Chemical nickel deposition solution

A technology for electroless nickel precipitation and nickel sulfamate, which is applied in the field of chemical nickel precipitation solution, can solve the problems of high energy consumption for maintaining the bath temperature, short service life of the solution, high energy consumption for heating and heating, etc. Liquid stability and strong corrosion resistance

Inactive Publication Date: 2012-04-04
GUANGDONG TONESET SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are the following disadvantages in the process: 1. The heating energy consumption is large, and the energy consumption of maintaining the tank temperature is also large; 2. The nickel immersion liquid evaporates quickly, and the nickel immersion liquid needs frequent maintenance; 4. The higher the temperature, the greater the reaction rate of phosphite in the solution, and the shorter the service life of the solution

Method used

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  • Chemical nickel deposition solution
  • Chemical nickel deposition solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] Chemical nickel deposition solution 1, the components and dosage are:

[0055] Nickel sulfamate 36g / L

[0056] Citric acid 9g / L

[0057] Succinic acid 17g / L

[0058] Sodium hypophosphite 20g / L

[0059] Sodium acetate 20g / L

[0060] Propoxy acid 18g / L

[0061] Sodium Lauryl Sulfate 0.03g / L

[0062] L-Threonine 0.15g / L

[0063] Deionized water balance

[0064] pH=5.7

[0065] Use this nickel deposition solution to deposit on the above object c). The temperature is 55°C. Sink for 20 minutes. The nickel layer is smooth. The thickness is 43 micro inches. The phosphorus content is 7.9%.

Embodiment 2

[0067] Chemical nickel deposition solution 2, the components and dosage are:

[0068] Nickel sulfamate 36g / L

[0069] Citric acid 9g / L

[0070] Succinic acid 17g / L

[0071]Sodium hypophosphite 20g / L

[0072] Sodium acetate 20g / L

[0073] Propoxy acid 18g / L

[0074] Sodium Lauryl Sulfate 0.03g / L

[0075] L-Threonine 0.15g / L

[0076] Deionized water balance

[0077] pH=5.7

[0078] Use this nickel precipitation solution to implement on the above-mentioned object a). The temperature is 55°C. Sink for 20 minutes. The nickel layer is smooth. The thickness is 40 micro inches. The phosphorus content is 8.3%.

Embodiment 3

[0080] Chemical nickel deposition solution 3, the components and dosage are:

[0081] Nickel sulfamate 40g / L

[0082] Citric acid 13g / L

[0083] Succinic acid 18g / L

[0084] Sodium hypophosphite 22g / L

[0085] Sodium acetate 20g / L

[0086] Propionic acid 18gL

[0087] Sodium Lauryl Sulfate 0.03g / L

[0088] L-Threonine 0.20g / L

[0089] Deionized water balance

[0090] pH=5.5

[0091] Use this nickel precipitation solution to implement on the above-mentioned object a). Temperature 60°C. Sink for 20 minutes. The nickel layer is smooth. The thickness is 58 micro inches. The phosphorus content is 8.2%.

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PUM

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Abstract

The invention relates to a chemical nickel deposition solution applied in the manufacturing industry of printed circuit boards. The chemical nickel deposition solution comprises the following components: (1) 30 to 45 g / L of nickel aminosulfonate, (2) 64 to 75 g / L of composite complexing agent, (3) 18 to 25 g / L of sodium hypophosphite, (4) 0.01 to 0.03 g / L of wetting agent, and (5) the balance of deionized water. Nickel ions are provided by the nickel aminosulfonate and used together with the composite complexing agent, and chemical nickel deposition can be performed at the temperature between 55 and 75 DEG C under the pH value between 5.5 and 6.0. The chemical nickel deposition solution can be implemented at a low temperature; the nickel deposition solution is weakly acidic, energy-saving and environment-friendly; the nickel layer is bright and clean; and the nickel deposition solution is strong in corrosion resistance, good in weldability and stable.

Description

technical field [0001] The invention relates to a chemical nickel deposition solution, in particular to a weakly acidic chemical nickel deposition solution using nickel sulfamate as a nickel source. Background technique [0002] Compared with electroplating nickel, the biggest advantages of electroless nickel deposition are: 1. No need to consider the current distribution on the plated parts, and the thickness of the deposited nickel is uniform; 2. The nickel layer is amorphous and has strong corrosion resistance. Therefore, this chemical nickel deposition method has a wide range of uses in the fields of electronics, computers, aerospace, petrochemical, textiles, etc., especially in the printed circuit board manufacturing industry, which is an indispensable production link at present. [0003] The current acidic chemical nickel deposition process must be carried out at a temperature above 80°C, and a brightening agent can be added to obtain a bright and clean appearance. Th...

Claims

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Application Information

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IPC IPC(8): C23C18/36
Inventor 方北龙刘彬云王植材陈光辉黄辉祥
Owner GUANGDONG TONESET SCI & TECH
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