Plastic film brush copper plating process

Abstract

The invention relates to a plastic film brush copper plating process. The process comprises the following steps: carrying out first copper plating treatment on a plastic film by adopting a physical vapor deposition method, preparing a first copper film on one surface of the plastic film, and preparing a second copper film on the other surface of the plastic film; second copper plating treatment is conducted on the first copper film and the second copper film in a brush copper plating mode, a third copper film is prepared on the first copper film, and a fourth copper film is prepared on the second copper film; the anode of the second copper plating treatment is a brush plating roller; and a copper plating solution adopted in the second copper plating treatment comprises water, copper sulfate, sulfuric acid, chloride ions, 1, 4-cyclohexanedione monoethylene ketal, phthalimide potassium salt and a polyol compound. According to the copper plating process, the plating speed is high, the copper film layer with fine, continuous and uniform crystals can be obtained, no adverse effect is generated on the original copper plating film layer, the binding force of the plated film layer is excellent, the film surface sheet resistance can meet the finished product requirement through one-time brush plating film forming, the plastic film is not punctured, and the copper plating process is suitable for amplification application.

Description

technical field [0001] The invention relates to the technical field of copper plating, in particular to a plastic film brush copper plating process. Background technique [0002] At present, double-sided copper plating is performed on the surface of plastic films (such as polypropylene PP or polyethylene terephthalate PET) with a thickness of 3.2 μm to 12 μm, usually by magnetron plus electroplating or vapor deposition plus electroplating. Both of these two processes have the problem of low pass rate of processing quality between processes. The main difficulty is concentrated in the uneven thickness of the copper film surface formed after magnetron or evaporation, and electroplating copper is prone to burn holes, resulting in Faults such as film perforation and film breakage occur frequently, and the pass rate is extremely low. [0003] In addition, due to the lack of copper thickness on the film surface produced by the pre-sequence magnetron coating or vapor deposition, th...

AI Technical Summary

Problems solved by technology

But the biggest difficulty at present is that the cathode roller in contact with the plastic film will be copper-plated in the acid copper plating process, and the copper-plated part on the cathode roller will easily puncture the plastic film layer, resulting in holes in the plated plastic film, which is unqualified

At the same time, the thickness uniformity of the coating may be poor, the edge of the film is easy to burn, and there are faults such as film burnt, perforation, and film breakage, which ultimately lead to a relatively low pass rate and efficiency of the coating.

[0005] On the other hand, if the square resistance of the film surface is greatly reduced in the magnetron or evaporation coating process, the risk of perforation and burning of the film surface will be greatly increased

Moreover, it is impossible to use a higher electroplating current in the subsequent acid copper plating process, so that the thickness of the film layer is greatly reduced and the square resistance of the film surface cannot be reduced to the range required by the finished product; on the contrary, if the current of acid copper plating is too high, it will Increase the possibility and degree of copper plating on the cathode roller, resulting in the possibility of puncturing or burning the plastic film at any time

It can be seen that the process of magnetron plus electroplating acid copper or vapor deposition plus electroplating acid copper is complex and difficult to control, let alone control the qualified rate of finished products in one process.

[0006] In addition, according to the summary of the phenomenon produced in the laboratory and workshop, the plastic film tends to be brittle after being electroplated with acid copper, and it cannot be repeated for many times. After electroplating once (at most twice), the film will appear The problem of easy to break the film, the product is unqualified, and all the product films in the previous processing are scrapped, which is too wasteful and has no economic efficiency.

[0007] In summary, the current plastic film brush copper plating process still has many problems that are difficult to coordinate. The industry urgently needs a fast plating speed that can improve the thickness and uniformity of the copper layer, and the plastic film will not be punctured. The upper resistance reaches the standard, and the bonding force between the copper plating layers is excellent. Plastic film brush copper plating process

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