses a rubber track core gold pretreatment and impregnation integrated process and device, and relates to the technical field of track core gold treatment. In the phosphating pretreatment process, cleaning needs to be carried out again generally after a phosphoric acid solution pool is led out, but in the leading-out process, a large amount of residual solution exists on the surface of core gold, so that the loss of the phosphoric acid solution is increased, and meanwhile, the cleaning difficulty is increased. Through cooperation of a top guide roller and an outer guide roller, when core gold subjected to phosphoric acid treatment is guided and conveyed, the top guide roller is higher than the outer guide roller, so that the core gold obliquely moves upwards, the inclined core gold has a drainage effect in the movement process of the core gold, and the residual phosphoric acid solution rapidly flows downwards along the core gold in cooperation with the gravity of the residual phosphoric acid solution on the surface of the core gold; therefore, the waste of the phosphoric acid solution is avoided, and the cleaning difficulty is reduced.

The present application relates to the field of image processing technology, and specifically to a method and system for visual inspection of appearance defects of IC package carriers, the method comprising: determining the regional characteristic value of each superpixel block in each convex hull, determining the filtering window of each pixel point in the grayscale image of the package carrier, and inspecting the filtered package carrier according to the regional concentration of each superpixel block in each convex hull, the color brightness difference value and the area of ​​all connected domains in each superpixel block in each convex hull. The present application determines the window size of each pixel point on the IC package carrier in the filtering algorithm by analyzing the characteristics of the normal texture area, the oxidation defect area and the noise appearing in the collected image in the gold surface area of ​​the IC package carrier, thereby improving the accuracy of oxidation defect detection in the gold surface area of ​​the IC package carrier.

The present invention provides a process for manufacturing gold micro-bumps with a high aspect ratio and low bonding pressure on a glass adapter plate. The method adopts a double-layer photoresist (cross-linked carbonized thin resist + thick resist) to form an electroplating pattern mask, thereby improving the adhesion of the photoresist without reducing the accuracy of the photoresist pattern, and reducing the problems of floating and debonding of the electroplated gold surface. Flattening and grayscale photolithography etching methods are adopted to prepare a bonding-enhancing microstructure on the surface of the micro-bumps, optimize the micro-bump height consistency and surface contact area, and reduce the bonding pressure requirement and bonding difficulty. Commonly used micro-nano processing technologies are adopted to effectively realize the preparation of micro-bumps required for three-dimensional integrated vertical interconnection of glass-based adapter plates in microwave components.

The invention discloses a preparation method of a ring-pull can cover. The preparation method comprises the steps that an aluminum-containing metal base material is pretreated to obtain a can cover blank, the surface of the can cover blank is coated with water-based epoxy paint to obtain a pre-coated blank, the pre-coated blank is cured, the water-based epoxy paint is cured to form a water-based epoxy paint film, and the ring-pull can cover is obtained. The curing treatment comprises the steps that the pre-coated blank is sequentially subjected to volatilization treatment and cross-linking treatment, the volatilization temperature of the volatilization treatment is T1, the cross-linking temperature of the cross-linking treatment is T2, and T1 < lt >; t1 is larger than or equal to 120 DEG C and smaller than or equal to 180 DEG C, the highest plate temperature of the precoated blank is PMTm, and PMTm is larger than or equal to 220 DEG C and smaller than or equal to 240 DEG C. The paint film on the surface layer of the ring-pull can cover adopts the environment-friendly water-based epoxy coating, the process requirement that the gold surface of the aluminum-containing metal base material is evenly coated with the water-based epoxy coating is met, the painting quality of the can cover of the aluminum alloy ring-pull can is more stable, and the machining process is safer.

