84results about How to "Fast plating" patented technology

A new, extremely sensitive, and rapid electronic detection method for direct detection of hybridized genomic targets to specific probes on the microarray is proposed. The method consists of fast electronic accumulation of the DNA target on a particular electrode site at the micro-electrode array, sequential electronic hybridization of oligonucleotide labeled metallic (nano)particles on the target DNA and monitoring the electrochemical AC impedance changes at the electrode site. The method is enhanced by electroplating over the DNA target which serves as the metallization template and over the particles which provide seeds for rapid electroplating. The AC impedance changes are monitored during the electroplating over the DNA target and between the array electrodes sites. The signal in the absence and presence of the target DNA is a difference between “no connection” and a “short” between the array electrodes

The invention relates to a co-deposition electroplating method for preparing Au-Sn alloy on an electroplating substrate and a cyanogen-free Au-Sn alloy electrolyte. The wave forms of electroplating current pulses are forward variable-amplitude pulses, namely that two different forward square wave pulses exist in one period, and the peak values and the conducting time of the electroplating current pulses respectively correspond to peak value current density and time which are required for generating Au5Sn and an Au-Sn alloy phase in a plating layer. In the electrolyte, sodium sulfite is adopted as a main complexing agent and ethylene diamine tetraacetic acid is adopted as an auxiliary complexing agent for the gold ion complexing agent, potassium pyrophosphate is used as a tin ion complexing agent, hydroquinone is used as an antioxidant, and the pH value of the electrolyte is from 8 to 9. When the method is used for preparing Au-30at.%Sn eutectic plated layer through electroplating, the plating speed reaches 13 mum/hour, the electrolyte is stable, the operation is simple, and the gold and tin content in the plated layer is easy to control. The method can be applied in microelectronics and photoelectron industry for connecting and encapsulating LED chips, connecting flip chips, forming welding pads or patterns on the surface of semiconductor devices or similar devices, etc.

The invention discloses an environmentally-friendly chemical gilding liquid. The environmentally-friendly chemical gilding liquid comprises 0.5-5g/L of non-cyanide gold salt, 5-30g/L of gold ion complexing agents, 5-20g/L of an impurity screener, 0.1-10g/L of a stabilizing agent and 15-35g/L of a pH buffering agent. The non-cyanide gold salt is sodium gold sulfide or auric-sodium chloride, a sulfite is used as the main complexing agent, and through combined action of the auxiliary complexing agent, the impurity screener and the stabilizing agent, long-term stabilization of production and storage is realized. The environmentally-friendly chemical gilding liquid does not adopt cyanides and cyanogen-containing substances, does not contain limited heavy metals such as lead and cadmium, has the characteristics of long storage life, high continuous production stability, good weldability, bright color and good corrosion resistance and weatherability, can satisfy functional electron electroplating requirements and can be used as a decorative gilding liquid.

The invention relates to a chemical Ni-P alloy-plating liquid and its process. The liquid is stable, works fast, has long service life, and does not contain chromium. So, it was widely used in industry. The Ni-P alloy coating is of fine corrosion-proof, containing 10-30g nickel sulfate, 20-40g sodium hypophosphite, 5-20g sodium acetate, 12-60g complexing agent and 0.002-0.01g complex stabilizer, with pH value of 4.5-5.0.

The invention relates to long-acting nano-micron composite layer synthetic solution and a preparation method thereof. The synthetic solution is prepared from a main salt, a reducer, a main complexing agent, an auxiliary complexing agent, a buffer a, a buffer b, silicon carbide, magnesium oxide, a cationic surfactant, a nonionic surfactant, rare earth, a stabilizer, a promoter and deionized water.Compared with the normal conventional chemical composite plating solution, the synthetic solution has the advantages of high plating speed, stable performance of plating solution, no pollution and high economy. The synthetic solution can be recycled by only periodically replenishing loss; and the binding force of the synthetic solution and a matrix reaches up to over 400MPa, is 200MPa higher thanthat of the common alkaline self-decomposition plating solution and is 300Mpa higher than that of electroplating.

