13 results about "Nickel deposition" patented technology

The invention relates to the technical field of etching waste liquid treatment, and provides a nickel-containing etching waste liquid treatment method which comprises the following steps: 1, neutralizing and extracting copper; step 2, nickel deposition; step 3, evaporative crystallization; wherein the step I specifically comprises the following steps: slowly adding sodium bicarbonate into the nickel-containing waste liquid, stirring to adjust the pH value of the waste liquid to weak acidity, preferentially forming a basic cupric carbonate Cu2 (OH) 2CO3 precipitate when Cu < 2 + > is within the pH value range, and stably remaining Ni < 2 + > in the solution, and carrying out operations such as filtering separation and the like; and the step 2 specifically comprises the treatment of adding sodium hydroxide into the nickel-containing filtrate from which most of copper is removed to adjust the pH value to be neutral and the like. According to the technical scheme, the problems that according to an existing nickel-containing etching waste liquid treatment method, the harmless treatment effect is achieved in a chemical precipitation mode, the main purpose is to stabilize solid nickel, although the emission requirement is met, the waste liquid still contains copper, soluble salt and other components, and huge resource waste is caused by direct emission are solved.

The application relates to a high-radiation shielding particle material and a preparation method thereof, and belongs to the technical field of shielding materials. The application aims to solve the problems that the existing radiation shielding materials cannot have the shielding performance of gamma rays, good flexibility and convenient construction performance and the like, and the particle material is composed of glass microspheres, a chemical nickel plating layer, an electroplated lead layer, an electroplated tungsten layer and an electroplated tantalum layer. The thickness of each layer is controlled to be 20 mu m. The method is that nickel is deposited on the surface of the glass microspheres by a chemical nickel plating method, and then an electroplated lead layer, an electroplated tungsten layer and an electroplated tantalum layer are sequentially deposited by an electroplating method. The glass microspheres are pretreated, and nickel is deposited on the surface of the glass microspheres by a chemical nickel plating method, so that other electroplated layers can be more easily deposited on the surface; the electroplated lead layer and the electroplated tungsten layer have the characteristics of good combined shielding performance of gamma rays and neutrons; and the metal tantalum layer has good gamma ray shielding performance and excellent mechanical performance.

The invention discloses an electromagnetic double-gradient composite material containing Ni and CFC and a preparation method and application thereof, and relates to the technical field of electromagnetic shielding materials. The preparation method comprises the following steps: (1) cutting carbon fiber cloth into small blocks, polishing carbon fibers through abrasive paper, immersing a sample into a sensitizing solution at room temperature for 15 minutes, and soaking the sample into an activating solution for 90 seconds; a sensitizer used in the chemical nickel plating process comprises nickel sulfate hexahydrate and diluted hydrochloric acid; and (2) ammonia water is added to adjust the pH of the chemical nickel plating solution, chemical nickel plating treatment is carried out at the temperature of 60 DEG C, nickel deposition is carried out for 1-4 times and 20 min each time, after the reaction is completed, deionized water is used for washing for 2 min, then pressing is carried out for 48 h, and finally drying is carried out in a drying oven, so that the electromagnetic double-gradient composite material is obtained. By depositing Ni on the CFC substrate, the dielectric loss, magnetic loss and heterogeneous interface loss performances are remarkably improved.

The invention relates to the technical field of wire cutting, in particular to a carborundum composite nickel deposition process and a diamond wire, and the carborundum composite nickel deposition process comprises the steps of bus cleaning, bus pretreatment, bus pre-nickel plating, bus sanding, secondary nickel plating, cleaning, heat treatment and the like. Ultrasonic powder in the electroplating liquid can be uniformly dispersed in the suspension liquid through ultrasonic oscillation, and then the ultrasonic powder is deposited on the bus along with metal ions. High-frequency mechanical waves generated by ultrasonic oscillation can enable particles and bubbles in the liquid to generate violent mechanical oscillation, so that the effects of stirring, dispersing and mixing are achieved; in the carborundum deposition process, carborundum powder can make full contact with the bus through ultrasonic waves, and meanwhile diffusion of metal ions in electrolyte and uniformity of metal deposition are promoted.

