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301 results about "Gold surface" patented technology

Method for preparing surface enhanced Raman substrate

The invention provides a method for preparing surface enhanced Raman substrate, and relates to Raman spectrums. The method comprises the steps that a seed crystal growing method is used for synthetizing a gold nanorod solution, wherein gold nano seeds are synthetized first, then a growing solution is added, silver nitrate is used for adjusting the slenderness ratio of gold nanorods until reaction is completed, the needed gold nanorod solution is obtained, then centrifuging is conducted to remove supernatant liquor, signal molecules are added to be connected to a gold surface, then a polyethylene glycol dressing agent is added to induce the gold nanorods to conduct self-assembling, then a processed nano particle solution is stirred, a TEOS methanol solution is added for reacting, silicon dioxide layers are wrapped on the surfaces of the self-assembled gold nanorods, and the surface enhanced Raman substrate is obtained. Detecting can be directly conducted in the solution, due to self-assembling and the coupling effect of plasma on the surfaces of adjacent nano particles, the electromagnetic field between the nano particles is obviously enhanced, the Raman signals at the position are amplified in a quantity level mode, accordingly, the detecting sensitivity of surface enhanced Raman is greatly improved, and the stability is high.
Owner:XIAMEN UNIV

Manufacturing method of PCB integrated with multiple surface processing

The invention relates to the field of a PCB production and manufacturing technology, and specifically relates to a manufacturing method of a PCB integrated with multiple surface processing. Through adjusting the production process of the PCB, electroplating thick gold surface processing which is conventionally carried out only after a solder mask is manufactured is performed in advance before an external-layer line is prepared, corresponding technical parameters are adjusted, the problem of mutual interference of three surface processing is effectively avoided, and three surface processing modes are realized in the same PCB. According to the invention, through adjusting a process sequence and the technical parameters, when antioxidation surface processing is carried out, the gold layer at an electroplating gold position and a nickel gold immersion position is not oxidized and an organic membrane is not formed, such that the effects of various surface processing are ensured. When the external-layer line is prepared, a volcanic ash grinding plate is employed, the bonding force applied to a dry membrane and a plate surface in a positive process can be increased, and the electroplating gold position is prevented from being plated with copper during pattern electroplating.
Owner:JIANGMEN SUNTAK CIRCUIT TECH

Selective nickel and gold plating method, PCB and device

The invention discloses a selective nickel and gold plating method comprising the steps that a first dry film is covered on the surface of a copper layer of a PCB, and a area requiring nickel and gold plating is exposed out of the surface of the copper layer of the PBC via exposure and development; micro-etching and copper reduction are performed on the copper layer of the area requiring nickel and gold plating; and then nickel and gold are plated on the copper layer of the area requiring nickel and gold plating, then the first dry film is removed, and a required line is manufactured on the copper layer of the PCB. According to the method, nickel and gold are firstly plated on the surface of the copper layer of the PCB, and then the line is manufactured so that a lead wire for plating does not need to be manufactured in the overall implement process, and a problem of difficulty in nickel and gold plating on the PCB caused by the fact that the lead wire for plating cannot be manufactured on the PCB is solved. Besides, micro-etching and copper reduction are performed on the copper layer of the area requiring nickel and gold plating so that height difference between the nickel and gold surface of the nickel and gold area and the surface of the line without nickel and gold plating is reduced, and thus combination force of the dry film and the surface of the PCB in the subsequent dry film covering technology is enhanced.
Owner:SHENNAN CIRCUITS

Novel chemical nickel gold production process and chemical nickel plating liquid

The invention discloses a PCB or package substrate chemical nickel gold production new process. The new process comprises the steps of chemical gold pretreatment, deoiling, micro-etching, activation,alkaline chemical nickel, nickel activation, acid chemical nickel, chemical gold, gold surface hole sealing and chemical gold aftertreatment. The invention further provides novel chemical nickel plating liquid. The process is low in nickel cylinder temperature and high in chemical nickel deposition speed; nickel simple substances are difficultly separated out from the wall of a chemical nickel plating liquid stabilizing tank; the horizontal production of chemical nickel gold can be realized; a production line is shortened; the emission of waste water is reduced; and the comprehensive production cost of the production line is reduced. In the novel chemical nickel plating liquid, through adjustment of types of complexing agents and stabilizing agents in the chemical nickel plating liquid, even if under the conditions of higher PH and higher deposition speed, higher P content is achieved to meet various performance requirements of existing chemical nickel gold for the surface treatment ofPCBs and package substrates.
Owner:湖南互连微电子材料有限公司