The invention relates to the technical field of medical precious metal materials and medical instruments, in particular to a gold surface anticoagulation coating structure and a preparation method and application thereof. According to the method, a micro-nano morphology surface is constructed on the surface of a gold layer through in-situ wet chemical reduction of chloroauric acid, the surface of the micro-nano gold layer is modified through fluoromercaptan, a lubricating agent is injected into the modified micro-nano gold surface, and a lubricating agent injected porous self-lubricating surface (SLIPS) is constructed; the locking capacity of the surface of the nano-gold layer modified by fluoromercaptan to the lubricating layer is remarkably improved, so that the lubricating layer is not prone to loss, and the long-lasting anticoagulation function is achieved. The problems that when a liquid injection surface method is adopted for conducting anticoagulation treatment on the surface of a material, injected lubricating liquid is prone to being exhausted, and the anticoagulation performance durability is poor are solved.

This invention discloses a method for electroplating soft gold onto a circuit board, and also discloses the circuit board. The method includes the following steps: S1: Obtaining a circuit board with a copper layer on its surface; S2: Electroplating a nickel layer on the surface of the copper layer, wherein the surface of the nickel layer has gold bonding lines and non-gold bonding lines; S3: Forming multiple arrayed and spaced bump structures in the gold bonding lines, each bump structure including a nickel substrate and a gold surface layer disposed on the surface of the nickel substrate; S4: Electroplating the circuit board with gold to form a first gold layer on the gold bonding lines and a second gold layer on the non-gold bonding lines, wherein the thickness of the first gold layer is greater than the thickness of the second gold layer. In this way, selective thickening of the gold bonding lines is achieved during the gold plating process, ensuring that the gold bonding lines have a sufficiently thick gold layer to guarantee the reliability of the gold bonding lines, while the non-gold bonding lines maintain a relatively thin gold layer, which can reduce the amount of gold used and lower the production cost of the circuit board.

The invention discloses a flexible circuit double-sided board and a preparation process thereof, and relates to the technical field of flexible circuit boards, the flexible circuit double-sided board comprises a flexible circuit board base material and a covering film covering the surface of the flexible circuit board base material, and the covering film is provided with a window for exposing a copper surface to be subjected to gold immersion. According to the method, the white stains on the gold surface are thoroughly eliminated, the reaction path between the oxidation area of the windowing edge and the golden finger is blocked through the 200-micron copper bars, gold plating abnormity of the oxidation area is concentrated on the copper bars, gold plating on the surface of the golden finger is uniform, and the elimination rate of the white stains reaches 100%; a board grinding process does not need to be newly added, the technical index of'copper surface board grinding forbidding 'of a client is completely met, and potential damage of board grinding to the performance of the circuit board is avoided.

This application relates to the field of flexible printed circuit board (FPC) manufacturing technology, and provides a pre-laser gold plating method for preventing oxidation of the gold surface of FPC connectors after laser processing. The method includes: sequentially performing bonding, encapsulation, lamination, and surface treatment on the flexible circuit board; then applying polyimide reinforcement, followed by a second lamination and surface treatment; printing reinforcement marking lines and text on the flexible circuit board, and after curing; laser-cutting the connector finger positions on the flexible circuit board, with laser cutting only extending to the tips of the connector fingers and both sides of the polyimide reinforcement, controlling the cutout size to avoid affecting subsequent grinding and sandblasting processes; performing a third surface treatment on the laser-cut flexible circuit board, thoroughly removing carbon powder residue generated during laser cutting through sandblasting to prevent carbon powder contamination of the subsequent electroless plating tank; and finally, electroless nickel-gold plating on the surface-treated flexible circuit board to complete subsequent conventional production processes.

The invention relates to the technical field of gold processing, in particular to a gold surface texture processing method which comprises the following steps: preparing processing equipment, a cutter system, a clamp system, a dust collection system, polishing equipment and ultrasonic cleaning equipment, then cleaning the surface of a gold workpiece to ensure that no oil stain and oxide exist, then loading the workpiece into the clamp system and screwing the workpiece, secondly, a three-dimensional model is imported into software, a tool path with the direction perpendicular to the curved surface is generated, cutting parameters are set, machining is started, the tool abrasion condition is monitored in real time, meanwhile, a dust collection system sucks and collects metal powder generated in the carving process, and finally a finished gold workpiece is taken down. The polishing equipment is used for further polishing and grinding the surface of the gold workpiece, and then the ultrasonic cleaning equipment is used for cleaning the gold workpiece, so that the fineness and the machining speed of the texture on the surface of the workpiece are effectively improved, the original texture and glossiness of gold are kept, regional reflection can be formed, and pollution is avoided.