The invention discloses a substrate pretreatment process applied to an integrated electrode material, and belongs to the technical field of electrode material preparation. The process sequentially comprises the steps of substrate pretreatment, micro-etching, rough nickel deposition and embroidered ball array skeleton electrodeposition, and a micron-sized rough structure is constructed on the surface of a nickel-based porous substrate through micro-etching so as to provide more nucleation sites; on the basis that rough nickel is deposited on the rough surface of a base body, a compact amorphous metal nickel transition layer is formed, strong mechanical interlocking with the base body is achieved, and high corrosion resistance and high conductivity are achieved; and finally, growing a vertically-oriented nanowire array framework on the metal nickel transition layer by utilizing electro-deposition. Through the synergistic effect of micro-etching, rough nickel deposition and electro-deposition, a complete, stable and efficient three-dimensional conductive carrier from a macroscopic matrix to a microcosmic active skeleton is finally constructed, and the binding force between the integrated electrode material and the matrix, the interface stability and the mass transfer capacity are fundamentally improved.

The application discloses a wiring terminal and a preparation method thereof. The wiring terminal comprises a wiring terminal body and a composite layer. The composite layer comprises, from inside to outside, a copper deposition layer connected to the surface of the wiring terminal body, a tin deposition layer arranged on the surface of the copper deposition layer, and a nickel deposition layer arranged on the surface of the tin deposition layer. The copper deposition layer connected to the surface of the wiring terminal body, the tin deposition layer arranged on the surface of the copper deposition layer, and the nickel deposition layer arranged on the surface of the tin deposition layer can effectively absorb interface thermal stress and eliminate micro-pores, thereby significantly improving the corrosion resistance and fatigue fracture resistance of the wiring terminal under high-low temperature impact, high-frequency micro-motion and salt spray environment.

The application relates to the technical field of electro-catalysis, and particularly relates to a nickel-based electrode, a preparation method and application. In view of the technical problems of uneven coverage of a deposition layer, large interface resistance and large UOR output performance fluctuation caused by unreasonable selection of process parameters of the nickel-based electrode electrodeposition, the application provides a preparation method of a nickel-based electrode, which comprises the following steps: taking foamed nickel as a conductive substrate, performing surface pretreatment on the foamed nickel to remove the surface oxide layer and internal impurities of the foamed nickel; preparing an electroplating solution, the electroplating solution being a nickel nitrate hexahydrate aqueous solution, and the concentration of the electroplating solution being 0.10 M; taking the pretreated foamed nickel substrate as a working electrode, and placing the working electrode in the electroplating solution to perform direct current electrodeposition, wherein the direct current voltage applied during the electrodeposition is-1.15 V, and the electrodeposition time is 400 s, so as to form a nickel deposition layer on the surface of the foamed nickel substrate; taking out the electrode after the electrodeposition, cleaning and drying the electrode to obtain the nickel-based electrode. The application improves the UOR current output and operation stability.

The invention provides an electrodeposited nickel anode and a preparation method thereof. The anode comprises a substrate, and a SnOx intermediate layer and a PbO2 active layer which are sequentially laminated on the surface of the substrate. The anode of the electrodeposited nickel provided by the invention comprises a SnOx intermediate layer and a PbO2 active layer which are sequentially laminated on the surface of a substrate, wherein the SnOx intermediate layer has relatively high conductivity and corrosion resistance and can enhance the conductivity and corrosion resistance of the anode, the PbO2 active layer has relatively high catalytic activity, and the synergistic effect of the SnOx intermediate layer and the PbO2 active layer effectively reduces the oxygen evolution potential of the anode and prolongs the service life of the anode; and meanwhile, the anode does not contain expensive noble metal, so that the preparation cost is relatively low.

The present application belongs to the field of heavy metal wastewater resource treatment, and relates to a real-time regulation system for electrodepositing and recovering metal nickel from nickel-containing wastewater concentrate liquid, characterized in that the real-time regulation system comprises an electrochemical analysis unit, a software analysis unit, an intelligent decision unit and a regulation execution unit; the electrochemical analysis unit comprises an online water quality analysis module and an electrochemical analysis module, the electrochemical analysis module is used for measuring a parameter curve of a cathode electrodeposition process, the online water quality analysis module is used for acquiring parameter data of the nickel wastewater concentrate liquid, and the software analysis unit is used for acquiring key electrochemical parameters in real time and analyzing current efficiency, nickel deposition efficiency and a change trend of the electrodepositing of the nickel wastewater concentrate liquid. The current efficiency of the electrodepositing of the nickel wastewater concentrate liquid can be improved, and the operation cost of the electrodepositing of the nickel-containing wastewater concentrate liquid can be reduced.

