Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Diamond micro-powder chemical nickel-plating formula and process

A diamond micropowder and electroless nickel plating technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of short service life of diamond tools, easy to fall off, easy to oxidize when heated, etc. Density and corrosion resistance, increased stability, the effect of strong corrosion resistance

Pending Publication Date: 2019-04-05
ZHONGYUAN ENGINEERING COLLEGE
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Diamond micropowder has excellent properties of high hardness, wear resistance and corrosion resistance, and can be made into diamond tools such as cutting, grinding, drilling, etc.; at the same time, it is easy to oxidize and graphitize when heated, and it is compatible with most metals, alloys, and bonding agents. The disadvantage of high interfacial energy between them is easy to fall off and lose during actual use, resulting in short service life of diamond tools and low processing efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Diamond micro-powder chemical nickel-plating formula and process
  • Diamond micro-powder chemical nickel-plating formula and process
  • Diamond micro-powder chemical nickel-plating formula and process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The formula of diamond micropowder electroless nickel plating of the present embodiment is composed as follows: nickel sulfate hexahydrate 25g / L, sodium hypophosphite 33g / L, citric acid 20g / L, ammoniacal liquor 17.5g / L, sodium citrate 12.5g / L, Thiourea 1.4mg / L, potassium iodate 8mg / L, polyethylene glycol 4000 1g / L, dodecylbenzenesulfonic acid 1g / L.

[0029] The process of electroless nickel plating with diamond micropowder using the above formula is as follows: the pretreatment process of diamond micropowder is as follows: degreasing→water washing→hydrophilization→water washing→sensitization→water washing→activation→water washing.

[0030] Put 6g of diamond powder into 400mL plating solution, ultrasonically disperse it for 5 minutes, and then heat it in a water bath at 80-85°C with a stirring speed of 120r / min for electroless nickel plating.

Embodiment 2

[0032] The formula of the diamond micropowder electroless nickel plating of the present embodiment is composed as follows: nickel sulfate hexahydrate 25g / L, sodium hypophosphite 33g / L, citric acid 20g / L, ammoniacal liquor 12.5g / L, sodium citrate 12.5g / L , Thiourea 1.4mg / L, potassium iodate 8mg / L, polyethylene glycol 4000 1g / L, dodecylbenzenesulfonic acid 1g / L.

Embodiment 3

[0034] The formula of the diamond micropowder electroless nickel plating of the present embodiment is composed as follows: nickel sulfate hexahydrate 25g / L, sodium hypophosphite 33g / L, citric acid 25g / L, ammoniacal liquor 17.5g / L, sodium citrate 12.5g / L , Thiourea 1.4mg / L, potassium iodate 8mg / L, polyethylene glycol 4000 1g / L, dodecylbenzenesulfonic acid 1g / L.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a diamond micro-powder chemical nickel-plating formula and process. The diamond micro-powder chemical nickel-plating formula includes 20-30 g / L of nickel sulfate hexahydrate, 30-35 g / L of sodium hypophosphite, 15-25 g / L of citric acid, 12.5-22.5 g / L of ammonium hydroxide, 12.5-17.5 g / L of sodium citrate, 1-5 mg / L of thiourea, 2-10 mg / L of potassium iodate, 0.1-1.5 g / L of polyethylene glycol 4000 and 0.1-1.5 g / L of dodecylbenzene sulfonic acid. The process comprises the steps of adding diamond micro-powder at the loading capacity of 2-10 g into 400 mL of a plating solution; conducting ultrasonic dispersion for 5 min, then conducting water-bath heating at 75-90 DEG C and conducting chemical nickel plating at the stirring speed of 120 r / min. According to the diamond micro-powder chemical nickel-plating formula and process, citric acid and ammonium hydroxide are added on the basis of sodium citrate; the anti-corrosion capability of a plating coating obtained througha compound complex agent is higher than that of the plating coating obtained through a single complex agent. Interspaces of a single complex compound through the compound complex agent are filled. The structure is more compact. The complex compound becomes stable. Moreover, the deposition velocity is increased to some extent.

Description

technical field [0001] The invention belongs to the field of diamond micropowder surface treatment, and more specifically relates to a formulation and a process method of diamond micropowder electroless nickel plating. Background technique [0002] With the rapid development of semiconductor information technology and photovoltaic technology, the cutting requirements for precious hard and brittle materials such as monocrystalline silicon and gemstones are becoming more and more precise, while diamond wire saws have narrow slits, uniform thickness, and low warpage , and its application is becoming more and more extensive. Diamond micropowder has excellent properties of high hardness, wear resistance and corrosion resistance, and can be made into diamond tools such as cutting, grinding, drilling, etc.; at the same time, it is easy to oxidize and graphitize when heated, and it is compatible with most metals, alloys, and bonding agents. The disadvantage of high interfacial ener...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23C18/36
CPCC23C18/36
Inventor 方莉俐程丙良
Owner ZHONGYUAN ENGINEERING COLLEGE
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com