Middle-temperature acidic electroless nickel plating-phosphor alloy formula

An electroless nickel plating and formula technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of pores or even grain boundaries, poor stability of alkaline solution, large crystallite size, etc., to achieve Improved stability, good bonding, and obvious acceleration effects

Inactive Publication Date: 2009-01-21
NANCHANG HANGKONG UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the stability of the alkaline solution is poor, and maintenance is difficult, and the microscopic result of the alkaline electroless nickel plating layer is flaky, the crystallite size is large, and pores or even grain boundaries may occur b...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] 1. The basic plating solution formula is:

[0018] Nickel sulfate 25g / L, sodium hypophosphite 30g / L, sodium acetate 15g / L, thiourea 1.1mg / L, lactic acid 11ml / L, glacial acetic acid 9ml / L, succinic acid 5g / L, potassium iodate 6mg / L, loading capacity 0.9dm 2 / L,

[0019] 2. The additive formula for the periodic experiment is:

[0020] The addition formula of the periodic experiment is based on the above-mentioned plating solution formula. The other operating conditions are that the weight ratio of the reducing agent and the main salt is 1.2. The nickel ion concentration of the plating solution is measured every 60 minutes and the nickel ion consumption is determined. Add the concentrated liquid in a certain amount, the adding ratio is 12% of the opening liquid, the plating temperature is 75 ℃, and the pH value is 5.0.

[0021] 3. Preparation of plating solution

[0022] (1) Weigh out the calculated amounts of various drugs according to the volume of the plating solution;

[...

Embodiment 2

[0032] 1. The basic plating solution formula is:

[0033] Nickel sulfate 28g / L, sodium hypophosphite 32g / L, sodium acetate 18g / L, thiourea 0.8mg / L, lactic acid 10ml / L, glacial acetic acid 10ml / L, malic acid 8g / L, potassium iodide 10mg / L, loading 1.0dm 2 / L,

[0034] 2. The additive formula for the periodic experiment is:

[0035] The additive formula of the periodic experiment is the above-mentioned plating solution formula, and the other operating conditions are that the addition ratio of the reducing agent to the main salt is 1.2 (weight ratio); the nickel ion concentration of the plating solution is measured every 60 minutes and the nickel ion Concentrated liquid is added to the consumption amount of the liquid, the addition ratio is 15% of the opening liquid, the plating temperature is 72 ℃, and the pH value is 4.8.

[0036] 3. Preparation of plating solution

[0037] (1) Weigh out the calculated amounts of various drugs according to the volume of the plating solution;

[0038...

Embodiment 3

[0047] 1. The basic plating solution formula is:

[0048] Nickel sulfate 26g / L, sodium hypophosphite 30g / L, sodium acetate 12g / L, thiourea 1.2mg / L, lactic acid 13ml / L, glacial acetic acid 13ml / L, citric acid 10g / L, potassium iodide 8mg / L, loading 1.3dm 2 / L,

[0049] 2. The additive formula for the periodic experiment is:

[0050] The additive formula of the periodic experiment is the above-mentioned plating solution formula, and the other operating conditions are that the addition ratio of the reducing agent to the main salt is 1.2 (weight ratio); the nickel ion concentration of the plating solution is measured every 60 minutes and the nickel ion Concentrated liquid is added to the consumption, the addition ratio is 10% of the opening liquid, the plating temperature is 75 ℃, and the pH value is 5.2.

[0051] 3. Preparation of plating solution

[0052] (1) Weigh out the calculated amounts of various drugs according to the volume of the plating solution;

[0053](2) Ionized water o...

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PUM

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Abstract

The invention provides a formulation of medium-temperature acidic electroless nickel-phosphorus alloy, which is characterized in that the formulation is as follows: 25 to 30 grams of nickel sulfate per liter, 25 to 35 grams of sodium hypophosphite per liter, 12 to 18 grams of sodium acetate per liter, 0.5-1.3 milligrams of thiourea per liter, 7 to 13 milliliters of lactic acid per liter, 7 to 13 milliliters of acetic acid per liter, 4-10 grams of organic acid per liter, 5-16 milligrams of potassium iodide or potassium iodate per liter, and the loadage is between 0.5 and 1.5 dm<2>/L. The invention has the advantages that: the formulation improves the stability of a plating solution, obviously improves plating rate, has good corrosion resistance and the comprehensive properties of plating; the stability of the plating solution can reach over 1800 s; the stability of periodic experiments is more than ten periods; the corrosion resistance of the plating reaches over 130 s; and the hardness of the plating reaches 480 HV.

Description

Technical field [0001] The invention relates to a nickel-phosphorus alloy plating formula, in particular to a middle-temperature acid chemical nickel-phosphorus alloy plating formula. Background technique [0002] Because the electroless nickel plating technology has the characteristics of uniform coating, good wear resistance, corrosion resistance, high hardness, and convenient operation, it is widely used in aerospace, petrochemical, machinery and electronics, computers, automobiles, food, textiles and medical fields. . Electroless plating is developing at an annual growth rate of more than 15%, and it is one of the fastest growing processes in the field of surface technology in recent years. At present, the operating temperature of the plating solution commonly used in industrial production is 85~95℃. Although the deposition rate of nickel is relatively fast, the process control is difficult, the energy consumption is high, the equipment is worn out and the working conditions ...

Claims

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Application Information

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IPC IPC(8): C23C18/36
Inventor 邹建平刘贤泽刑秋菊魏道胜刘胜宾蔺万峰梁臻李光明
Owner NANCHANG HANGKONG UNIVERSITY
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