The utility model discloses rubber track core gold surface cleaning and drying integration device. The utility model relates to mechanical engineering technical field, and this device includes the casing, still includes: high pressure gas conveying assembly, the outer wall of gas conveying assembly is connected with the inner wall rotation of casing, the outer wall fixed connection of high pressure gas conveying assembly has cleaning assembly, the inner wall of casing is clamped and has sawtooth doctor, high pressure gas conveying assembly includes high pressure gas pipeline, and the both ends of high pressure gas pipeline are clamped and have the protective cover, the inner wall fixed connection of protective cover has gas inlet pipeline and gas outlet pipeline respectively, the inner wall fixed connection of high pressure gas pipeline has helical guide vane, the inner wall rotation of protective cover is connected with the rotating shaft, the outer wall fixed connection of rotating shaft has turbine blade, realizes cleaning and drying integration design under the action of cleaning assembly and high pressure gas through with high pressure gas pipeline outer wall fixed connection.

This invention discloses a method for detecting the purity of gold, comprising the following steps: creating a detection platform and placing the gold to be tested on the platform; acquiring image information of the gold to be tested; capturing several "impurity units" on the surface of the gold to be tested in the image and locating the "impurity units"; moving the gold to be tested according to the location of the "impurity units" so that the spectrometer can perform multi-point purity measurements on the "impurity units" and calculate the purity of the gold to be tested. Through the above method, during detection, the gold to be tested is placed on the detection platform, 3D image information of the gold to be tested is acquired by a camera, and all "impurity units" in the image information are captured to obtain the position coordinates of each "impurity unit". Based on the coordinates, the gold to be tested is moved so that each "impurity unit" is positioned below the detection end of the spectrometer, thereby enabling the spectrometer to perform precise multi-point measurements on each "impurity unit" and improving the accuracy of gold purity detection.

The invention provides a wafer aging test method, and relates to the technical field of wafer test. The first protective gas is introduced into the aging test cavity of the aging test device, so that air in the aging test cavity can be emptied, and the first protective gas with the temperature higher than the target aging test temperature is continuously blown into the aging test cavity, namely, the surface of the wafer to be tested can be blown; condensation and deposition of pollutants on the surface of the to-be-tested wafer can be avoided under the condition that the to-be-tested wafer cannot be prevented from being in contact with various gaseous pollutants, so that discoloration of the back gold surface of the to-be-tested wafer is greatly reduced.

The invention discloses a multi-layer aluminum core copper-clad plate adopting a plasma oxidation-copper plating process and also discloses a preparation method of the copper-clad plate, and the preparation method comprises the following steps: carrying out plasma anodic oxidation and copper plating treatment on the surface of an aluminum substrate to obtain a copper-clad plasma anodic aluminum oxide substrate; manufacturing an inner-layer circuit pattern on the surface of the copper-clad plasma anodic aluminum oxide substrate, then overlapping the inner-layer circuit pattern with a copper foil and a prepreg, and carrying out vacuum hot-pressing curing to obtain a multi-layer plate blank embedded with an aluminum core; through holes are formed in the multi-layer plate blank, activation and copper plating treatment are carried out, and interlayer electrical interconnection is achieved; and manufacturing an outer-layer circuit pattern on the surface of the multi-layer plate blank, preparing a solder mask layer on the surface of the circuit, and carrying out nickel plating and gold leaching surface treatment to obtain the multi-layer aluminum core copper-clad plate. According to the method, the problems of weak interlayer binding force, low heat dissipation efficiency, insufficient electrical interconnection reliability and the like of the aluminum core multilayer board are solved, and the prepared copper-clad plate can meet the use requirements of high-frequency and high-power electronic equipment.