The invention provides a novel chemical nickel-plating method for capacitive touch screen indium tin oxide (ITO) wiring. Compared with the conventional vacuum sputtering technology, the novel chemical nickel-plating method is low in equipment investment, low in production cost and high in efficiency; and compared with the traditional chemical nickel-plating process on a nonmetallic matrix, the novel chemical nickel-plating method has high solution stability and selectivity. The novel chemical nickel-plating method comprises the following steps of: sequentially deoiling, etching, sensitizing, activating, reducing and performing chemical nickel-plating on the ITO film glass; and the key points are that the selectivity of the ITO film is improved during sensitization by adopting sensitizing solution containing Cu+, and the sensitizing solution is more stable than the traditional Sn2+ sensitizing solution; during etching, the etching process is stabilized by employing etching solution containing S2O82- or HS2O8-, and the etching effect is improved; and the chemical nickel-plating is performed at the low temperature of 55-65 DEG C, the plating solution is stable, and the plating layer is smooth and dense. The results prove that the method is easy to operate and high in speed; the ITO surface nickel layer is completely covered and has high adhesive force, and the glass matrix is not covered by the nickel layer and has high selectivity.

The invention relates to a chemical copper plating solution. The chemical copper plating solution is an aqueous solution containing soluble copper salt, a soluble hydroxide, a complexing agent, a stabilizer, an accelerant, a buffering agent and a reducing agent. The reducing agent is a methylene glycol compound and/or an alpha-diol compound. The invention further provides a preparation method of the chemical copper plating solution and a nonmetal surface chemical plating method adopting the chemical copper plating solution. The chemical copper plating solution has a better reduction effect and is good in stability and long in service life.

The invention relates to zinc-nickel-phosphorus electroplating liquid and a preparation method and electroplating method thereof. The technical problems that an existing zinc-nickel plated layer is low in hardness and does not have the abrasion resistance are solved. The zinc-nickel-phosphorus electroplating liquid contains the following components including, by concentration, 20-30 g/L of nickelaminosulfonate, 4-10 g/L of sodium phosphate, 40-60 g/L of zinc sulfate, 20-40 g/L of potassium hydroxide, 0.1-0.3 g/L of additive and 20-40 g/L of complexing agent, and deionized water serves as a solvent. Meanwhile the invention provides the preparation method and electroplating method of the zinc-nickel-phosphorus electroplating liquid. The zinc-nickel-phosphorus electroplating liquid and the preparation method and electroplating method thereof are widely applied to surface treatment of metal workpieces, and a plated layer formed through the method serves as an anodic protective plated layer, has excellent corrosion resistance and high hardness and achieves the double effects of corrosion resistance and abrasion resistance.

The invention relates to a solution for chemically plating nickel on the surface of a non-catalytic active material and a plating process for the solution, and belongs to the technical field of chemical nickel-plating. The solution comprises liquor A, liquor B, liquor C and/or liquor D, wherein the liquor A comprises a water-soluble nickel salt and a buffer agent; the liquor B comprises a reducing agent, a complexing agent, a buffer agent, a stabilizer and a surface wetting agent; the liquor C comprises the water-soluble nickel salt and the complexing agent; and the liquor D comprises the reducing agent and the stabilizer. The plating process for the solution comprises the following steps: preparing the liquor A, the liquor B and a diluent; uniformly mixing the liquor A, the liquor B and the diluent to obtain a mixture, regulating the pH value of the mixture to 7.0-8.0, heating the mixture to a temperature of 82-88 DEG C, and carrying out primary plating by using an iron material as an initiator; filtering plating liquor after carrying out primary plating; recycling filtrate for next-time plating, feeding plating liquor obtained by the next-time plating into the liquor C and the liquor D, and recycling the plating liquor. According to the solution and the plating process thereof, the combination and the process design are reasonable, generation and emission of waste liquor can be greatly reduced, and the utilization rate of the plating liquor can be increased.