Manufacturing method of matted gold line of circuit board

The invention discloses a manufacturing method of a matted gold line of a circuit board, and belongs to the field of production and manufacturing of the circuit board. The manufacturing method sequentially comprises the following steps: whole board electroplating, surface super-roughening, external line pattern transferring, pattern nickel electroplating, pattern gold electroplating and etching; the step of whole board electroplating is carried out until copper thickness is 3-5microns more than a required thickness; the step of surface super-roughening is carried out by micro-etching a copper layer surface of the circuit board so as to control micro-etching thickness within 0.75 plus/minus 0.25microns; after micro-etching, roughness parameter values of the copper surface are as follows: Ra is 0.3-0.5microns and Rz is 3.0-4.0microns. Through the manufacturing method disclosed by the invention, the circuit board with the matted gold line is researched and developed; the copper surface is roughened by virtue of a super-roughening process and then nickel and gold are electrically matted on the copper surface, therefore through the roughened copper surface and the matted nickel, a gold surface is rougher than a normal gold-electroplated gold surface, so as to achieve required color of matted gold; meanwhile, by roughening the copper surface through the super-roughening process, surface roughness is increased, binding force between the gold surface and the surface layer is enhanced, defects such as plating permeation in the gold electroplating process are overcome, and the reliability of a product is improved.
Owner:JIANGMEN SUNTAK CIRCUIT TECH

Circuit board production method using immersion gold and electrolytic gold plating combined surface treatment

The invention discloses a circuit board production method using immersion gold and electrolytic gold plating combined surface treatment. A substrate is drilled and then subjected to electroless copper deposition panel plating; then the whole copper layer is thickened by pattern plating; then an anti-immersion gold dry film is printed; after exposure and development of the film, a circuit pattern with copper exposed in an open window is formed; immersion gold plating is carried out and the film is stripped off; then an anti-immersion gold dry film is printed; after exposure and development of the film, electrolytic gold plating is carried out and the film is stripped off; the circuit board is subjected to etching, and the exposed copper surface is etched off; an in-process inspection is carried out; solder masking ink is printed and follow-up processes are carried out. The method substantially simplifies the technique and solves the problems of gold infiltration and low consumed time in the prior art. The entire production process has only one etching, so that the entire substrate has the conductive copper surface to complete the electrolytic copper plating before the electrolytic copper plating, thereby reducing the process and improving the quality and production efficiency. According to the invention, the circuit pattern is produced at the same time as an immersion gold surface treatment area, and surface treatment is completed before silk screen and solder masking, so that the process is reduced, the time is saved and the production efficiency of the circuit board is improved.
Owner:广东依顿电子科技股份有限公司

Machining method and device for gold and platinum jewelry and combined type jewelry structure

The invention discloses a machining method and device for a gold and platinum jewelry and a combined type jewelry structure. The machining method for the gold and platinum jewelry includes the following steps: (1) platinum materials are adopted, and a jewelry body is molded through a die or machined through cutting according to a model of the jewelry; (2) at least one groove is machined in the surface of the jewelry body; (3) gold materials are melted at a high temperature into the grooves of the jewelry body; (4) surface polishing is carried out, wherein the surface of the gold and the surface of the platinum are polished; (5) electrolysis and gold plating are carried out on the surface of the jewelry, wherein the surface of the gold is coated with oil firstly, and secondly electrolysis and gold plating are carried out after air drying is carried out; and (6) polishing processing is carried out. According to the machining method, a gold wire rod is heated at a high temperature through a heating gun to be directly melted into the grooves of the jewelry body; as local heating melting is carried out, the production efficiency for melting the gold wire rod and the jewelry body together can be improved, and the production cost can be saved; when heating is carried out, as borax water is contained in the grooves, the effect of removing impurities can be achieved, and the melting intensity can improved.
Owner:SHENZHEN BOFOOK JEWELRY