The present application relates to the technical field of medical noble metal materials and medical devices, and in particular to a gold surface anti-coagulation coating structure, a preparation method and application thereof.The present application uses chloroauric acid to construct a micro-nano morphology surface in situ by wet chemical reduction on the surface of a gold layer, uses fluorothiol to modify the surface of the micro-nano gold layer, and injects a lubricant into the modified micro-nano gold surface to construct a lubricant-injected porous self-lubricating surface (SLIPS).The locking ability of the nano gold layer surface modified by fluorothiol is significantly improved, so that the lubricating layer is not prone to loss, thereby having a long-lasting anti-coagulation function.The present application solves the problem that the injected lubricating liquid is prone to depletion and the anti-coagulation performance has poor durability when a liquid injection surface method is used to perform anti-coagulation treatment on the surface of a material.

The invention discloses a high-heat-resistance organic weldable protective agent and a preparation method thereof, which are used in the technical field of surface treatment process, the high-heat-resistance organic weldable protective agent comprises the following components by mass: 5-10 parts of a composite film-forming agent; 0.1 to 0.5 part of an accelerant; 0.03 to 0.06 part of a homogenizing agent; 0.002 to 0.006 part of an organic solvent; and 0.1-0.3 part of a stabilizer. The obtained film is uniform and transparent, glossy in color, high in weldability, good in heat resistance, free of color change after three times of backflow and good in gold surface compatibility, is particularly suitable for half nickel-gold half OSP products, and is easy to rework. Alcohol and ester imidazole are used, so that a film cannot be formed on a gold surface, and the welding performance cannot be influenced; the accelerant is used for accelerating formation of the film-forming agent on the copper surface, equipment cannot be corroded, and the film coating speed is higher; the homogenizing agent provided by the invention can improve the uniformity of a film layer.

The invention provides a three-dimensional laminated three-dimensional packaging component tin coating device and process method, and the method comprises the steps: obtaining a gold removal surface image of a gold removal pin, determining the gold removal color uniformity and the gold removal flatness so as to determine a gold removal characterization state, and determining whether secondary gold removal is needed or not according to the gold removal characterization state; obtaining a separation blade surface image of the gold-removed tin-coated separation blade and a tin-coated surface image of the tin-coated pin; and determining whether the height of the tinning pin is reduced or not according to the tin liquid area proportion of the surface image of the separation blade, determining a tinning characterization state according to the tinning flatness and the tinning flowing phenomenon of the tinning surface image, and adjusting the temperature of the alloy tin pot according to the tinning characterization state. According to the invention, the problem that the gold-removing and tin-coating quality of the device does not meet the standard requirement because the parameters are not adjusted according to the bottleneck that the gold-removing and tin-coating height of the device pin is difficult to control in the prior art is solved.

The invention belongs to the field of material chemistry and molecular electronics, and discloses a preparation method of a gold nanorod assembly. Comprising the following steps: providing a dispersion system containing a plurality of gold nanorods in a liquid-phase medium; introducing a heterocyclic ring assembly molecule anchored on the surface of the gold nanorod into the dispersion system, wherein the heterocyclic ring assembly molecule comprises an aromatic heterocyclic ring providing structural rigidity, a sulfur-containing anchoring group forming a coordinate bond with the gold surface, and a group or atom capable of forming a hydrogen bond; the gold nanorod assembly comprises at least two gold nanorods and heterocyclic ring assembly molecules located on the gold nanorods respectively, and the two gold nanorods are connected with each other through hydrogen bond supramolecular interaction formed between complementary functional groups of the heterocyclic ring assembly molecules. The preparation of the gold nanorod assembly with high yield and linear orientation is realized by utilizing the heterocyclic ring assembly molecules.

