The invention discloses a surface treatment method of a circuit board. The method comprises a cleaning step of cleaning the surface of the circuit board; an activation step:
coating a catalyst on the surface of the circuit board to form a catalyst layer; a
nickel plating step: immersing the circuit board into a
nickel plating liquid
medicine, and replacing the catalyst layer with a
nickel layer; a
gold leaching step of forming a thin
gold layer on the nickel layer; the nickel plating liquid
medicine comprises a nickel source agent, a
reducing agent, a stabilizer and an
accelerant, and based on 100 vol% of the nickel plating liquid
medicine, the nickel plating liquid medicine comprises 3-7 vol% of the nickel source agent, 0.5-3 vol% of the
reducing agent, 0.5-0.77 vol% of the stabilizer and 0.1-1 vol% of the
accelerant. The nickel source comprises nickel
sulfate, the
reducing agent comprises
sodium hypophosphite, and the accelerator comprises
sodium sulfate. Therefore, according to the surface treatment method disclosed by the invention, through proportional configuration of the nickel plating liquid medicine, the
deposition rate and uniformity of the nickel layer are effectively controlled, generation of defects on the surface of the nickel layer is inhibited, the problem of black nickel is reduced, and the conductive stability and reliability of the whole circuit board are improved.