The invention discloses an environment-friendly high-phosphorus chemical nickel plating solution for an airtight glass-sealed binding terminal. The environment-friendly high-phosphorus chemical nickel plating solution comprises the following active ingredients according to concentration: 25-27g/L nickel sulfate, 19-22g/L sodium hypophosphite, 20-23g/L sodium hydroxide, 41-44g/L lactic acid, 1.5-2.3g/L trisodium citrate, 13-15g/L malic acid, 8-12g/L glycine, 0.2-0.4ml/L OP-10, 0.26-0.3g/L stannous chloride, 0.26-0.34g/L maleic anhydride and 3-5mg/L N,N-diethylaminopropyne. The invention discloses a method for performing chemical plating by adopting the chemical nickel plating solution. A stainless steel needle and an iron cover can be simultaneously subjected to chemical nickel plating and be evenly plated, no nickel nuclear generated on sintered glass can be guaranteed, and the difficulty in keeping the smoothness and cleanness of the surface of glass can be solved.

The invention provides chemical copper plating liquid and a preparation method thereof. The chemical copper plating liquid comprises, by mass concentration, 1-10 g/L of water soluble cupric salt, 10-100 g/L of a first complexing agent, 3-20 g/L of a second complexing agent, 2-50 g/L of a reduction agent and 0.001-100 mg/L of stabilizer. According to the chemical copper plating liquid, the specificsecond complexing agent is selected, by means of mutual operation and synergistic interaction between the two complexing agents, thus the obtained chemical copper plating liquid is stable without decomposing in the plating application process, and the plating speed of the chemical copper plating liquid is also increased substantially. In addition, a copper plated film obtained after the chemicalcopper plating liquid applies plating is smooth and uniform, and the requirement for functionality chemical copper plating can be met.

The invention discloses a chemical copper plating solution and relates to the field of chemical plating. According to the chemical copper plating solution, formaldehyde serves as a reducing agent; cuprous salt serves as a copper source; and complexing of the cuprous salt is conducted with phosphine ligand as a complexing reagent. Monovalent copper ions are different from bivalent copper ions in that the monovalent copper ions are likely to be subjected to a disproportionated reaction in water to generate elementary substance copper and bivalent copper, and ligand needs to be added to stabilizethe monovalent copper ions. The monovalent copper ions belongs to soft acid specified in the Louis acid and base theory, and the effect that the monovalent copper ions are matched with traditional nitrogen and oxygen ligand belonging to hard base is poor. According to the chemical copper plating solution, the adopted phosphorus ligand belongs to soft base and is good in coordination with the monovalent copper ions, and the good stabilizing effect can be achieved for the monovalent copper ions; and product quality is improved while the plating speed is increased. The invention further discloses a chemical copper plating method. According to the chemical copper plating method, a to-be-placed workpiece is put in the chemical copper plating solution for chemical plating at the temperature of40-60 DEG C. The method is high in plating speed, good in stability and high in production efficiency.

The invention relates to a chemical nickel plating method of an Mg-Gd-Y-Zr (wt%) magnesium alloy. The method comprises pre-plating pretreatment of a magnesium alloy matrix and deposition of a chemical nickel plating layer through chemical nickel plating, wherein the pre-plating pretreatment process comprises five steps of removing oil, activating, acid-washing, reactivating and zinc galvanizing; chemical nickel plating solution takes basic nickel carbonate as main salt, sodium hypophosphite as a reducing agent, hydrofluoric acid as a corrosion inhibitor, lactic acid as a complex agent and mixed liquor of cadmium sulfate and potassium iodate as a brightening agent; and a plating component is subject to zinc galvanizing and then electroless plating at the temperature about 85 DEG C to obtain the bright, flat, uniform and compact nickel plating layer. The chemical nickel plating method is applicable to chemical nickel plating on the surface of the Mg-Gd-Y-Zr magnesium alloy, thus achieving the purpose of protecting the magnesium alloy. The chemical nickel plating method has the advantages of fast plating speed, good protectiveness, simple operation and easy control.