The invention relates to a circuit board manufacturing process capable of avoiding a laser oxidized gold surface, which comprises the following steps: preparing a substrate, pickling, performing laser treatment on an inner ring, roughening and performing electroless gold plating, in the electroless gold plating step, intermediate plates are vertically inserted into a hanging basket and are conveyed along the direction of the plate surface, and vertical electroless gold plating is performed to obtain electroless gold plates, and the spacing distance between the adjacent intermediate plates is not less than 10mm. According to the invention, the inner ring laser step is carried out before the electroless gold step, so that the risk that the electroless gold surface is oxidized under the influence of laser is avoided, and the conductivity of the product is ensured. And the middle plates are inserted into different insertion frame areas at intervals. Even if the middle plates deform, the middle plates cannot be tightly attached to the adjacent middle plates due to the fact that the middle plates are blocked by the Teflon thin wires, it is guaranteed that chemical gold acts on the plate faces of the two middle plates on the side, and the problem that the chemical gold is positively stacked due to the fact that the strength of the laser plate faces is reduced in advance is solved.

The application discloses an ammonium ion sensor and a preparation method thereof, wherein the ammonium ion sensor comprises a substrate, a reference electrode and a working electrode which are arranged on the substrate in a spaced manner; the working electrode comprises a metal electrode layer, a dendritic gold nanomaterial layer, a conductive polymer layer and an ammonium ion selective membrane which are arranged in a stacked manner; the metal electrode layer is arranged in close contact with the substrate; the conductive polymer layer is arranged in close contact with one side of the dendritic gold nanomaterial layer and wraps around the surface of the dendritic gold according to the shape of the dendritic gold. In the application, the conductive polymer layer is conformal with the dendritic gold in the dendritic gold nanomaterial layer, which is beneficial to electron transmission, reduces potential drift, makes the ammonium ion sensor have good performance, has a low detection lower limit and a wide sensing range, realizes sensitive, stable and real-time noninvasive monitoring of different ammonium ion concentrations in various body fluids, does not produce toxic substances during ammonium ion detection and can realize continuous detection of ammonium ions in body fluids.

The application discloses a semiconductor structure, a preparation method and a corresponding chip and product. The structure comprises a silicon-based integrated circuit and a bump structure arranged on the silicon-based integrated circuit. The bump structure comprises, in sequence, a UBM layer, a copper conductor layer, a nickel conductor layer and a gold conductor layer. A metal protective layer composed of palladium, palladium alloy, platinum or platinum alloy is coated on exposed sidewalls of the UBM layer, the copper conductor layer and the nickel conductor layer, and the protective layer does not cover the gold conductor layer. The preparation method forms stepped sidewalls through specific etching steps, and realizes selective self-growth of the protective layer on the titanium / copper / nickel sidewalls by using chemical plating based on the metal equilibrium potential difference, and the gold surface is not deposited. The application effectively solves the problems of poor welding and short circuit caused by oxidation of the copper-nickel-gold bump sidewall and oxides generated by copper diffusion, significantly improves long-term reliability, and is particularly suitable for high-end display fields such as liquid crystal drive chips.

The utility model provides a track core gold surface sand blasting device, and relates to a track core gold production technology. The sand blasting device is used for solving the technical problems that when a sand blasting device provided by an existing patent carries out sand blasting on crawler belt core metal, workers need to frequently carry out feeding and discharging manually, and the speed is low. The crawler belt core gold surface sand blasting device comprises a shell, a spraying pipe is connected and communicated to the shell, a plurality of spraying heads are arranged on the spraying pipe, the shell is installed on a bottom plate, a plurality of supporting legs are installed at the bottom of the bottom plate, and a conveying mechanism used for automatically feeding and discharging materials is arranged on the bottom plate. The mounting plate is pushed through the air cylinder, so that the mounting plate slides on the guide rail in a reciprocating mode through the sliding block, the crawler belt core metal moves to the position below the spraying head, the spraying pipe is connected with an external feeding pipe, sand is sprayed to the crawler belt core metal through the spraying head, the air cylinder retracts and resets after sand blasting is completed, the crawler belt core metal is taken out, and the automatic feeding and discharging effect is achieved.