Spectroscopic residue detection system and method

A spectroscopic detection system and method for quantitative measurements of non-volatile residues. A sample to be analyzed is spread out on the inside surface of a cup portion of a unique detector cup. The cup portion mates with a detector portion to create an enclosed reflecting volume. A small port in the detector portion permits entrance of light which diffusely reflects multiple times from the inside surface of the enclosed reflecting volume and which is partially absorbed by the sample depending on the spectral absorption characteristics of the sample. A light detector in the detector portion detects light after multiple reflections from the surfaces of the detector and cup portions and multiple passes through the sample on the surface of the cup portion. Light detected by the light detector is spectrally analyzed to determine the spectral characteristics of the sample. In a preferred embodiment of the present invention the light is infrared light, the diffusely reflecting volume is a sphere, the reflecting surface of the cup is a smooth hemispheric gold surface and the reflecting surface of the detector portion is a rough hemispheric gold surface. In this preferred embodiment light from a broad band infrared light source is directed through an interferometer system prior to entering the detector cup and signals from the light detector are Fourier analyzed along with mirror position data to determine absorption characteristics of the sample.
Owner:SURFACE OPTICS

Nano gold doped integral material for enriching glycoprotein and applications thereof

The invention relates to a preparation method of a nano gold doped integral material for enriching glycoprotein. The preparation method comprises the following steps: taking glycidyl methacrylate (GMA) and polyethylene glycol diacrylate (PEGDA) as the monomers to synthesize a hydrophilic polymer integral material substrate through an in-situ polymerization method; utilizing the epoxy groups in the substrate surface to enrich the substrate surface with mercapto groups through a chemical derivatization method, then modifying the substrate surface with nano gold particles; finally co-modifying 4-mercaptophenylboronic acid and mercaptoethylamine on the nano gold surfaces on the substrate, and enriching glycoprotein on the basis of phenylboronic acid affinity chromatography. The hydrophilicity of the monomer polyethylene glycol diacrylate (PEGDA) is utilized so as to reduce the non-specific adsorption of substrate on proteins, and thus the enrichment selectivity is improved. At the same time, the high specific surface area of nano particles is utilized at the same time, thus the enrichment capacity is increased, and finally the high-efficient and high-selective enrichment of glycoprotein is achieved.
Owner:DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI

Biological two-parameter sensor based on photonic crystal fiber

The invention discloses a biological two-parameter sensor based on a photonic crystal fiber. The biological two-parameter sensor comprises a D type photonic crystal fiber and single mode fibers, wherein the single mode fibers are in fusion welding at the two ends of the D type photonic crystal fiber. The D type photonic crystal fiber comprises a photonic crystal fiber; one side of the photonic crystal fiber is a polishing and grounding surface; a metal layer is plated on the polishing and grinding surface; a plurality of air holes are formed in the photonic crystal fiber; the air holes penetrate through two end surfaces of the photonic crystal fiber; and any one air hole is filled with a temperature-sensitive medium. The film plating gold surface plasma resonance effect is used as a refractive index sensing mechanism; the directional coupling effect and the temperature-sensitive effect of the D type photonic crystal fiber are used as temperature sensing mechanisms; two mutually separated resonance loss peaks are generated in a fiber output spectrum; and the high-sensitivity two-parameter sensing of the concentration and the temperature of biological liquid to be tested is realized.The sensor has higher sensitivity by optimizing the air hole layer number and hole diameter of the photonic crystal fiber and the film plating gold thickness.
Owner:NANJING UNIV OF POSTS & TELECOMM

Method for measuring confirmations of sulphydryl-modified linear DNA (deoxyribonucleic acid) or nucleic acid aptamer on nano-gold surface

The invention relates to a method for measuring confirmations of a sulphydryl-modified linear DNA (deoxyribonucleic acid) or nucleic acid aptamer on a nano-gold surface. The method comprises the following steps of measuring the hydrate particle size of a linear DNA or nucleic acid aptamer and a nano-gold composite in the assembling process in a dynamic light scattering way, and measuring the confirmations of the linear DNA or nucleic acid aptamer on the nano-gold surface under different surface coating amounts by combining adsorption kinetics respectively. According to the method, under the condition of medium surface probe capacity, one end, connected with a sulphydryl, of the confirmation of the linear DNA on the nano-gold surface winds the nano-gold surface, and the other end of the confirmation of the linear DNA outwards extends perpendicularly to the surface; along with the increase of the surface probe capacity, the length of each DNA probe winding the nano-gold surface is continuously decreased, the outwards-extending tail of each DNA probe becomes longer and longer, and however, the nano-gold surface is kept in a DNA basic group adsorbed-wrapped low-surface free energy state; the confirmations can be described as DILOT (dynamic inner-layer and outer-tail) models significant on guiding the applications of nucleic acid sensor probe designs, DNA-hybridization-based nano-assembling and the like.
Owner:CAPITAL NORMAL UNIVERSITY
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