6 results about "Gold surface" patented technology

The utility model discloses a kind of ultra-thin FPC function test fixture, specifically related to FPC test technical field, comprising: lower mould, the lower mould is provided with the placement area matched with FPC appearance on, the edge of the placement area is equipped with multiple positioning pins;Upper mould, the upper mould is located above lower mould;FPC connects flat cable, one end of the FPC connecting flat cable is connected with test mainboard, the other end of the FPC connecting flat cable is equipped with the contact PAD corresponding with FPC gold finger.The utility model is provided with lower mould, upper mould and FPC connecting flat cable, FPC is fixed on lower mould, one end of FPC connecting flat cable is connected with test mainboard, the contact PAD of the other end is contacted with FPC gold finger under the pressing of upper mould, solve the gold surface pressure point problem caused by FPC and fixture direct plug, simultaneously avoid repeatedly plugging connection to cause test mainboard damaged.

This invention discloses a method for electroplating soft gold onto a circuit board, and also discloses the circuit board. The method includes the following steps: S1: Obtaining a circuit board with a copper layer on its surface; S2: Electroplating a nickel layer on the surface of the copper layer, wherein the surface of the nickel layer has gold bonding lines and non-gold bonding lines; S3: Forming multiple arrayed and spaced bump structures in the gold bonding lines, each bump structure including a nickel substrate and a gold surface layer disposed on the surface of the nickel substrate; S4: Electroplating the circuit board with gold to form a first gold layer on the gold bonding lines and a second gold layer on the non-gold bonding lines, wherein the thickness of the first gold layer is greater than the thickness of the second gold layer. In this way, selective thickening of the gold bonding lines is achieved during the gold plating process, ensuring that the gold bonding lines have a sufficiently thick gold layer to guarantee the reliability of the gold bonding lines, while the non-gold bonding lines maintain a relatively thin gold layer, which can reduce the amount of gold used and lower the production cost of the circuit board.

This application relates to the field of flexible printed circuit board (FPC) manufacturing technology, and provides a pre-laser gold plating method for preventing oxidation of the gold surface of FPC connectors after laser processing. The method includes: sequentially performing bonding, encapsulation, lamination, and surface treatment on the flexible circuit board; then applying polyimide reinforcement, followed by a second lamination and surface treatment; printing reinforcement marking lines and text on the flexible circuit board, and after curing; laser-cutting the connector finger positions on the flexible circuit board, with laser cutting only extending to the tips of the connector fingers and both sides of the polyimide reinforcement, controlling the cutout size to avoid affecting subsequent grinding and sandblasting processes; performing a third surface treatment on the laser-cut flexible circuit board, thoroughly removing carbon powder residue generated during laser cutting through sandblasting to prevent carbon powder contamination of the subsequent electroless plating tank; and finally, electroless nickel-gold plating on the surface-treated flexible circuit board to complete subsequent conventional production processes.

The utility model discloses rubber track core gold surface cleaning and drying integration device. The utility model relates to mechanical engineering technical field, and this device includes the casing, still includes: high pressure gas conveying assembly, the outer wall of gas conveying assembly is connected with the inner wall rotation of casing, the outer wall fixed connection of high pressure gas conveying assembly has cleaning assembly, the inner wall of casing is clamped and has sawtooth doctor, high pressure gas conveying assembly includes high pressure gas pipeline, and the both ends of high pressure gas pipeline are clamped and have the protective cover, the inner wall fixed connection of protective cover has gas inlet pipeline and gas outlet pipeline respectively, the inner wall fixed connection of high pressure gas pipeline has helical guide vane, the inner wall rotation of protective cover is connected with the rotating shaft, the outer wall fixed connection of rotating shaft has turbine blade, realizes cleaning and drying integration design under the action of cleaning assembly and high pressure gas through with high pressure gas pipeline outer wall fixed connection.

The present application discloses a kind of circuit board's scratch-proof electrical measurement method, include: preliminary step, provide a panel, its surface is defined with multiple unit areas, and each described unit area forms a first gold surface;Dry film setting step, a dry film is set on the panel and shields multiple described unit areas;A windowing step, multiple first windows are formed on the dry film, and each described first gold surface is exposed to corresponding described first window;Cutting step, the panel and the dry film are cut along the junction of described unit area, to form multiple circuit boards and multiple sub dry films covered on multiple described circuit boards;Electrical measurement step, each described circuit board is electrically measured by the part of described first gold surface exposed to described first window;And removal step, remove described sub dry film.The present application discloses the scratch-proof electrical measurement method of circuit board can improve the problem that existing circuit board manufacturing method is prone to gold surface scratch in process.

The application belongs to the field of material chemistry and molecular electronics, and discloses a preparation method of gold nanorod assembly. The method comprises the following steps: providing a dispersion system containing a plurality of gold nanorods in a liquid medium; introducing a heterocyclic assembly molecule anchored on the surface of the gold nanorod into the dispersion system, wherein the heterocyclic assembly molecule contains a structural rigid aromatic heterocycle, a sulfur-containing anchoring group forming a coordination bond with the gold surface, and a group or atom capable of forming a hydrogen bond; the gold nanorod assembly contains at least two gold nanorods and the heterocyclic assembly molecule on each gold nanorod, and the two gold nanorods are connected by the hydrogen bond supramolecular interaction between the complementary functional groups of the heterocyclic assembly molecules. The preparation of the gold nanorod assembly with high yield and linear orientation is realized by using the heterocyclic assembly molecule.