The invention provides a method for improving recycling of plating emery of a diamond wire. The method comprises the steps of pretreatment, preplating, emery loading, reinforcing and after-treatment.According to the invention, when a mother wire goes to a reinforcing station from an emery loading station, a linkage station is located in the middle of the emery loading station and the reinforcingstation, and two wiring wheels and a tension arm wiring wheel are arranged at the linkage station; plating emery is left on the wiring wheels due to long-term friction between the linkage station andthe diamond wire; semi-cut pipelines are additionally arranged below the wiring wheel located at the wire outlet of the emery loading station and the wiring wheel located at the wire inlet of the reinforcing station, and the plating emery falling off from the wiring wheels is collected; and a collection box is additionally arranged behind the linkage station to recycle the fallen plating emery. Due to usage of a large number of machines and long operation time, the method provided by the invention can effectively reduce the waste of the plating emery and saves cost for a company.

The invention discloses a diamond micro-powder chemical nickel-plating formula and process. The diamond micro-powder chemical nickel-plating formula includes 20-30 g/L of nickel sulfate hexahydrate, 30-35 g/L of sodium hypophosphite, 15-25 g/L of citric acid, 12.5-22.5 g/L of ammonium hydroxide, 12.5-17.5 g/L of sodium citrate, 1-5 mg/L of thiourea, 2-10 mg/L of potassium iodate, 0.1-1.5 g/L of polyethylene glycol 4000 and 0.1-1.5 g/L of dodecylbenzene sulfonic acid. The process comprises the steps of adding diamond micro-powder at the loading capacity of 2-10 g into 400 mL of a plating solution; conducting ultrasonic dispersion for 5 min, then conducting water-bath heating at 75-90 DEG C and conducting chemical nickel plating at the stirring speed of 120 r/min. According to the diamond micro-powder chemical nickel-plating formula and process, citric acid and ammonium hydroxide are added on the basis of sodium citrate; the anti-corrosion capability of a plating coating obtained througha compound complex agent is higher than that of the plating coating obtained through a single complex agent. Interspaces of a single complex compound through the compound complex agent are filled. The structure is more compact. The complex compound becomes stable. Moreover, the deposition velocity is increased to some extent.

The present invention provides alloy plating solution and corresponding treating process for forming coating with high corrosion resistance, high hardness, high wear resistance and high erosion resistance. The present invention is used in hydraulic part production, and has the outstanding features of high plating speed, low material consumption, low power consumption and no pollution. The alloy plating solution is compounded through dissolving nickel sulfate, amino acetic acid, sodium hypophosphorite, graphite fluoride, boric acid, sodium saccharin, lead ion, ammonia water and sodium hydroxide in the weight ratio of 3 to 2.5 to 0.35 to 0.6 to 3 to 0.3 to 0.003 to 0.35 to 0.15 in pure water of 90 weight portions. During plating, the alloy plating solution is heated to 50-80 deg.c, and the plating time is determined based on thickness to be plated.

The invention discloses a carrying tool for a printed circuit board (PCB), which is characterized by comprising a first clamping frame and a second clamping frame, wherein the first clamping frame is provided with a first through hole, and the second clamping frame is provided with a second through hole; the first clamping frame is connected with the second clamping frame in a relatively rotating way; and the carrying tool for the PCB also comprises a limit device which is used for limiting the PCB between the first clamping frame and the second clamping frame. The carrying tool for the PCB can be used for conveniently clamping the surrounding edge of the PCB, and ensures the PCB to stably move in the moving process without being bended and deformed. More particularly, the carrying tool guarantees the thinner PCB not to be bended and deformed, and realizes rapid electroplating for the thinner PCB.