[Problem] To provide a surface-treated copper foil which comprises a heat-resistant treated layer and a chromate-treated layer and does not comprise a roughening-treated layer. The surface-treated copper foil is suitable for a copper-clad laminated plate to be used for a printed wiring board compatible with high-speed transmission, because said surface-treated copper foil exhibits excellent heat resistance and rust prevention, and because the conductor loss due to different kinds of metals is small due to having a small adhesion amount of nickel and chromium on the treated surface and the conductor loss caused by roughening particles does not occur due to having low roughness. [Solution] A surface-treated copper foil wherein: the arithmetic average height Sa of the surface of an untreated copper foil is less than 0.27 μm; the developed interfacial area ratio Sdr is less than 6%; when the surface area ratio calculated from the Sdr is defined as A, and the nickel adhesion amount (mg) per two-dimensional area of 1 m2 of the treated surface of the surface-treated copper foil is defined as B, the nickel adhesion amount [B / A] per surface area of 1 m2 is 5-31 mg; and when the chromium adhesion amount (mg) per two-dimensional area of 1 m2 of the treated surface of the surface-treated copper foil is defined as C, the chromium adhesion amount [C / A] per surface area of 1 m2 is 1-4 mg.

The application discloses a coating preparation method for enhancing the interface bonding force of nickel / nickel-based superalloy, adopts double-layer glow plasma surface metallurgy technology, takes pure nickel as a target material, controls the surface temperature of the nickel-based superalloy workpiece and grows the coating through two-step regulation, the first step is to form the Ni-Fe-Cr interdiffusion layer interface with the micron-sized pinning structure, and the second step is to form the nickel deposition layer with the columnar crystal structure, so that the coating with high interface bonding strength is obtained. The application utilizes the high interface compatibility of the nickel layer and the nickel-based superalloy, the coating structure is composed of the interface pinning and the columnar crystal of the pure nickel layer, the single interface pin size is 20-50 microns and is embedded into the base material, the pure nickel layer is the columnar crystal structure, and the bonding strength of the coating and the base interface is improved. In the 800 DEG C thermal shock experiment, the thermal shock resistance times of the coating are greater than 200 times, the coating bonding force is higher than 70 N through the scratch test, and the mechanical properties are excellent.

The present application relates to the advanced material technology field of integrated circuit packaging COF technology, and in particular to a method for inhibiting the chemical nickel plating and plating leakage of ultra-fine lines of a flexible substrate of an integrated circuit package and application. The method, through the systematic synergistic effect of pre-activation pre-dipping treatment, activation treatment and post-dipping treatment, can promote the uniformity of line activation, can control the deposition rate of nickel plating around the line, can improve the plating and plating leakage phenomenon caused by the uneven palladium adsorption amount on both sides of the line, can reduce the nickel plating deposition between fine lines, and can avoid the nickel bridging problem of fine lines caused by the excessive activity of palladium or the palladium residue between fine lines. The method has the characteristics of simple process, simple operation, low production cost and being suitable for large-scale production, and can be well applied to the chemical nickel plating process of the ultra-fine lines of the flexible substrate containing line width and line spacing below 12 microns and line width greater than 50 microns.

The nickel deposition prevention structure comprises a flow guide base at the bottom of the electroplating bath and a deposition prevention assembly in the middle of the electroplating bath, and spoilers are arranged on the two sides in the electroplating bath. The anti-deposition assembly comprises a deposition plate with a protective plate, lifting is achieved through a threaded lead screw and a driving motor, and a movable groove accommodates and fixes a threaded sleeve and the threaded lead screw; two sides of the top of the deposition plate are inclined planes and provided with filtrate holes to form a flow guide and filtration dual mode, a triangular flow guide block of a flow guide base divides fluid at the bottom of the groove into three channels, and the spoiler adjusts the angle through a spoiler motor and cooperates with a spoiler hole to generate turbulent flow; according to the structure, a nickel layer is stripped through dynamic lifting, fluid distribution is optimized, ion enrichment and vortex dead angles are reduced, and the uniformity of a plating layer is improved.