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Chemical gold plating solution

A technology of chemical gold plating and gold sodium sulfite, which is applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problem of poor coating adhesion on the appearance of the coating, difficult to meet the requirements of thick gold plating, and gold plating solution. Problems such as low plating speed, to achieve the effect of golden appearance, good weldability and fast plating speed

Inactive Publication Date: 2016-05-04
HARBIN INST OF TECH AT WEIHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the plating speed of this gold plating solution is low, the fastest can only reach 0.72μm / h, usually 0.3-0.5μm / h
However, long-term plating will lead to poor coating appearance and coating adhesion, and it is difficult to meet the requirements of thick gold plating.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] A cyanide-free chemical gold plating solution for rapid thick gold plating, its composition formula is sodium gold sulfite (calculated as Au) 1g / L, sodium sulfite 22g / L, sodium thiosulfate 13g / L, triammonium citrate 1g / L ; Borax 8g / L, Thiourea 1g / L; Benzotriazole 0.01g / L.

[0015] The plating solution is kept sealed at room temperature for 6 months without decomposition and can be used normally.

[0016] The test sample is printed circuit board, which is processed by the following process:

[0017] (1) Electroless nickel plating for 10 minutes after pickling, micro-etching, activation, and pre-dip treatment;

[0018] (2) Electroless gold plating on the electroless nickel layer for 20 minutes. The plating temperature is 75°C, and the pH value is 6.5;

[0019] (3) Blow dry with cold wind.

[0020] The appearance of the obtained gold layer is flat and bright, without overflow plating and missing plating phenomenon, the thickness of the plating layer is 0.4 μm, and the ...

Embodiment 2

[0022] A cyanide-free chemical gold plating solution for rapid thick gold plating, its composition formula is sodium gold sulfite (calculated as Au) 2g / L, sodium sulfite 25g / L, sodium thiosulfate 16g / L, triammonium citrate 2g / L ; Borax 8g / L, thiourea 3g / L; Benzotriazole 0.03g / L.

[0023] The plating solution is kept sealed at room temperature for 6 months without decomposition and can be used normally.

[0024] The test sample is printed circuit board, which is processed by the following process:

[0025] (1) Electroless nickel plating for 10 minutes after pickling, micro-etching, activation, and pre-dipping;

[0026] (2) Electroless gold plating on the electroless nickel layer for 20 minutes. The plating temperature is 80°C, and the pH value is 6.8;

[0027] (3) Blow dry with cold wind.

[0028] The appearance of the obtained gold layer is flat and bright, without overflow plating and missing plating phenomenon, the thickness of the plating layer is 0.45 μm, and the bondi...

Embodiment 3

[0030] A cyanide-free chemical gold plating solution for rapid thick gold plating, its composition formula is sodium gold sulfite (calculated as Au) 3g / L, sodium sulfite 25g / L, sodium thiosulfate 20g / L, triammonium citrate 3g / L ; Borax 10g / L, Thiourea 0.1g / L; Benzotriazole 0.05g / L.

[0031] The plating solution is kept sealed at room temperature for 6 months without decomposition and can be used normally.

[0032] The test sample is printed circuit board, which is processed by the following process:

[0033] (1) Electroless nickel plating for 10 minutes after pickling, micro-etching, activation, and pre-dipping;

[0034] (2) Electroless gold plating on the electroless nickel layer for 20 minutes. The plating temperature is 85°C, and the pH value is 7.2;

[0035] (3) Blow dry with cold wind.

[0036] The appearance of the obtained gold layer is flat and bright, without overflow plating and missing plating phenomenon, the thickness of the plating layer is 0.5 μm, and the bon...

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PUM

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Abstract

The invention relates to a chemical gold plating solution for quickly depositing a gold layer. The chemical gold plating solution comprises the following components: 0.5-3g / L of sodium gold sulfite (based on Au), 22-28g / L of sodium sulfite, 13-20g / L of sodium thiosulfate, 1-5g / L of triammonium citrate, 8-12g / L of borax, 0.1-5g / L of thiourea, and 0.01-0.09g / L of benzotriazole. The appropriate pH value of the plating solution is 6.5-7.2, and the appropriate temperature is 75-85 DEG C. The gold plating solution provided by the invention does not contain cyanide, is good in stability and high in plating speed, and can obtain a plated layer with thickness more than or equal to 0.4mu m in 20 minutes, the appearance of the plated layer is golden and bright in color, and the requirement of plating thick gold on most products can be met. The chemical gold plating solution not only can meet requirements of functional electron electroplating, but also can be used as a decorative gold plating solution.

Description

technical field [0001] The invention relates to the technical field of chemical gold plating applied to surface treatment, in particular to a cyanide-free chemical gold plating solution for rapidly depositing a gold layer. Background technique [0002] The gold coating has a golden yellow appearance, good resistance to color change, and can be used as a decorative coating; at the same time, it has excellent properties such as corrosion resistance, wear resistance, oxidation resistance, low contact resistance, good solderability, and thermocompression bonding , It can also be used as a functional and protective coating. Therefore gold-plated layer is widely used in the surface decoration of electronic products, such as PCB, ceramic integrated circuit (IC) packaging, aerospace technology and cutting-edge military equipment. Modern high-end electronic equipment, especially miniaturized equipment, has increased requirements for the miniaturization of large-scale integrated circ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44
CPCC23C18/44
Inventor 刘海萍毕四富王春雨曹立新王尧
Owner HARBIN INST OF TECH AT WEIHAI
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